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公开(公告)号:US06552143B2
公开(公告)日:2003-04-22
申请号:US09937910
申请日:2001-10-19
IPC分类号: C08F12204
CPC分类号: C08F32/08 , C08F232/02 , G03F7/0045 , G03F7/039 , G03F7/0395 , G03F7/0397
摘要: A photoresist polymeric compound includes a monomer unit represented by following Formula (I): The polymeric compound may further include at least one of monomer units represented by Formulae (IIa) to (IIg) as described in the specification. The photoresist polymeric compound can exhibit high adhesion to substrates and can highly precisely form fine patterns.
摘要翻译: 光致抗蚀剂聚合物包括由下式(I)表示的单体单元:聚合化合物还可包含如本说明书中所述的由式(IIa)至(IIg)表示的单体单元中的至少一种。 光致抗蚀剂聚合物可以表现出对基材的高粘合性,并可高精度地形成精细图案。