公开(公告)号：US4528064A

公开(公告)日：1985-07-09

申请号：US670912

申请日：1984-11-13

申请人： Kenji Ohsawa ,  Takao Ito ,  Masayuki Ohsawa ,  Keiji Kurata

发明人： Kenji Ohsawa ,  Takao Ito ,  Masayuki Ohsawa ,  Keiji Kurata

IPC分类号： H05K1/02 ,  H05K1/14 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46 ,  C23F1/02 ,  B44C1/22 ,  C03C15/00 ,  C03C25/06

CPC分类号： H05K3/4655 ,  H05K3/4038 ,  H05K2201/0195 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/063 ,  H05K2203/0759 ,  H05K2203/1344 ,  H05K3/002 ,  H05K3/3447 ,  H05K3/3463 ,  H05K3/3468 ,  H05K3/3484 ,  H05K3/4076 ,  H05K3/4602 ,  H05K3/4652 ,  Y10T29/49165

摘要： A multilayer circuit board provided with multilayer wiring patterns as upper and lower multilayers is provided, in which on a first circuit board 24 with a first wiring pattern 23 formed thereon a copper foil 27 is bonded through an insulating resin layer 25, the patterning is carried out so as to form a second wiring pattern 33, and the upper and lower patterns 23 and 33 are connected to each other by conductive substance 34 filled within an opening portion 32 of the second wiring pattern 33. In accordance with this multilayer circuit board, the quality thereof is improved, the manufacturing thereof is carried out at low cost, and in addition, it becomes possible to form a circuit of high density integration.

摘要翻译： PCT No.PCT / JP81 / 00371 Sec。 371日期1982年8月5日 102（e）日期1982年8月5日PCT提交1981年12月8日PCT公布。 出版物WO82 / 02138 日期：1982年6月24日。设置有多层布线图案作为上层和下层多层的多层电路板，其中在其上形成有铜箔27的第一布线图案23的第一电路板24上通过绝缘树脂 进行图案化以形成第二布线图案33，并且上图案23和下图案33通过填充在第二布线图案33的开口部分32内的导电物质34彼此连接。 根据该多层电路板，其质量得到改善，其制造成本低廉，并且还可以形成高密度集成电路。

公开(公告)号：US07721422B2

公开(公告)日：2010-05-25

申请号：US11784810

申请日：2007-04-10

申请人： Tomoo Iijima ,  Masayuki Ohsawa

发明人： Tomoo Iijima ,  Masayuki Ohsawa

IPC分类号： H05K3/36

CPC分类号： H05K3/4647 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/06 ,  H05K3/062 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/041 ,  H05K2203/0733 ,  H05K2203/1189 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49137 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

摘要： A method of making a microelectronic assembly includes providing a conductive metal layer having a first surface and a second surface, and etching the first surface of the conductive metal layer to form conductive protrusions, whereby after the etching step, the second surface of the conductive metal layer defines a substantially flat, continuous surface. The method includes juxtaposing a layer of an insulating material with tips of the conductive protrusions, and pressing the conductive protrusions through the layer of an insulating material so that the tips of the conductive protrusions are accessible at a first surface of the layer of an insulating material.

摘要翻译： 制造微电子组件的方法包括提供具有第一表面和第二表面的导电金属层，并且蚀刻导电金属层的第一表面以形成导电突起，由此在蚀刻步骤之后，导电金属的第二表面 层限定基本平坦的连续表面。 该方法包括将绝缘材料层与导电突起的尖端并置，并且通过绝缘材料层压住导电突起，使得导电突起的顶端在绝缘材料层的第一表面可接近 。

公开(公告)号：US07565098B2

公开(公告)日：2009-07-21

申请号：US11673183

申请日：2007-02-09

申请人： Masayuki Ohsawa

发明人： Masayuki Ohsawa

IPC分类号： G03G15/09

CPC分类号： G03G15/0891 ,  G03G15/0877 ,  G03G2215/0819 ,  G03G2215/0827

摘要： A developing device includes a developer carrier opposed to an image carrier for carrying an electrostatic latent image, and a rotatable developer transferring screw for transferring developer to the developer carrier while agitating; the developer carrier includes a magnet roller and a developing sleeve including a rotatable non-electromagnetic cylinder body disposed coaxially with an axis of the magnet roller to contain the magnet roller, and an axis diameter of a center portion of the developer transferring screw is set larger than an axis diameter of each of both end portions of the developer transferring screw.

