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47 条记录 (耗时 0.026 秒)

    Apparatus and method for polishing semiconductor wafer
    41.
    发明申请
    Apparatus and method for polishing semiconductor wafer 审中-公开
    用于抛光半导体晶片的装置和方法

    公开(公告)号：US20060049142A1

    公开(公告)日：2006-03-09

    申请号：US11200172

    申请日：2005-08-10

    申请人： Fumitaka Ito

    发明人： Fumitaka Ito

    IPC分类号： C03C15/00 ,  H01L21/306 ,  B44C1/22

    CPC分类号： B08B1/007 ,  B08B3/02

    摘要： By almost completely removing foreign matter adhering to the wafer holding unit of a polishing head in a CMP process, a wafer yield is improved. An apparatus for polishing a semiconductor wafer is provided with a wafer holder to which the wafer is attached, a polishing unit which polishes the wafer with a polishing slurry supplied to the wafer, a wafer attaching and detaching unit at which the wafer is attached to or detached from the wafer holder, and a washing unit which washes the wafer holder. The wafer holder has a wafer contact surface, which contacts the backside of the wafer, and a supporting unit which prevents the jump out of the wafer. The washing unit has nozzles which supply a washing solution to the wafer contact surface and the supporting unit, and the nozzles are composed of a plurality of outlets capable of supplying at least two different liquids. As a result, it is possible to almost completely remove the foreign matter adhering to the wafer holder to always keep the wafer holder clean.

    摘要翻译： 通过在CMP工艺中几乎完全除去附着在抛光头的晶片保持单元上的异物，晶片产量提高。 用于抛光半导体晶片的装置设置有晶片保持器，晶片固定到晶片固定器上，抛光单元，其用提供给晶片的抛光浆料抛光晶片，晶片安装和分离单元，晶片附着到和/ 从晶片保持器分离，洗涤单元洗涤晶片保持器。 晶片保持器具有接触晶片背面的晶片接触表面和防止跳出晶片的支撑单元。 洗涤单元具有向晶片接触表面和支撑单元提供洗涤溶液的喷嘴，并且喷嘴由能够供应至少两种不同液体的多个出口组成。 结果，可以几乎完全除去附着在晶片保持架上的异物，以始终保持晶片保持器清洁。

    Pyrrolidinyl hydroxamic acid compounds and their production process
    43.
    发明授权
    Pyrrolidinyl hydroxamic acid compounds and their production process 失效
    吡咯烷基异羟肟酸化合物及其制备方法

    公开(公告)号：US6110947A

    公开(公告)日：2000-08-29

    申请号：US302097

    申请日：1999-04-29

    申请人： Fumitaka Ito

    发明人： Fumitaka Ito

    IPC分类号： C07D295/12 ,  A61K31/40 ,  A61K31/4025 ,  A61K31/44 ,  A61K31/4427 ,  A61K31/443 ,  A61K31/4433 ,  A61P1/00 ,  A61P7/00 ,  A61P7/10 ,  A61P23/00 ,  A61P25/00 ,  A61P25/04 ,  A61P25/28 ,  A61P29/00 ,  A61P43/00 ,  C07D20060101 ,  C07D207/12 ,  C07D213/54 ,  C07D295/13 ,  C07D307/79 ,  C07D401/06 ,  C07D401/12 ,  C07D405/06 ,  C07D405/12 ,  C07D405/14 ,  C07D409/12 ,  A61K31/4439 ,  C07D407/12

