METHOD FOR PRODUCING NITRIDE SEMICONDUCTOR OPTICAL DEVICE AND EPITAXIAL WAFER
    35.
    发明申请
    METHOD FOR PRODUCING NITRIDE SEMICONDUCTOR OPTICAL DEVICE AND EPITAXIAL WAFER 失效
    用于生产氮化物半导体光学器件和外延晶体的方法

    公开(公告)号:US20100055820A1

    公开(公告)日:2010-03-04

    申请号:US12539887

    申请日:2009-08-12

    IPC分类号: H01L33/00

    摘要: In step S106, an InXGa1-XN well layer is grown on a semipolar main surface between times t4 and t5 while a temperature in a growth furnace is maintained at temperature TW. In step S107, immediately after completion of the growth of the well layer, the growth of a protective layer covering the main surface of the well layer is initiated at temperature TW. The protective layer is composed of a gallium nitride-based semiconductor with a band gap energy that is higher than that of the well layer and equal to or less than that of a barrier layer. In step S108, the temperature in the furnace is changed from temperatures TW to TB before the barrier layer growth. The barrier layer composed of the gallium nitride-based semiconductor is grown on the protective layer between times t8 and t9 while the temperature in the furnace is maintained at temperature TB.

    摘要翻译: 在步骤S106中,在时间t4〜t5的半极性主面上生长InXGa1-XN阱层,而生长炉内的温度保持在温度TW。 在步骤S107中,在阱层生长完成之后,在温度TW下开始覆盖阱层主表面的保护层的生长。 保护层由氮化镓系半导体构成,带隙能量高于阱层的带隙能量,并且等于或小于势垒层的带隙能量。 在步骤S108中,在阻挡层生长之前,炉中的温度从温度TW变为TB。 由氮化镓系半导体构成的阻挡层在时刻t8〜t9的保护层上生长,同时炉内的温度保持在温度TB。

    Nitride semiconductor light emitting device
    40.
    发明授权
    Nitride semiconductor light emitting device 失效
    氮化物半导体发光器件

    公开(公告)号:US08513684B2

    公开(公告)日:2013-08-20

    申请号:US13294034

    申请日:2011-11-10

    IPC分类号: H01L33/00

    摘要: A nitride semiconductor light emitting device is provided. A core semiconductor region, a first cladding region, and a second cladding region are mounted on a nonpolar primary surface of a support substrate of GaN which is not the polar plane. The core semiconductor region includes an active layer and a carrier block layer. The first cladding region includes an n-type AlGaN cladding layer and an n-type InAlGaN cladding layer. The n-type InAlGaN cladding layer is provided between the n-type AlGaN cladding layer and the active layer. A misfit dislocation density at an interface is larger than that at an interface. The AlGaN cladding layer is lattice-relaxed with respect to the GaN support substrate and the InAlGaN cladding layer is lattice-relaxed with respect to the AlGaN cladding layer.

    摘要翻译: 提供一种氮化物半导体发光器件。 核心半导体区域,第一包层区域和第二包层区域安装在不是极平面的GaN的支撑衬底的非极性主表面上。 核心半导体区域包括有源层和载流子阻挡层。 第一包层区域包括n型AlGaN包覆层和n型InAlGaN包覆层。 n型InAlGaN包层设置在n型AlGaN包层和有源层之间。 界面处的错配位错密度大于界面处的位错密度。 AlGaN包层相对于GaN支撑衬底是晶格弛豫的,并且InAlGaN包层相对于AlGaN包层是晶格弛豫的。