公开(公告)号：US20060258046A1

公开(公告)日：2006-11-16

申请号：US11491746

申请日：2006-07-24

Applicant: Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Worner

Inventor： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stuempfl ,  Stefan Wein ,  Holger Worner

IPC: H01L21/00

CPC classification number: H01L21/56 ,  H01L21/568 ,  H01L23/3114 ,  H01L23/3135 ,  H01L24/19 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2924/00013 ,  H01L2924/01068 ,  H01L2924/15311 ,  H01L2924/014 ,  H01L2224/13099

Abstract: An electronic component and a blank have plastic embedding compounds of a first and a second plastic layer. Semiconductor chips are embedded in the first plastic layer in such a way that their marginal sides are surrounded by a bead. The second plastic layer compensates for the unevenness of a upper boundary of the first plastic layer.

公开(公告)号：US06953992B2

公开(公告)日：2005-10-11

申请号：US10247966

申请日：2002-09-20

Applicant: Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stümpfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Wörner

Inventor： Bernd Goller ,  Robert-Christian Hagen ,  Gerald Ofner ,  Christian Stümpfl ,  Josef Thumbs ,  Stefan Wein ,  Holger Wörner

IPC: H01L21/60 ,  H01L23/31 ,  H01L23/49 ,  H01L23/48 ,  H01L23/495 ,  H01L25/52

CPC classification number: H01L24/80 ,  H01L23/3128 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012

Abstract: The invention relates to an electronic component having at least one semiconductor chip and a flat chip carrier assigned to the semiconductor chip. Electrical connections between contact areas on an active chip surface of the semiconductor chip and contact terminal areas on an upper side of the chip carrier are formed by strips of material that can undergo microstructuring and that are provided with an electrically conductive coating. The invention also relates to a method for producing the electronic component.

Abstract translation: 本发明涉及一种具有至少一个半导体芯片和分配给该半导体芯片的平坦芯片载体的电子部件。 在半导体芯片的有源芯片表面上的接触区域和芯片载体的上侧上的接触端子区域之间的电连接由能够经历微结构并且具有导电涂层的材料条形成。 本发明还涉及一种电子部件的制造方法。

公开(公告)号：US06910662B1

公开(公告)日：2005-06-28

申请号：US09959707

申请日：2000-05-02

Applicant: Anton Gerald Ofner

Inventor： Anton Gerald Ofner

IPC: B64B1/20 ,  B64C3/48 ,  B64C3/44

CPC classification number: B64B1/20 ,  B64C3/48 ,  Y02T50/14

Abstract: Wing parts (20, 21) which influence the lift of aircraft wings (1), especially wings (1) with a cross section and an angle of attack which is suitable for high-speed flight, which parts can be moved out of an aerodynamically inactive servicing position within the aircraft fuselage (30) or out of chambers (40) mounted on the wings (1) into an aerodynamically efficient active position and from the active position back into the servicing position, are assigned to the wings (1). These wing parts (20, 21) in their active position are located on the top (3) and optionally also on the bottom (4) of the wings (1) and are shaped for example such that the wing parts (21) located in their active position on the bottom (4) of the wings (1) jointly with the wing parts (20) located in their active position on the top (3) of the wings (1) increase the lift and optionally at the same time change the angle of attack of the wing.

Abstract translation: 影响飞机机翼（1）的升力的翼部件（20,21），特别是适用于高速飞行的横截面和迎角的翼（1），这些部件可以从空气动力学中移出 将安装在机翼（1）上的飞行器机身（30）内或室外（40）内的不正常的维修位置分配成空气动力学有效的主动位置并从主动位置返回维修位置。 这些翼部件（20,21）处于其主动位置，位于机翼（1）的顶部（3）上并且任选地位于底部（4）上，并且成形为例如使翼部件（21）位于 它们与翼（1）的底部（4）的主动位置与位于机翼（1）的顶部（3）上的主动位置的翼部件（20）共同增加升力并且可选地同时改变 机翼的攻角。

公开(公告)号：US06710455B2

公开(公告)日：2004-03-23

申请号：US10231881

申请日：2002-08-30

Applicant: Bernd Goller ,  Gerald Ofner ,  Josef Thumbs ,  Holger Wörner ,  Robert-Christian Hagen ,  Christian Stümpfl ,  Stefan Wein