    CPC分类号： C07D213/54 ,  C07D207/12 ,  C07D295/13 ,  C07D307/79 ,  C07D405/12 ,  C07D409/12 ,  Y02P20/55

    摘要： A compound of the formula: ##STR1## and it pharmaceutically acceptable salt, wherein A is hydrogen, hydroxy or OY, where Y is a hydroxy protecting group;Ar is phenyl optionally substituted with one or more substituents selected from halo, hydroxy, C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy, CF.sub.3, C.sub.1 -C.sub.4 alkyloxy, and carboxy-C.sub.1 -C.sub.4 alkyloxy;X is phenyl, naphthyl, biphenyl, indanyl, benzofuranyl, benzothiopheny, 1-tetralone-6-yl, C.sub.1 -C.sub.4 alkylenedioxy, pyridyl, furyl and thienyl, these groups optionally being substituted with up to three substituents selected from halo, C.sub.1 -C.sub.4 alkyl, C.sub.1 -C.sub.4 alkoxy, hydroxy, NO.sub.2, CF.sub.3 and SO.sub.2 CH.sub.3 ; andR is hydrogen, C.sub.1 -C.sub.4 alkyl or a hydroxy protecting group.These compounds and pharmaceutical compositions containing them are useful as analgesic, antiinflammatory, diuretic, anesthetic or neuroprotective agents, or an agent for stroke or treatment of functional bowel diseases such as abdominal pain, for the treatment of a mammalian subject, especially a human subject. Further, the present invention provides processes for producing the hydroxamic compounds of formula (I) and their intermediate compounds of formula (II).

    摘要翻译： 下式的化合物及其药学上可接受的盐，其中A是氢，羟基或OY，其中Y是羟基保护基; Ar是任选被一个或多个选自卤素，羟基，C 1 -C 4烷基，C 1 -C 4烷氧基，CF 3，C 1 -C 4烷氧基和羧基-C 1 -C 4烷氧基的取代基取代的苯基; X是苯基，萘基，联苯基，茚满基，苯并呋喃基，苯并噻吩并，1-四氢萘酮-6-基，C 1 -C 4亚烷基二氧基，吡啶基，呋喃基和噻吩基，这些基团任选被至多三个选自卤素，C 1 -C 4 烷基，C 1 -C 4烷氧基，羟基，NO 2，CF 3和SO 2 CH 3; 和R是氢，C 1 -C 4烷基或羟基保护基。 含有它们的这些化合物和药物组合物可用作止痛剂，抗炎剂，利尿剂，麻醉剂或神经保护剂，或用于中风或治疗功能性肠病如腹痛的药剂，用于治疗哺乳动物受试者，特别是人类受试者。 此外，本发明提供了制备式（I）的异羟肟酸化合物及其中间体式（II）的化合物的方法。

    Method of dressing an abrasive cloth and apparatus therefor
    44.
    发明授权
    Method of dressing an abrasive cloth and apparatus therefor 失效
    磨砂布的修整方法及其设备

    公开(公告)号：US5984764A

    公开(公告)日：1999-11-16

    申请号：US861200

    申请日：1997-05-21

    申请人： Hideo Saito ,  Hiromi Nishihara ,  Fumitaka Ito ,  Hironobu Hirata

    发明人： Hideo Saito ,  Hiromi Nishihara ,  Fumitaka Ito ,  Hironobu Hirata

    IPC分类号： B24B37/04 ,  B24B53/007 ,  B24D7/06 ,  B24B1/00

    CPC分类号： B24B53/017 ,  B24B37/042 ,  B24D7/06

    摘要： The present invention relates to a method of discovering optimal conditions such as the rotational speed ratio of an abrasive cloth and a dresser, to improve the flatness of the abrasive cloth after it has been dressed. A narrow annular dresser having an inner diameter of at least the width of a wide annular utilization region of the abrasive cloth is pressed while rotating against the abrasive cloth which is fixed onto a turn table. A rotational motion is imparted to the abrasive cloth in the same direction as the rotation of the dresser and at a predetermined rotational speed. The abrasive cloth is dressed thereby in such a manner that there is a uniform distribution of distances through which the grindstone slides over various points within the utilization region of the abrasive cloth.

    摘要翻译： 本发明涉及一种发现最佳条件的方法，例如研磨布和修整器的转速比，以提高研磨布整修后的平整度。 具有至少宽度大的研磨布的环形利用区域的内径的窄环形修整器在被固定到转台上的研磨布上旋转时被按压。 旋转运动以与修整器的旋转相同的方向并以预定的转速传递给研磨布。 研磨布以这样一种方式穿着，使磨石在研磨布的利用区域内的各个点上滑动穿过该距离的均匀分布。