公开(公告)号：US20140037187A1

公开(公告)日：2014-02-06

申请号：US13783291

申请日：2013-03-02

Applicant: KLA-Tencor Corporation

Inventor： Gino Marcuccilli ,  Amir Widmann ,  Ellis Chang ,  John Robinson ,  Allen Park

IPC: G06T7/00

CPC classification number: G06T7/0004 ,  G06T7/001 ,  G06T2207/10061 ,  G06T2207/30148

Abstract: Methods for inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer are provided. One method includes acquiring images for multiple die printed on a wafer, each of which is printed by performing a double patterning lithography process on the wafer and which include two or more die printed at nominal values of overlay for the double patterning lithography process and one or more die printed at modulated values of the overlay; comparing the images acquired for the multiple die printed at the nominal values to the images acquired for the multiple die printed at the modulated values; and detecting defects in the multiple die printed at the modulated values based on results of the comparing step.

Abstract translation: 提供了检查晶片和/或预测在晶片上形成的器件的一个或多个特性的方法。 一种方法包括获取用于多个印刷在晶片上的图像，每个图像通过在晶片上执行双重图案化平版印刷工艺而被印刷，并且包括两个或更多个以双重图案化平版印刷工艺的覆盖的标称值印刷的模具，以及一个或 更多地以覆盖层的调制值打印; 将以标称值印刷的多个印模获得的图像与以调制值印刷的多个印模获得的图像进行比较; 并且基于比较步骤的结果检测以调制值印刷的多个印模中的缺陷。