公开(公告)号：US11233577B1

公开(公告)日：2022-01-25

申请号：US16948097

申请日：2020-09-03

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Mir Ashkan Seyedi

IPC: H04B10/00 ,  H04B10/69 ,  G02B6/42 ,  G01K7/00 ,  H04B10/40 ,  H04B10/50 ,  G02B6/293

Abstract: Examples include systems and methods for communicating temperature variation information of a transmitter resonator to a receiver resonator in an optical communication system. Some examples provide a transceiver module that includes a transmitter resonator to transmit optical signals emitted from a light source, a photodetector coupled to the transmitter resonator to detect the optical signals transmitted by the transmitter resonator and generate a photocurrent, and a controller to receive the photocurrent from the photodetector, determine temperature variation information of the transmitter resonator from the photocurrent, and encode the temperature variation information in an outgoing data stream transmitted via the transmitter resonator.

公开(公告)号：US11177219B1

公开(公告)日：2021-11-16

申请号：US16948397

申请日：2020-09-16

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Jinsung Youn ,  Mir Ashkan Seyedi

IPC: H01L23/538 ,  H04B10/40 ,  H04B10/25 ,  H04J14/02 ,  H01L23/498

Abstract: Examples include a photonic device including a photonic integrated circuit (PIC), an optical transceiver (OTRx) front-end circuitry integrated with the PIC, an electronic integrated circuit (EIC) and an interposer. The PIC and the EIC are disposed on the interposer. The EIC is electrically interconnected to the OTRx front-end circuitry in the PIC. Some examples include a method of fabricating a photonic device.

公开(公告)号：US20210242168A1

公开(公告)日：2021-08-05

申请号：US16777569

申请日：2020-01-30

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Mir Ashkan Seyedi ,  Marco Fiorentino

IPC: H01L23/00 ,  H01L23/498 ,  H01L23/31 ,  H01L21/56 ,  H01L21/48

Abstract: Examples herein relate to optoelectronic assemblies. In particular, implementations herein relate to an optoelectronic assembly formed via a chip on wafer on substrate (CoWoS) process. The optoelectronic assembly includes a substrate, an interposer, and an electronic integrated circuit (EIC). Each of the substrate, interposer, and EIC includes opposing first and second sides. The EIC is flip-chip assembled to the first side of the interposer, and the interposer with the EIC assembled thereto is flip-chip assembled to the first side of the substrate. An overmold layer extends over the first side of the interposer and encapsulates the EIC. The overmold layer includes a cavity such that a region of the first side of the interposer is exposed. An optical component is positioned within the cavity and coupled to the first side of the interposer.

公开(公告)号：US11036014B1

公开(公告)日：2021-06-15

申请号：US16777868

申请日：2020-01-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Mir Ashkan Seyedi ,  Geza Kurczveil

IPC: H04B10/27 ,  G02B6/42 ,  H04B10/50 ,  G02B6/293 ,  H04B10/61 ,  H04B10/54

Abstract: Improved systems and methods are provided to implement coherent communication. The system includes an interposer to route the components of an integrated photonic circuit. The interposer provides an interface to couple the components of the integrated photonic circuit including an optical source, modulator, coherent transmitter, coherent receiver, and interconnects therebetween. The optical source can be a grating-coupled surface-emitting laser (GCSEL). The GCSEL splits an optical signal into two symmetrical optical signals that are directed by a waveguide to a coherent transmitter and/or a coherent receiver of the integrated photonic circuit. Coherent communication is maintained and the need for a second laser in the coherent receiver is avoided through the structure of the GCSEL granting dual functional to the optical source.

公开(公告)号：US10985841B1

公开(公告)日：2021-04-20

申请号：US16775939

申请日：2020-01-29

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Mir Ashkan Seyedi

IPC: H04J14/02 ,  H04B10/25 ,  H04B10/516 ,  H04B10/27 ,  H04B10/50 ,  H04B10/29

Abstract: Examples herein relate to wavelength division multiplexing optical interconnects. In particular, implementations herein relate to an optical interconnect that include a wavelength translator. The optical interconnect includes a first transmitter configured to modulate, combine, and transmit multi-wavelength optical signals, the modulated optical signals having a first number of optical channels, a first data rate per wavelength, and a first wavelength spacing between neighboring modulated optical signals. The optical interconnect includes a wavelength translator configured to convert the modulated optical signals such that the converted modulated optical signals have at least one or more of: a second number of optical channels different from the first number of optical channels, a second data rate per wavelength different from the first data rate per wavelength, or a second wavelength spacing different from the first wavelength spacing.

公开(公告)号：US10895688B2

公开(公告)日：2021-01-19

申请号：US16694592

申请日：2019-11-25

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Kevin B. Leigh ,  Paul Kessler Rosenberg ,  Sagi Mathai ,  Mir Ashkan Seyedi ,  Michael Renne Ty Tan ,  Wayne Victor Sorin ,  Marco Fiorentino

IPC: G02B6/30

Abstract: In example implementations, an optical connector is provided. The optical connector includes a jumper holder, a base bracket, and an optical ferrule. The jumper holder holds a plurality of ribbon fibers. The base bracket is coupled to an electrical substrate to mate with the jumper holder. The optical ferrule is coupled to an end of each one of the plurality of ribbon fibers. The optical ferrule is laterally inserted into a corresponding orthogonal socket that is coupled to a silicon interposer on the electrical substrate to optically mate the optical ferrule to the orthogonal socket.

公开(公告)号：US10805004B2

公开(公告)日：2020-10-13

申请号：US16495187

申请日：2017-04-07

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tsung Ching Huang ,  Rui Wu ,  Nan Qi ,  Mir Ashkan Seyedi ,  Marco Fiorentino ,  Raymond G. Beausoleil

IPC: H04B10/00 ,  H04B10/079 ,  H04B10/50 ,  H04B10/54 ,  H04J14/00

Abstract: Examples described herein relate to reducing a magnitude of a supply voltage for a circuit element of an optical transmitter device. In some such examples, the circuit element is a driving element that is to receive a first electrical data signal and to provide a second electrical data signal to an optical element that is to provide an optical data signal. A testing element is to compare the optical data signal to the first electrical data signal to determine whether the optical transmitter device meets a performance threshold. When the device meets the performance threshold, a regulating element is to reduce a magnitude of the supply voltage of the driving element.

公开(公告)号：US20190064443A1

公开(公告)日：2019-02-28

申请号：US15761781

申请日：2015-09-22

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Mir Ashkan Seyedi ,  Chin-Hui Chen

IPC: G02B6/293

Abstract: In the examples provided herein, a system has a first racetrack resonant waveguide structure, positioned to enable an input light signal to couple from a first waveguide; and a second racetrack resonant waveguide structure, positioned to enable the input light signal to couple between the first racetrack resonant waveguide structure and the second racetrack resonant waveguide structure, and further positioned to enable an output light signal to couple from the second racetrack resonant waveguide structure to a second waveguide. The system also has a primary heating unit, positioned to heat a primary region including a first portion of the first racetrack resonant waveguide structure and a first portion of the second racetrack resonant waveguide structure, to change a central frequency and a passband width for the system.