公开(公告)号：US20110127312A1

公开(公告)日：2011-06-02

申请号：US13025419

申请日：2011-02-11

申请人： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah ,  Kazushige Toriyama

发明人： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah ,  Kazushige Toriyama

IPC分类号： B23K3/06

CPC分类号： B23K3/0638 ,  B23K1/0016

摘要： A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.

摘要翻译： 柔性酉面具有多个通孔。 衬底在限定体积的凹陷区域中具有多个可湿性垫。 通孔与可湿性垫对齐。 熔融的焊料通过柔性整体式掩模的通孔被直接注入到具有可湿性垫的体积中，使得通孔和具有可湿性垫的体积被焊料填充。 允许焊料固化，形成粘附到可湿性垫的多个焊料结构。 焊料固化后，将柔性单位掩模从基板上剥离。

公开(公告)号：US07868457B2

公开(公告)日：2011-01-11

申请号：US11855290

申请日：2007-09-14

申请人： Bruce K. Furman ,  Jae-Woong Nah

发明人： Bruce K. Furman ,  Jae-Woong Nah

IPC分类号： H01L23/488

CPC分类号： H01L21/6835 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/328 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10734 ,  H05K2203/0278 ,  H01L2924/00014 ,  H01L2224/13099

摘要： An electrical structure and method for forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure and a first solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. A second portion of the non-solder metallic core structure is thermo-compression bonded to the second electrically conductive pad.

摘要翻译： 一种电气结构和形成方法。 电结构包括第一衬底，其包括第一导电焊盘，第二衬底，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构和第一焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 非焊接金属芯结构的第二部分被热压接合到第二导电焊盘。

公开(公告)号：US20100116871A1

公开(公告)日：2010-05-13

申请号：US12269240

申请日：2008-11-12

申请人： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah ,  Kazushige Toriyama

发明人： Peter A. Gruber ,  Paul A. Lauro ,  Jae-Woong Nah ,  Kazushige Toriyama

IPC分类号： B23K1/20 ,  B23K3/06

CPC分类号： B23K3/0638 ,  B23K1/0016

摘要： A flexible unitary mask has a plurality of through holes. A substrate has a plurality of wettable pads in recessed regions defining volumes. The through holes are aligned with the wettable pads. Molten solder is directly injected through the through holes of the flexible unitary mask into the volumes with the wettable pads, such that the through holes and the volumes with the wettable pads are filled with solder. The solder is allowed to solidify, forming a plurality of solder structures adhered to the wettable pads. The flexible unitary mask is peeled from the substrate after the solder has solidified.

摘要翻译： 柔性酉面具有多个通孔。 衬底在限定体积的凹陷区域中具有多个可湿性垫。 通孔与可湿性垫对齐。 熔融的焊料通过柔性整体式掩模的通孔直接注入到具有可湿性垫片的体积中，使得通孔和具有可湿性垫片的体积用焊料填充。 允许焊料固化，形成粘附到可湿性垫的多个焊料结构。 焊料固化后，将柔性单位掩模从基板上剥离。

公开(公告)号：US20090302095A1

公开(公告)日：2009-12-10

申请号：US12542797

申请日：2009-08-18

申请人： Russell A. Budd ,  Frank R. Libsch ,  Jae-Woong Nah

发明人： Russell A. Budd ,  Frank R. Libsch ,  Jae-Woong Nah

IPC分类号： B23K1/20

CPC分类号： B23K1/0016 ,  B23K3/0623 ,  B23K3/087 ,  B23K2101/40 ,  B23K2101/42 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11005 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/3478 ,  H05K2203/0113 ,  H05K2203/0292 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0557 ,  H05K2203/105 ,  H01L2924/00 ,  H01L2224/05599

摘要： A mask having a plurality of through holes and a mold having a plurality of cavities are provided, and the through holes and the cavities are aligned. Conductive balls are dispensed into the aligned through holes and cavities. Substantially one ball is dispensed into each aligned through hole and cavity, and the mask with the holes and the cavities in the mold are configured and dimensioned such that the balls are substantially flush with, or recessed below, an outer surface of the mask. The mask is removed, the conductive balls are aligned with pads of a semiconductor device, and the conductive balls are transferred to the pads by fluxless reflow in a formic acid environment. Vibrational, electrostatic, and direct transfer aspects are also disclosed.