摘要翻译： 显影装置包括与用于承载静电潜像的图像载体相对的显影剂载体和用于在搅拌下将显影剂转移到显影剂载体的可旋转显影剂转印螺杆; 显影剂载体包括磁性辊和显影套筒，该显影套筒包括与磁辊的轴线同轴地设置以容纳磁性辊的可旋转非电磁圆柱体，并且显影剂转印螺杆的中心部分的轴线直径设定得更大 比显影剂转印螺杆的两端部的轴线直径大。

公开(公告)号：US07096578B2

公开(公告)日：2006-08-29

申请号：US10823611

申请日：2004-04-14

申请人： Tomoo Iijima ,  Masayuki Ohsawa

发明人： Tomoo Iijima ,  Masayuki Ohsawa

IPC分类号： H05K3/36

CPC分类号： H05K3/4647 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/06 ,  H05K3/062 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/041 ,  H05K2203/0733 ,  H05K2203/1189 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49137 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

摘要： A method is provided for manufacturing a multi-layer wiring circuit substrate. A first metal layer is selectively etched in first areas to reduce a thickness of the metal layer in the first areas and to form protrusions in other areas which extend above the etched areas. An interlayer-insulating layer is formed to overlie the etched areas of the first metal layer. The interlayer-insulating layer has an inner surface which confronts the etched first areas and an outer surface remote from the inner surface, such that the protrusions extend through the interlayer-insulating layer and have ends exposed at the outer surface. A second metal layer is then provided in conductive communication with the exposed ends of the protrusions, and the first and second metal layers are selectively patterned from surfaces remote from the interlayer-insulating layer.

摘要翻译： 提供了制造多层布线电路基板的方法。 在第一区域中选择性地蚀刻第一金属层以减少第一区域中的金属层的厚度并且在蚀刻区域上方延伸的其它区域中形成突起。 形成层间绝缘层以覆盖第一金属层的蚀刻区域。 层间绝缘层具有面对被蚀刻的第一区域的内表面和远离内表面的外表面，使得突起延伸穿过层间绝缘层并且具有在外表面露出的端部。 然后提供与突起的暴露端部导电连通的第二金属层，并且从远离层间绝缘层的表面选择性地图案化第一和第二金属层。

公开(公告)号：US20060258139A1

公开(公告)日：2006-11-16

申请号：US11487747

申请日：2006-07-17

申请人： Tomoo Iijima ,  Masayuki Ohsawa

发明人： Tomoo Iijima ,  Masayuki Ohsawa

IPC分类号： H01L21/44

CPC分类号： H05K3/4647 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/06 ,  H05K3/062 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/041 ,  H05K2203/0733 ,  H05K2203/1189 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49137 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

摘要： A method of making a microelectronic element includes making a connection component by providing a metal layer having a top surface and a bottom surface, providing a dielectric layer over the top surface of the metal layer and forming openings in the dielectric layer to expose portions of the top surface of the metal layer. The method includes providing conductive elements atop the dielectric layer, at least some of the conductive elements extending through the openings in the dielectric layer and being in contact with the metal layer, and plating first conductive protrusions atop the at least some of the conductive elements extending through the openings in the dielectric layer, the first conductive protrusions extending away from the metal layer. The method includes selectively removing portions of the metal layer from the bottom surface of the metal layer to form second conductive protrusions that extend away from the first conductive protrusions. At least some of the first and second conductive protrusions are electrically interconnected with one another.

