公开(公告)号：US20140329961A1

公开(公告)日：2014-11-06

申请号：US14359403

申请日：2012-11-21

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Saurav S. Sengupta ,  Michael L. Smith ,  John O. Osby

IPC: H01B3/44 ,  C08F222/26 ,  C08F210/02

CPC classification number: H01B3/446 ,  C08F210/02 ,  C08F222/26 ,  H01B3/441 ,  C08F218/16 ,  C08F218/18 ,  C08F4/34

Abstract: Interpolymer resins having ethylene monomer residues and residues of a non-conjugated diene comonomer. The non-conjugated diene comonomer can be a dialkenyl phthalate. Incorporation of non-conjugated diene comonomers into interpolymers can provide additional labile unsaturation sites for cross-linking. The interpolymers and cross-linked variations thereof can be employed in a variety of articles of manufacture, such as, for example, as insulation material for power cables.

Abstract translation: 具有乙烯单体残基和非共轭二烯共聚单体残基的共聚物树脂。 非共轭二烯共聚单体可以是邻苯二甲酸二辛基酯。 将非共轭二烯共聚单体掺入互聚物可以为交联提供额外的不稳定不饱和位点。 互聚物和交联变体可以用于各种制品中，例如用作电力电缆的绝缘材料。