公开(公告)号：US20140096716A1

公开(公告)日：2014-04-10

申请号：US13646403

申请日：2012-10-05

Applicant: ASM IP HOLDING B.V.

Inventor： Hsiao Pei Chung ,  Hirofumi Arai ,  Dai Ishikawa

IPC: F27D15/02 ,  C23C16/46

CPC classification number: C23C16/4586 ,  F27D5/0037 ,  H01J37/32724 ,  H01L21/67109

Abstract: A pedestal for supporting a substrate includes: a heating plate for heating the substrate; an upper cooling plate for cooling the substrate, installed on the heating plate and provided with an upper fluid path for passing a cooling fluid therethrough; and an lower cooling plate for cooling the substrate, installed under the heating plate and including a lower fluid path for passing a cooling fluid therethrough.

Abstract translation: 用于支撑基板的基座包括：用于加热基板的加热板; 用于冷却基板的上部冷却板，安装在加热板上并设置有用于使冷却流体通过的上部流体路径; 以及用于冷却基板的下部冷却板，安装在加热板下方并且包括用于使冷却流体从其中通过的下部流体路径。