Inventor： Bernd Goller ,  Gerald Ofner ,  Josef Thumbs ,  Holger Wörner ,  Robert-Christian Hagen ,  Christian Stümpfl ,  Stefan Wein

IPC: H01L2348

CPC classification number: H01L24/29 ,  H01L25/0657 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29387 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83139 ,  H01L2225/0651 ,  H01L2225/06555 ,  H01L2225/06562 ,  H01L2225/06575 ,  H01L2225/06586 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2924/00012

Abstract: An electronic component is formed with at least two semiconductor chips that are disposed on a carrier substrate. Active chip surfaces of the semiconductor chips include central contact surfaces on which opposing solder contact surfaces are formed. These are conductively connected to an intermediate carrier which is disposed between the semiconductor chips and which produces rewirings from them to the carrier substrate. A method for fabricating the component is also described.

Abstract translation: 电子部件形成有至少两个设置在载体基板上的半导体芯片。 半导体芯片的有源芯片表面包括形成相对的焊料接触表面的中心接触表面。 这些导体连接到设置在半导体芯片之间并产生从它们到载体衬底的重新布置的中间载体。 还描述了用于制造该部件的方法。

公开(公告)号：US20180095426A1

公开(公告)日：2018-04-05

申请号：US15282615

申请日：2016-09-30

Applicant: Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

Inventor： Sven Albers ,  Klaus Reingruber ,  Andreas Wolter ,  Georg Seidemann ,  Christian Geissler ,  Thorsten Meyer ,  Gerald Ofner

IPC: G04B37/14 ,  H04B1/3827 ,  A44C5/02 ,  A44C5/00 ,  A44C5/14

CPC classification number: G04B37/1486 ,  A44C5/0053 ,  A44C5/02 ,  A44C5/105 ,  A44C5/14 ,  G06F1/163 ,  H04B1/385 ,  H04B2001/3861 ,  H04W4/80

Abstract: A flexible band wearable electronic device includes a plurality of rigid links. The flexible band wearable electronic device also includes a number of pivot joints coupling the plurality of rigid links together. The flexible band wearable electronic device further includes a first electronic device on a first of the plurality of rigid links, and a second electronic device on a second of the plurality of rigid links. The flexible band wearable electronic device still further includes an electrical communication pathway between first electronic device and the second electronic device and through at least a portion of one of the number of pivot joints.

公开(公告)号：US20140361387A1

公开(公告)日：2014-12-11

申请号：US13910133

申请日：2013-06-05

Applicant: Thorsten Meyer ,  Gerald Ofner ,  Christian Mueller ,  Reinhard Mahnkopf ,  Christian Geissler ,  Andreas Augustin

Inventor： Thorsten Meyer ,  Gerald Ofner ,  Christian Mueller ,  Reinhard Mahnkopf ,  Christian Geissler ,  Andreas Augustin

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/0077 ,  B81B7/007 ,  B81B2207/012 ,  B81B2207/095 ,  B81C1/00333 ,  H01L24/19 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/24137 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73259 ,  H01L2224/73267 ,  H01L2924/1431 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A chip arrangement may include: a mold compound; and a microelectromechanical systems device at least partially embedded in the mold compound.

Abstract translation: 芯片布置可以包括：模具化合物; 以及至少部分地嵌入模具化合物中的微机电系统装置。

公开(公告)号：US08754522B2

公开(公告)日：2014-06-17

申请号：US13281795

申请日：2011-10-26

Applicant: Thorsten Meyer ,  Gerald Ofner

Inventor： Thorsten Meyer ,  Gerald Ofner

IPC: H01L23/34

CPC classification number: H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/3121 ,  H01L23/5389 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/24137 ,  H01L2224/92 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2224/96 ,  H01L2224/82 ,  H01L2924/00

Abstract: Repairable semiconductor device and method. In one embodiment a method, provides a first body having a first semiconductor chip and a first metal layer. A second body includes a second semiconductor chip and a second metal layer. Metal of the first metal layer is removed. The first semiconductor chip is removed from the first body. The second body is attached to the first body. The first metal layer is electrically coupled to the second metal layer.

