公开(公告)号：US20180090419A1

公开(公告)日：2018-03-29

申请号：US15280398

申请日：2016-09-29

Applicant: Texas Instruments Incorporated

Inventor： Chih-Chien Ho ,  Chung-Hao Lin ,  Yuh-Harng Chien

IPC: H01L23/495

Abstract: A leadframe has a peripheral frame. A die attach pad (DAP) is positioned inwardly and downwardly of the peripheral frame. Two spaced apart parallel arms engage one side of the DAP. In one embodiment the arms are portions of a U-shaped strap.

公开(公告)号：US20170330822A1

公开(公告)日：2017-11-16

申请号：US15151177

申请日：2016-05-10

Applicant: Texas Instruments Incorporated

Inventor： Chia-Yu Chang ,  Chih-Chien Ho ,  Steven Su

IPC: H01L23/495 ,  G06F17/50 ,  H01L25/065 ,  H01L23/31

Abstract: A leadframe includes a first die attach pad (“DAP”) having a first longitudinally extending edge surface and a second DAP having a first longitudinally extending edge surface. The second DAP is positioned with the first longitudinally extending edge surface thereof in adjacent, laterally and vertically spaced relationship with the first longitudinally extending edge surface of the first DAP.