Silicon oxide film formation method
    41.
    发明授权
    Silicon oxide film formation method 失效
    氧化硅膜形成方法

    公开(公告)号:US06955836B2

    公开(公告)日:2005-10-18

    申请号:US10326092

    申请日:2002-12-23

    摘要: A silicon oxide film formation method enhances the efficiency of generating atomic oxygen and improves film quality of a silicon film (SiO2 film) in forming the silicon oxide film using an RS-CVD system. Nitrogen atom containing gas (N2 gas, NO gas, N2O gas, NO2 gas or the like) is added to oxygen atom containing gas (O2 gas, O3 gas or the like) introduced into a plasma generating space in a vacuum container to produce plasmas with these gases and to thereby increase the quantity of atomic oxygen generated by the plasmas in the plasma generating space.

    摘要翻译: 在使用RS-CVD系统形成氧化硅膜时,氧化硅膜形成方法提高了产生原子氧的效率并提高了硅膜(SiO 2膜)的膜质量。 将含氮原子的气体(N 2气体,NO气体,N 2 O气体,NO 2气体等)加入氧原子 将含有气体(O 2 O 2气体,O 3气体等)引入到真空容器中的等离子体产生空间中以产生具有这些气体的等离子体,从而增加数量 由等离子体产生空间中的等离子体产生的原子氧。

    Hot element CVD apparatus and a method for removing a deposited film
    42.
    发明授权
    Hot element CVD apparatus and a method for removing a deposited film 失效
    热元素CVD装置和去除沉积膜的方法

    公开(公告)号:US06942892B1

    公开(公告)日:2005-09-13

    申请号:US09633002

    申请日:2000-08-04

    申请人: Keiji Ishibashi

    发明人: Keiji Ishibashi

    摘要: The present invention provides a method for efficiently and completely removing a film deposited inside a film forming chamber. In addition, the invention provides a CVD apparatus using heating element which an in-situ cleaning method can be applied and its in-situ leaning method.The removal method of this invention comprises a method for removing a film deposited inside a chamber which can be exhausted and/or on a member placed in the chamber, wherein after the chamber is exhausted, a heating element, at least the surface of which is composed of platinum, disposed in said vacuum chamber, is heated at a prescribed temperature and a cleaning gas which is decomposed and/or activated by the heating element to generate an activated species that converts the deposited film into gaseous substance is introduced into the chamber.

    摘要翻译: 本发明提供一种有效且完全除去沉积在成膜室内的膜的方法。 此外,本发明提供一种使用可以应用原位清洗方法的加热元件的CVD装置及其原位倾斜方法。 本发明的去除方法包括一种去除沉积在室内的膜的方法,所述膜可以排出和/或放置在室中的构件上,其中在室被排出之后,至少其表面为 由设置在所述真空室中的铂组成,在规定温度下被加热,并且由加热元件分解和/或激活的清洁气体产生将沉积膜转化为气态物质的活化物质。

    Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same
    47.
    发明授权
    Group III nitride crystal substrate, epilayer-containing group III nitride crystal substrate, semiconductor device and method of manufacturing the same 有权
    III族氮化物晶体衬底,含有外延层的III族氮化物晶体衬底,半导体器件及其制造方法

    公开(公告)号:US08771552B2

    公开(公告)日:2014-07-08

    申请号:US12837872

    申请日:2010-07-16

    IPC分类号: H01B1/00

    摘要: A group III nitride crystal substrate is provided in which a uniform distortion at a surface layer of the crystal substrate represented by a value of |d1 −d2 |/d2 obtained from a plane spacing d1 at the X-ray penetration depth of 0.3 μm and a plane spacing d2 at the X-ray penetration depth of 5 μm is equal to or lower than 1.9 ×10−3, and the main surface has a plane orientation inclined in the direction at an angle equal to or greater than 10° and equal to or smaller than 80° with respect to one of (0001) and (000-1) planes of the crystal substrate. A group III nitride crystal substrate suitable for manufacturing a light emitting device with a blue shift of an emission suppressed, an epilayer-containing group III nitride crystal substrate, a semiconductor device and a method of manufacturing the same can thereby be provided.

