公开(公告)号：US07819995B2

公开(公告)日：2010-10-26

申请号：US12411156

申请日：2009-03-25

申请人： Yong Suk Kim ,  Byeung Gyu Chang ,  Taek Jung Lee

发明人： Yong Suk Kim ,  Byeung Gyu Chang ,  Taek Jung Lee

IPC分类号： C03B29/00 ,  C04B33/34

CPC分类号： H05K3/4611 ,  C04B33/32 ,  H05K3/4629 ,  H05K2203/0789 ,  H05K2203/308

摘要： There is provided a method of manufacturing a multilayer ceramic substrate, the method including: providing a non-sintered multilayer ceramic substrate having a plurality of low temperature sintering green sheets laminated therein; disposing a hard-to-sinter constraining green sheet on at least one of top and bottom surfaces of the non-sintered multilayer ceramic substrate; sintering the non-sintered multilayer ceramic substrate having the hard-to-sinter constraining layer disposed thereon; immersing the sintered multilayer ceramic substrate into an acidic solution; and activating a contact between the hard-to-sinter constraining layer and the acidic solution such that the hard-to-sinter constraining layer is removed.

摘要翻译： 提供一种制造多层陶瓷基板的方法，该方法包括：提供层叠有多个低温烧结生片的非烧结多层陶瓷基板; 在非烧结多层陶瓷基板的顶表面和底表面中的至少一个上设置难以烧结的约束生片; 烧结其上设置有难烧结约束层的非烧结多层陶瓷衬底; 将烧结的多层陶瓷衬底浸入酸性溶液中; 并且激活硬烧结约束层和酸性溶液之间的接触，从而去除硬烧结约束层。

公开(公告)号：US07496270B2

公开(公告)日：2009-02-24

申请号：US11707112

申请日：2007-02-16

申请人： Yong Suk Kim ,  Hoon Hur

发明人： Yong Suk Kim ,  Hoon Hur

IPC分类号： G02B6/00

CPC分类号： B29C45/14655 ,  B29C45/14836 ,  B29C45/2704 ,  B29C2045/14327 ,  B29L2031/3475 ,  B29L2031/747 ,  H01L33/52

摘要： A light emitting unit, an apparatus and method for manufacturing the same, an apparatus for molding a lens thereof, and a light emitting device package thereof, which are capable of achieving an enhancement in light extraction efficiency and an improvement in mass productivity, are disclosed. The light emitting unit manufacturing apparatus includes a mold including a first mold and a second mold coupled to each other under a condition in which at least one light emitting unit is interposed between the first and second molds, a groove formed in one of the first and second molds at a position facing the light emitting unit, the groove having a lens shape, and a passage extending from an outer surface of the mold to the groove.

摘要翻译： 公开了一种能够实现光提取效率提高和批量生产率提高的发光单元，其制造方法及其制造方法，其透镜成型装置及其发光装置封装 。 发光单元制造装置包括：模具，其包括第一模具和第二模具，所述模具在第一模具和第二模具之间插入有至少一个发光单元的条件下彼此耦合;沟槽，其形成在第一模具和第二模具之一中; 在面向发光单元的位置处的第二模具，所述凹槽具有透镜形状，以及从模具的外表面延伸到凹槽的通道。

公开(公告)号：US20070286550A1

公开(公告)日：2007-12-13

申请号：US11707112

申请日：2007-02-16

申请人： Yong Suk Kim ,  Hoon Hur

发明人： Yong Suk Kim ,  Hoon Hur

IPC分类号： H01L21/00 ,  G02B6/32

CPC分类号： B29C45/14655 ,  B29C45/14836 ,  B29C45/2704 ,  B29C2045/14327 ,  B29L2031/3475 ,  B29L2031/747 ,  H01L33/52

摘要： A light emitting unit, an apparatus and method for manufacturing the same, an apparatus for molding a lens thereof, and a light emitting device package thereof, which are capable of achieving an enhancement in light extraction efficiency and an improvement in mass productivity, are disclosed. The light emitting unit manufacturing apparatus includes a mold including a first mold and a second mold coupled to each other under a condition in which at least one light emitting unit is interposed between the first and second molds, a groove formed in one of the first and second molds at a position facing the light emitting unit, the groove having a lens shape, and a passage extending from an outer surface of the mold to the groove.