公开(公告)号：US06828221B2

公开(公告)日：2004-12-07

申请号：US10139237

申请日：2002-05-07

申请人： Tomoo Iijima ,  Masayuki Ohsawa

发明人： Tomoo Iijima ,  Masayuki Ohsawa

IPC分类号： H01L2144

CPC分类号： H05K3/4647 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/06 ,  H05K3/062 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/041 ,  H05K2203/0733 ,  H05K2203/1189 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49137 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

摘要： The present invention prepares a member having a conductor-circuit-forming copper foil formed on a protrusion-forming copper layer via an etching-barrier layer formed of a different metal. Etching is selectively performed for the protrusion-forming copper foil by using etchant that does not etch the etching-barrier layer, and protrusions are thereby formed. Then, the etching-barrier layer is removed using etchant that does not etch the copper foil and using the protrusions as masks. An interlayer-insulating layer is formed on a surface of the copper foil, on which the protrusions are formed, so that the protrusions are connected to the conductor circuit. Thereby, heights of the protrusions are uniformed, and the reliability of connections can be improved.

摘要翻译： 本发明通过由不同金属形成的蚀刻阻挡层来制备具有形成在突起形成铜层上的导体电路形成铜箔的部件。 通过使用不蚀刻蚀刻阻挡层的蚀刻剂来选择性地对突起形成铜箔进行蚀刻，从而形成突起。 然后，使用不蚀刻铜箔并使用突起作为掩模的蚀刻剂去除蚀刻阻挡层。 在形成有突起的铜箔的表面上形成层间绝缘层，使得突起与导体电路连接。 由此，突起的高度均匀，可以提高连接的可靠性。

公开(公告)号：US06646337B2

公开(公告)日：2003-11-11

申请号：US10287633

申请日：2002-11-05

申请人： Tomoo Iijima ,  Masayuki Ohsawa

发明人： Tomoo Iijima ,  Masayuki Ohsawa

IPC分类号： H01L2312

CPC分类号： H05K3/4647 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/06 ,  H05K3/062 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/041 ,  H05K2203/0733 ,  H05K2203/1189 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49137 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

摘要： The present invention prepares a member having a potrusion-forming copper foil 21 formed on a conductor-circuit-forming copper layer 23 via an etching-barrier layer 22 formed of a different metal. Etching is selectively performed for the protrusion-forming copper foil 21 by using etchant that does not etch the etching-barrier layer, and protrusions 25 are thereby formed. Then, the etching-barrier layer 22 is removed using etchant that does not etch the copper foil 23 and using the protrusions as masks. An interlayer-insulating layer 27 is formed on a surface of the copper foil 23, on which the protrusions 25 are formed, so that the protrusions are connected to the conductor circuit. Thereby, heights of the protrusions are uniformed, and the reliability of connections can be improved.

摘要翻译： 本发明通过由不同金属形成的蚀刻阻挡层22制备具有形成在导体电路形成铜层23上的形成陶瓷的铜箔21的部件。 通过使用不蚀刻蚀刻阻挡层的蚀刻剂来选择性地对突起形成铜箔21进行蚀刻，从而形成突起25。 然后，使用不蚀刻铜箔23并使用突起作为掩模的蚀刻剂去除蚀刻阻挡层22。 在铜箔23的形成有突起25的表面上形成层间绝缘层27，使得突起与导体电路连接。 由此，突起的高度均匀，可以提高连接的可靠性。

公开(公告)号：US4936693A

公开(公告)日：1990-06-26

申请号：US430108

申请日：1989-11-01

申请人： Masayuki Ohsawa

发明人： Masayuki Ohsawa

IPC分类号： B41J3/01 ,  G06K1/12

CPC分类号： G06K1/121

摘要： A label printing device is disclosed, which comprises a keyboard having a plurality of numeral keys for inputting an article code, a data generator for generating data necessary for the formation of bar code data according to the article code, a printer and a control unit for forming bar code data having an arrangement predetermined by a bar code format read out from the memory according to data from said data generator and causing the printer to print the bar code data on label. In the memory are stored different bar code formats corresponding to a plurality of operation modes including registration and training. The control unit reads out, according to the input article code and the operation mode selected by the operation mode selection unit, a corresponding bar code format from the memory.