    摘要翻译: 提供了一种III族氮化物晶体基板,其中在由X射线穿透深度为0.3μm的平面间距d1获得的| d1 -d2 | / d2的值表示的晶体基板的表面层处的均匀的变形,以及 在5μm的X射线穿透深度处的平面间距d2等于或小于1.9×10 -3,并且主表面具有以等于或大于等于或等于10°的角度在<10-10>方向上倾斜的平面取向 相对于晶体基板的(0001)和(000-1)面之一,比10°等于或小于80°。 因此,可以提供适合于制造抑制发射蓝移的发光器件的III族氮化物晶体衬底,含有外延层的III族氮化物晶体衬底,半导体器件及其制造方法。

    Silicon carbide substrate manufacturing method and silicon carbide substrate
    48.
    发明授权
    Silicon carbide substrate manufacturing method and silicon carbide substrate 有权
    碳化硅衬底制造方法和碳化硅衬底

    公开(公告)号:US08586998B2

    公开(公告)日:2013-11-19

    申请号:US13557749

    申请日:2012-07-25

    IPC分类号: H01L29/38

    摘要: Silicon carbide single crystal is prepared. Using the silicon carbide single crystal as a material, a silicon carbide substrate having a first face and a second face located at a side opposite to the first face is formed. In the formation of the silicon carbide substrate, a first processed damage layer and a second processed damage layer are formed at the first face and second face, respectively. The first face is polished such that at least a portion of the first processed damage layer is removed and the surface roughness of the first face becomes less than or equal to 5 nm. At least a portion of the second processed damage layer is removed while maintaining the surface roughness of the second plane greater than or equal to 10 nm.

    摘要翻译: 制备碳化硅单晶。 使用碳化硅单晶作为材料,形成具有位于与第一面相反的一侧的第一面和第二面的碳化硅衬底。 在形成碳化硅衬底时,分别在第一面和第二面上形成第一加工损伤层和第二处理损伤层。 抛光第一面使得第一经处理的损伤层的至少一部分被去除并且第一面的表面粗糙度变得小于或等于5nm。 第二处理的损伤层的至少一部分被去除,同时保持第二平面的表面粗糙度大于或等于10nm。

    Method of processing a surface of group III nitride crystal and group III nitride crystal substrate
    49.
    发明授权
    Method of processing a surface of group III nitride crystal and group III nitride crystal substrate 有权
    III族氮化物晶体和III族氮化物晶体衬底的表面处理方法

    公开(公告)号:US08338299B2

    公开(公告)日:2012-12-25

    申请号:US12795177

    申请日:2010-06-07

    IPC分类号: H01L21/302

    摘要: There is provided a method of processing a surface of a group III nitride crystal, that includes the steps of: polishing a surface of a group III nitride crystal with a polishing slurry containing abrasive grains; and thereafter polishing the surface of the group III nitride crystal with a polishing liquid at least once, and each step of polishing with the polishing liquid employs a basic polishing liquid or an acidic polishing liquid as the polishing liquid. The step of polishing with the basic or acidic polishing liquid allows removal of impurity such as abrasive grains remaining on the surface of the group III nitride crystal after it is polished with the slurry containing the abrasive grains.

    摘要翻译: 提供一种处理III族氮化物晶体的表面的方法,其包括以下步骤:用含有磨粒的抛光浆料抛光III族氮化物晶体的表面; 然后用研磨液将III族氮化物晶体的表面抛光至少一次,并且用抛光液研磨的每个步骤都使用碱性研磨液或酸性研磨液作为研磨液。 用碱性或酸性抛光液抛光的步骤允许在含有磨料颗粒的浆料抛光后,去除残留在III族氮化物晶体表面上的杂质,例如磨粒。