摘要翻译： 公开了一种能够实现光提取效率提高和批量生产率提高的发光单元，其制造方法及其制造方法，其透镜成型装置及其发光装置封装 。 发光单元制造装置包括：模具，其包括第一模具和第二模具，所述模具在第一模具和第二模具之间插入有至少一个发光单元的条件下彼此耦合;沟槽，其形成在第一模具和第二模具之一中; 在面向发光单元的位置处的第二模具，所述凹槽具有透镜形状，以及从模具的外表面延伸到凹槽的通道。

公开(公告)号：US08198198B2

公开(公告)日：2012-06-12

申请号：US12458834

申请日：2009-07-23

申请人： Won Hee Yoo ,  Byeung Gyu Chang ,  Yong Suk Kim

发明人： Won Hee Yoo ,  Byeung Gyu Chang ,  Yong Suk Kim

IPC分类号： H01L21/302

CPC分类号： G01R3/00 ,  G01R1/06761 ,  H05K1/0306 ,  H05K3/108 ,  H05K3/143 ,  H05K3/388

摘要： The present invention relates to a method for forming electrode patterns of a ceramic substrate including the steps of: forming a plurality of conductive adhesion patterns on the ceramic substrate to be separated apart from one another; forming a plating seed layer, covering the conductive adhesion patterns, on the ceramic substrate; forming photoresist patterns, exposing parts corresponding to the conductive adhesion patterns, on the plating seed layer; forming a plating layer on the plating seed layer exposed by the photoresist patterns; removing the photoresist patterns; and etching parts of the plating seed layer exposed by removal of the photoresist patterns.

摘要翻译： 本发明涉及一种形成陶瓷基板的电极图案的方法，包括以下步骤：在陶瓷基板上形成多个导电粘合图案以彼此分开; 在陶瓷基板上形成覆盖导电粘合图案的电镀种子层; 在电镀种子层上形成光致抗蚀剂图案，暴露与导电粘合图案相对应的部分; 在由光致抗蚀剂图案曝光的电镀种子层上形成镀层; 去除光致抗蚀剂图案; 以及通过去除光致抗蚀剂图案来蚀刻暴露的电镀种子层的部分。

公开(公告)号：US08035205B2

公开(公告)日：2011-10-11

申请号：US11620561

申请日：2007-01-05

申请人： Seong Won Park ,  Cheng Yu Hsia ,  Yong Suk Kim

发明人： Seong Won Park ,  Cheng Yu Hsia ,  Yong Suk Kim

IPC分类号： H01L23/495

CPC分类号： H01L21/565 ,  H01L24/73 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/06568 ,  H01L2924/01029 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compound flow controller is optimally associated with the substrate or semiconductor package at one or more various locations. Flow controllers can control or direct the flow of the molding compound during the encapsulation process. Flow controllers can be sized, shaped, and positioned in order to smooth out the flow of the molding compound, such that the speed of the flow is substantially equivalent over areas of the substrate containing dies and over areas of the substrate without dies. In this manner, defects such as voids in the encapsulation, wire sweeping, and wire shorts can be substantially avoided during encapsulation.

摘要翻译： 半导体封装可以包括附接到衬底的管芯堆叠，其中接合线电连接两者。 通常，多个管芯堆叠被粘附到单个衬底上，使得可以一次制造几个半导体封装。 模制复合流量控制器在一个或多个不同位置处与衬底或半导体封装最佳地相关联。 流动控制器可以在封装过程中控制或引导模塑料的流动。 流量控制器的尺寸，形状和位置可以平滑模制化合物的流动，从而在含有模具的基材的区域和没有模具的基材的超过区域上流动的速度基本相当。 以这种方式，在封装期间可以基本上避免诸如封装，电线清扫和电线短路之类的缺陷的缺陷。

公开(公告)号：US20100295068A1

公开(公告)日：2010-11-25

申请号：US12675582

申请日：2008-08-27

申请人： Bu Wan Seo ,  Sung Woo Kim ,  Hoon Hur ,  Yong Suk Kim

发明人： Bu Wan Seo ,  Sung Woo Kim ,  Hoon Hur ,  Yong Suk Kim

IPC分类号： H01L33/52 ,  H01L33/48

CPC分类号： H01L25/0753 ,  H01L33/50 ,  H01L2224/48137 ,  H01L2224/48227 ,  H05B33/0821 ,  H05B33/0857 ,  Y02B20/341 ,  H01L2224/48091 ,  H01L2924/00014

摘要： In one embodiment, the light emitting device package includes a package body, electrodes attached to the package body, and at least two light emitting devices electrically connected to the electrodes. Each light emitting device emits light of a different color from the other light emitting devices. A protective layer is formed over the at least two light emitting devices, and a phosphor layer formed over the protective layer. Other embodiments include other structures such a individual phosphor layers on each light emitting device. And, a light apparatus including a package may include a single driver driving the light emitting devices of the package.

摘要翻译： 在一个实施例中，发光器件封装包括封装主体，附接到封装体的电极以及电连接到电极的至少两个发光器件。 每个发光装置发射与其他发光装置不同颜色的光。 在至少两个发光器件上形成保护层，并且形成在保护层上方的荧光体层。 其他实施例包括其他结构，例如每个发光器件上的各个荧光体层。 并且，包括封装的光装置可以包括驱动封装的发光器件的单个驱动器。

公开(公告)号：US07775681B2

公开(公告)日：2010-08-17

申请号：US11862084

申请日：2007-09-26

申请人： Yong Suk Kim ,  Hoon Hurh ,  Geun Ho Kim

发明人： Yong Suk Kim ,  Hoon Hurh ,  Geun Ho Kim

IPC分类号： F21V21/00

CPC分类号： H05K1/142 ,  G02F1/133603 ,  G02F2001/133612 ,  H05K1/0286 ,  H05K3/0052 ,  H05K2201/10106 ,  H05K2201/10189 ,  H05K2201/10446

摘要： A backlight unit including a circuit board mounted with light emitting diodes and formed with connecting pads electrically connected with the light emitting diodes, a driver installed on one surface of the circuit board and configured to drive the light emitting diodes, a connector coupled to the connecting pads of the circuit board, in which the connector has a connecting direction changed toward the driver, and a connecting line for connecting the connector to the driver.

