公开(公告)号：US09786686B2

公开(公告)日：2017-10-10

申请号：US14930999

申请日：2015-11-03

Applicant: Japan Display Inc.

Inventor： Yasushi Kawata

IPC: G02F1/1345 ,  H01L27/12

CPC classification number: H01L27/1218 ,  G02F1/13452 ,  G02F1/13458 ,  H01L27/124

Abstract: According to one embodiment, a display device includes a first substrate includes an insulating substrate including a pierced portion, a pad electrode formed on the insulating substrate, and a signal line electrically connected to the pad electrode, a wiring board includes an interconnecting wiring and located under the insulating substrate, and a conductive material provided in the pierced portion and electrically connecting the pad electrode and the interconnecting wiring to each other.

公开(公告)号：US09666832B2

公开(公告)日：2017-05-30

申请号：US15017195

申请日：2016-02-05

Applicant: JAPAN DISPLAY INC.

Inventor： Yasushi Kawata

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/00

CPC classification number: H01L51/5246 ,  H01L27/322 ,  H01L27/3244 ,  H01L27/3262 ,  H01L27/3272 ,  H01L51/003 ,  H01L51/0097 ,  H01L2227/326 ,  H01L2251/5338

Abstract: According to one embodiment, a method of manufacturing a display device, includes preparing a first substrate formed such that a first resin layer is formed on a first support substrate, and thereafter a display element portion and a mounting portion are formed above the first resin layer and a protection layer, which extends from an end portion of the first resin layer along the mounting portion onto the first support substrate, is disposed, preparing a second substrate formed such that a second resin layer is formed on a second support substrate, attaching the first substrate and the second substrate, and mounting a flexible printed circuit board, which is in a state in which the flexible printed circuit board is opposed to the protection layer, on the mounting portion.

公开(公告)号：US09666428B2

公开(公告)日：2017-05-30

申请号：US14585603

申请日：2014-12-30

Applicant: Japan Display Inc.

Inventor： Yasushi Kawata

IPC: H01L21/31 ,  H01L21/02 ,  H01L51/00 ,  H01L51/52 ,  H01L27/32

CPC classification number: H01L21/022 ,  H01L27/322 ,  H01L27/3244 ,  H01L51/003 ,  H01L51/0097 ,  H01L51/5253 ,  H01L2224/18 ,  H01L2251/5338 ,  H01L2251/566 ,  H01L2924/0002 ,  Y02E10/549 ,  Y02P70/521 ,  H01L2924/00

Abstract: According to one embodiment, a display device includes a first multilayer, second multilayer, and filler layer. The first multilayer includes a first barrier layer formed on a surface of the resin layer and a switching element formed above the first barrier layer. The second multilayer includes a second barrier layer which is substantially the same as the first barrier layer with respect to layering order, material, and thickness. The filler layer is positioned between the first multilayer and the second multilayer. A layering structure of the first barrier layer and a layering structure of the second barrier layer are symmetrical to each other with respect to the switching element.

公开(公告)号：US09356084B2

公开(公告)日：2016-05-31

申请号：US14285705

申请日：2014-05-23

Applicant: Japan Display Inc.

Inventor： Yasushi Kawata

IPC: H01L27/32 ,  H01L51/00

CPC classification number: H01L51/5246 ,  H01L27/322 ,  H01L27/3244 ,  H01L27/3262 ,  H01L27/3272 ,  H01L51/003 ,  H01L51/0097 ,  H01L2227/326 ,  H01L2251/5338

Abstract: According to one embodiment, a method of manufacturing a display device, includes preparing a first substrate formed such that a first resin layer is formed on a first support substrate, and thereafter a display element portion and a mounting portion are formed above the first resin layer and a protection layer, which extends from an end portion of the first resin layer along the mounting portion onto the first support substrate, is disposed, preparing a second substrate formed such that a second resin layer is formed on a second support substrate, attaching the first substrate and the second substrate, and mounting a flexible printed circuit board, which is in a state in which the flexible printed circuit board is opposed to the protection layer, on the mounting portion.

Abstract translation: 根据一个实施例，一种制造显示装置的方法包括制备形成为在第一支撑基板上形成第一树脂层的第一基板，然后在第一树脂层的上方形成显示元件部分和安装部分 并且设置从第一树脂层的沿着安装部的端部延伸到第一支撑基板上的保护层，准备形成为使得第二树脂层形成在第二支撑基板上的第二基板， 第一基板和第二基板，并且在安装部分上安装柔性印刷电路板与保护层相对的状态下的柔性印刷电路板。