Abstract translation: 可修复的半导体器件和方法。 在一个实施例中，一种方法提供了具有第一半导体芯片和第一金属层的第一主体。 第二主体包括第二半导体芯片和第二金属层。 第一金属层的金属被去除。 第一半导体芯片从第一主体移除。 第二个身体连接到第一个身体。 第一金属层电耦合到第二金属层。

公开(公告)号：US08716859B2

公开(公告)日：2014-05-06

申请号：US13346993

申请日：2012-01-10

Applicant: Thorsten Meyer ,  Gerald Ofner ,  Bernd Waidhas

Inventor： Thorsten Meyer ,  Gerald Ofner ,  Bernd Waidhas

IPC: H01L23/52

CPC classification number: H01L24/81 ,  H01L21/568 ,  H01L23/3135 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/14 ,  H01L24/17 ,  H01L24/19 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/0231 ,  H01L2224/02371 ,  H01L2224/02373 ,  H01L2224/02381 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05548 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/3511 ,  H01L2924/00

Abstract: A flip chip package structure is proposed in which a redistribution layer (RDL) is disposed on a surface of both a semiconductor chip and one or more lateral extensions of the semiconductor chip surface. The lateral extensions may be made using, e.g., a reconstituted wafer to implement a fanout region lateral to one or more sides of the semiconductor chip. One or more electrical connectors such as solder bumps or copper cylinders may be applied to the RDL, and an interposer such as a PCB interposer may be connected to the electrical connectors. In this way, a relatively tight semiconductor pad pitch may be accommodated and translated to an appropriate circuit board pitch without necessarily requiring a silicon or glass interposer.

Abstract translation: 提出了一种倒装芯片封装结构，其中再分配层（RDL）设置在半导体芯片和半导体芯片表面的一个或多个侧向延伸部分的表面上。 横向延伸部可以使用例如重构的晶片来实现半导体芯片的一个或多个侧面的横向扇出区域。 可以将一个或多个电连接器（例如焊料凸块或铜圆筒）施加到RDL，并且诸如PCB插入器的插入件可以连接到电连接器。 以这种方式，可以容纳相对紧凑的半导体衬垫间距并将其转换成适当的电路板间距，而不需要硅或玻璃插入件。

公开(公告)号：US08610266B2

公开(公告)日：2013-12-17

申请号：US11470056

申请日：2006-09-05

Applicant: Kai Chong Chan ,  Gerald Ofner

Inventor： Kai Chong Chan ,  Gerald Ofner

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L24/13 ,  H01L21/563 ,  H01L24/11 ,  H01L2224/05022 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1319 ,  H01L2224/13644 ,  H01L2224/73203 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/351 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A semiconductor device (5) for radio frequency applications has a semiconductor chip (1) with an integrated circuit accommodated in a radio frequency package. Inside bumps (2) comprise inside contacts between the semiconductor chip (1) and a redistribution substrate (3). The inside bumps (2) have a metallic or plastic core (6) and a coating layer (7) of a noble metal.

Abstract translation: 用于射频应用的半导体器件（5）具有容纳在射频封装中的集成电路的半导体芯片（1）。 内部凸块（2）包括半导体芯片（1）和再分布基板（3）之间的内部触点。 内部凸块（2）具有金属或塑料芯（6）和贵金属的涂层（7）。

公开(公告)号：US08003448B2

公开(公告)日：2011-08-23

申请号：US12868147

申请日：2010-08-25

Applicant: Kai Chong Chan ,  Charles Wee Ming Lee ,  Gerald Ofner

Inventor： Kai Chong Chan ,  Charles Wee Ming Lee ,  Gerald Ofner

IPC: H01L29/06 ,  H01L23/34 ,  H01L21/00

CPC classification number: H01L23/3121 ,  H01L21/563 ,  H01L29/0657 ,  H01L2221/6834 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/10155 ,  H01L2924/10157 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor package includes a rewiring substrate and a semiconductor chip. The semiconductor chip includes: a first face with an active surface including integrated circuit devices and chip contact pads, a second face lying in a plane essentially parallel to the first face and side faces. Each side face of the semiconductor chip lies in a plane essentially perpendicular to the first and second faces. At least one edge between two mutually essentially perpendicular faces of the semiconductor chip includes a surface.

Abstract translation: 半导体封装包括重新布线基板和半导体芯片。 半导体芯片包括：具有主动表面的第一面，包括集成电路器件和芯片接触焊盘，位于基本上平行于第一面和侧面的平面中的第二面。 半导体芯片的每个侧面位于基本上垂直于第一和第二面的平面中。 半导体芯片的两个相互基本垂直的面之间的至少一个边缘包括一个表面。