摘要翻译： 一种背光单元，包括安装有发光二极管并形成有与发光二极管电连接的连接焊盘的电路板，安装在电路板的一个表面上并被配置为驱动发光二极管的驱动器，连接器连接到连接 电路板的焊盘，其中连接器具有朝向驱动器的连接方向，以及用于将连接器连接到驱动器的连接线。

公开(公告)号：US20100148205A1

公开(公告)日：2010-06-17

申请号：US12709113

申请日：2010-02-19

申请人： Yong Suk Kim ,  Hoon Hurh ,  Geun Ho Kim ,  Yu Ho Won

发明人： Yong Suk Kim ,  Hoon Hurh ,  Geun Ho Kim ,  Yu Ho Won

IPC分类号： H01L33/00

CPC分类号： G02B7/022 ,  H01L33/483 ,  H01L33/54

摘要： A lens and a light emitting device package formed by introducing surface mount technology (SMI) are disclosed. The lens includes a refractive portion which refracts incident light, and at least one surface mount portion, wherein a portion of the surface mount portion is formed in the refractive portion.

摘要翻译： 公开了通过引入表面贴装技术（SMI）形成的透镜和发光器件封装。 透镜包括折射入射光的折射部分和至少一个表面安装部分，其中表面安装部分的一部分形成在折射部分中。

公开(公告)号：US07570692B2

公开(公告)日：2009-08-04

申请号：US10466163

申请日：2001-12-21

申请人： Sang-Woo Ahn ,  Jin Soo Choi ,  Yong Suk Kim ,  Munchurl Kim ,  Jin Woong Kim ,  Chieteuk Ahn

发明人： Sang-Woo Ahn ,  Jin Soo Choi ,  Yong Suk Kim ,  Munchurl Kim ,  Jin Woong Kim ,  Chieteuk Ahn

IPC分类号： H04N7/52

CPC分类号： H04N21/234318 ,  H04N21/234309 ,  H04N21/2353 ,  H04N21/23605 ,  H04N21/23608 ,  H04N21/2362 ,  H04N21/242 ,  H04N21/8193

摘要： An apparatus and method for transmitting MPEG-4 data synchronized to MPEG-2 data is disclosed. The apparatus for transmitting MPEG-4 data synchronized to MPEG-2 data includes: an object separation unit for extracting MPEG-4 object data from MP4 data, separating meta information from the object data, and generating program information and synchronization information; a conversion unit for converting the MPEG-4 object data to MPEG-4 packets of which data structure is the same as that of MPEG-2 data, based on the program information and synchronization information; and a multiplexing unit for multiplexing the MPEG-4 packets with the MPEG-2 data.

摘要翻译： 公开了一种用于发送与MPEG-2数据同步的MPEG-4数据的装置和方法。 用于发送与MPEG-2数据同步的MPEG-4数据的装置包括：对象分离单元，用于从MP4数据中提取MPEG-4对象数据，从对象数据中分离元信息，以及生成节目信息和同步信息; 转换单元，用于基于节目信息和同步信息将MPEG-4对象数据转换为与MPEG-2数据相同的数据结构的MPEG-4数据包; 以及复用单元，用于将MPEG-4分组与MPEG-2数据进行复用。

公开(公告)号：US20090065797A1

公开(公告)日：2009-03-12

申请号：US12230447

申请日：2008-08-28

申请人： Yong Suk Kim ,  Hoon Hur

发明人： Yong Suk Kim ,  Hoon Hur

IPC分类号： H01L21/00 ,  G02F1/1335

CPC分类号： H05K1/142 ,  H05K1/0206 ,  H05K1/141 ,  H05K3/403 ,  H05K2201/09963 ,  H05K2201/10106 ,  H05K2201/209 ,  H05K2203/167

摘要： A light emitting unit capable of widely adjusting brightness or size, and a liquid crystal display device using the same are disclosed. The light emitting unit includes a circuit board including circuit lines having a plurality of connecting members, and a plurality of unit module connected to the connecting members of the circuit board. The unit module is coupled with at least one light emitting device.

摘要翻译： 公开了能够广泛调节亮度或尺寸的发光单元以及使用其的液晶显示装置。 发光单元包括电路板，其包括具有多个连接构件的电路线，以及连接到电路板的连接构件的多个单元模块。 单元模块与至少一个发光装置耦合。