公开(公告)号：US20090181223A1

公开(公告)日：2009-07-16

申请号：US12015447

申请日：2008-01-16

申请人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： B23K31/02 ,  B32B3/10

CPC分类号： B23K1/0016 ,  B23K1/19 ,  B23K35/262 ,  B23K35/3013 ,  B23K2101/36 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05027 ,  H01L2224/0508 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2924/01322 ,  Y10T428/24826 ,  Y10T428/24942 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor solder bump structure having a solder bump with at least a first solder and a second solder attached to the first solder, producing one solder bump having at least two different solders with different melting temperatures. A method of fabricating the solder is included.

摘要翻译： 一种半导体焊料凸块结构，具有至少具有第一焊料的焊料凸块和附着到第一焊料的第二焊料，产生具有不同熔融温度的至少两种不同焊料的一个焊料凸块。 包括制造焊料的方法。

公开(公告)号：US20090093111A1

公开(公告)日：2009-04-09

申请号：US11869573

申请日：2007-10-09

申请人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Stephen L. Buchwalter ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： H01L21/44 ,  B23K1/00

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/1131 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2924/0002 ,  H01L2924/14 ,  Y10T29/49149 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/05552

摘要： A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus-for performing this process.

摘要翻译： 用于将至少两个彼此邻接的层对准的方法包括在每个层中形成多个链轮开口，用于当链轮从基座向外延伸时接收链轮直径减小的链轮，链轮的中心轴线 每个层中的开口基本上彼此对准，用于首先接收链轮的邻接层中的链轮开口的直径大于邻接层中链轮开口的直径。 随后在至少两个层中的每一个中形成多个储存器开口，并且将链轮开口定位在层中以彼此对应并且层中的储存器开口彼此对应，使得 层中对应的链轮开口的中心轴线对层中对应的储存器开口的中心轴进行实质上的对准。 通过将具有最小直径的链轮的端部插入到具有最大直径的链轮的链轮开口中并且连续到具有最小直径的链轮开口，使链轮开口与链轮接合，使得中心轴线 的对应的链轮开口和相应的储存器开口的中心轴线在层中的基本对准。 本发明还包括用于执行该过程的装置。

公开(公告)号：US20090075469A1

公开(公告)日：2009-03-19

申请号：US11855236

申请日：2007-09-14

申请人： Bruce K. Furman ,  Jae-Woong Nah

发明人： Bruce K. Furman ,  Jae-Woong Nah

IPC分类号： H01L21/44

CPC分类号： H05K3/3436 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/11901 ,  H01L2224/13082 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13611 ,  H01L2224/13644 ,  H01L2224/13655 ,  H01L2224/16 ,  H01L2224/73203 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/328 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/0338 ,  Y02P70/613 ,  Y10T29/49155 ,  H01L2924/00014 ,  H01L2224/13099

摘要： An electrical structure and method for forming electrical interconnects. The method includes positioning a sacrificial carrier substrate such that a first surface of a non-solder metallic core structure within the sacrificial carrier substrate is in contact with a first electrically conductive pad. The first surface is thermo-compression bonded to the first electrically conductive pad. The sacrificial carrier substrate is removed from the non-solder metallic core structure. A solder structure is formed on a second electrically conductive pad. The first substrate comprising the non-solder metallic core structure is positioned such that a second surface of the non-solder metallic core structure is in contact with the solder structure. The solder structure is heated to a temperature sufficient to cause the solder structure to melt and form an electrical and mechanical connection between the second surface of the non-solder metallic core structure and the second electrically conductive pad.

摘要翻译： 一种用于形成电互连的电结构和方法。 该方法包括定位牺牲载体衬底，使得牺牲载体衬底内的非焊料金属芯结构的第一表面与第一导电焊盘接触。 第一表面被热压接合到第一导电焊盘。 从非焊接金属芯结构去除牺牲载体衬底。 在第二导电焊盘上形成焊料结构。 包括非焊料金属芯结构的第一衬底定位成使得非焊料金属芯结构的第二表面与焊料结构接触。 将焊料结构加热到足以使焊料结构熔化并在非焊接金属芯结构的第二表面和第二导电焊盘之间形成电和机械连接的温度。

公开(公告)号：US20080251281A1

公开(公告)日：2008-10-16

申请号：US11733840

申请日：2007-04-11

申请人： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

发明人： Stephen Leslie Buchwalter ,  Bruce K. Furman ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

IPC分类号： H05K1/03 ,  H01K3/10

CPC分类号： H01L24/16 ,  H01L21/563 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L24/28 ,  H01L24/31 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L2221/68377 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1131 ,  H01L2224/11334 ,  H01L2224/114 ,  H01L2224/116 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/17051 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/3436 ,  H05K2201/0379 ,  H05K2201/094 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10977 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2224/45111 ,  H01L2924/01047 ,  H01L2224/13099 ,  H01L2924/01083 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.

摘要翻译： 一种电气结构和成型方法。 电结构包括第一衬底，其包括第一导电焊盘，第二衬底，其包括第二导电焊盘，以及将第一导电焊盘电连接和机械连接到第二导电焊盘的互连结构。 互连结构包括非焊料金属芯结构，第一焊料结构和第二焊料结构。 第一焊料结构将非焊料金属芯结构的第一部分电连接并机械地连接到第一导电焊盘。 第二焊料结构将非焊料金属芯结构的第二部分电连接并机械连接到第二导电焊盘。

公开(公告)号：US09579738B2

公开(公告)日：2017-02-28

申请号：US13034932

申请日：2011-02-25

申请人： Kang-Wook Lee ,  Jae-Woong Nah ,  Nathalie Normand ,  Valerie Oberson

发明人： Kang-Wook Lee ,  Jae-Woong Nah ,  Nathalie Normand ,  Valerie Oberson

IPC分类号： B23K1/00 ,  B23K35/36 ,  B23K35/362

CPC分类号： B23K1/0016 ,  B23K35/3601 ,  B23K35/362

摘要： The present invention is directed to flux compositions. One composition comprises an activator, a medium-viscosity solvent being a polymer, and a high-viscosity solvent being a copolymer containing first monomers and second monomers. Another composition comprises an activator, and a high-viscosity solvent comprising a copolymer containing first monomers and second monomers. Another composition comprises an activator of 6-12 percent by weight of glutaric acid, pimelic acid, tartaric acid, or mixtures thereof, and a medium-viscosity solvent of 88-94 percent by weight comprising a polymer with hydroxyl end groups. Another composition comprises an activator in a liquid state comprising poly(ethylene glycol)-diacid, and a medium-viscosity solvent comprising a polymer with hydroxyl end groups.

摘要翻译： 本发明涉及助焊剂组合物。 一种组合物包含活化剂，中等粘度溶剂为聚合物，高粘度溶剂为包含第一单体和第二单体的共聚物。 另一组合物包含活化剂和包含含有第一单体和第二单体的共聚物的高粘度溶剂。 另一组合物包含6-12重量％的戊二酸，庚二酸，酒石酸或其混合物的活化剂和88-94重量％的中等粘度溶剂，其包含具有羟基端基的聚合物。 另一种组合物包含液态的活化剂，其包含聚（乙二醇） - 二酸，以及包含具有羟基端基的聚合物的中等粘度溶剂。

公开(公告)号：US08921221B2

公开(公告)日：2014-12-30

申请号：US13164728

申请日：2011-06-20

申请人： Mark H. McLeod ,  Jae-Woong Nah

发明人： Mark H. McLeod ,  Jae-Woong Nah

IPC分类号： H01L21/44 ,  B23K1/20 ,  B23K3/06 ,  H01L23/485

CPC分类号： B23K1/20 ,  B23K3/0638 ,  H01L2224/11

摘要： A photoresist layer is applied over a solder resist layer on a substrate such as a wafer. Openings in the solder resist and photoresist layers are filled with flux-free molten solder using IMS. The process is applicable to fine pitch applications and chip size packaging substrates. A protection layer may be employed to facilitate removal of the photoresist layer from the substrate. An oversized substrate including an adhesive layer on a peripheral area may be employed for providing greater adhesion of a dry film layer to the peripheral area of the substrate than the central portion thereof. The peripheral area is removed following IMS.

摘要翻译： 将抗蚀剂层施加在诸如晶片的衬底上的阻焊层上。 使用IMS将阻焊剂和光致抗蚀剂层中的开口填充无助熔融熔融焊料。 该方法适用于细间距应用和芯片尺寸封装基板。 可以使用保护层以便于从基板去除光致抗蚀剂层。 可以使用包括在周边区域上的粘合剂层的尺寸过大的基材，以提供比其中心部分更大的干膜层对基材周边区域的附着力。 在IMS之后删除外围区域。