摘要翻译： 公开了一种标签打印装置，其包括具有用于输入商品代码的多个数字键的键盘，用于产生根据商品代码形成条形码数据所需的数据的数据发生器，打印机和用于 根据来自所述数据发生器的数据，形成具有从存储器读出的条形码格式预定的布置的条形码数据，并使打印机在标签上打印条形码数据。 在存储器中存储对应于包括注册和训练的多种操作模式的不同条形码格式。 控制单元根据输入的商品代码和由操作模式选择单元选择的操作模式从存储器读出相应的条形码格式。

公开(公告)号：US20070209199A1

公开(公告)日：2007-09-13

申请号：US11784810

申请日：2007-04-10

申请人： Tomoo Iijima ,  Masayuki Ohsawa

发明人： Tomoo Iijima ,  Masayuki Ohsawa

IPC分类号： H05K3/36

CPC分类号： H05K3/4647 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2224/81192 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01067 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K3/06 ,  H05K3/062 ,  H05K3/3457 ,  H05K3/4038 ,  H05K3/4614 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/09563 ,  H05K2203/0369 ,  H05K2203/0384 ,  H05K2203/041 ,  H05K2203/0733 ,  H05K2203/1189 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49137 ,  Y10T29/49155 ,  Y10T29/49204 ,  Y10T29/49222

摘要： A method of making a microelectronic assembly includes providing a conductive metal layer having a first surface and a second surface, and etching the first surface of the conductive metal layer to form conductive protrusions, whereby after the etching step, the second surface of the conductive metal layer defines a substantially flat, continuous surface. The method includes juxtaposing a layer of an insulating material with tips of the conductive protrusions, and pressing the conductive protrusions through the layer of an insulating material so that the tips of the conductive protrusions are accessible at a first surface of the layer of an insulating material. In certain embodiments, the method may include after the pressing step, etching the second surface of the conductive metal layer to form conductive traces that are electrically interconnected with the conductive protrusions. The layer of an insulating material may be heated before the pressing step so as to soften the layer of an insulating material during the pressing step. The layer of an insulating material may be cooled to an ambient temperature after the pressing step. A microelectronic element, such as a semiconductor chip, is electrically interconnected with said conductive protrusions. The microelectronic assembly may also be electrically interconnected with a microelectronic structure having one or more layers, such as a multi-level microelectronic structure.

摘要翻译： 制造微电子组件的方法包括提供具有第一表面和第二表面的导电金属层，并且蚀刻导电金属层的第一表面以形成导电突起，由此在蚀刻步骤之后，导电金属的第二表面 层限定基本平坦的连续表面。 该方法包括将绝缘材料层与导电突起的尖端并置，并且通过绝缘材料层压住导电突起，使得导电突起的顶端在绝缘材料层的第一表面可接近 。 在某些实施例中，该方法可以包括在压制步骤之后，蚀刻导电金属层的第二表面以形成与导电突起电互连的导电迹线。 可以在压制步骤之前加热绝缘材料层，以在压制步骤期间软化绝缘材料层。 在压制步骤之后，可以将绝缘材料层冷却至环境温度。 诸如半导体芯片的微电子元件与所述导电突起电互连。 微电子组件也可以与具有一层或多层的微电子结构电互连，例如多级微电子结构。

公开(公告)号：US20050097727A1

公开(公告)日：2005-05-12

申请号：US10450844

申请日：2002-03-27

申请人： Tomoo Iijima ,  Yoshiro Kato ,  Hiroshi Odaira ,  Masayuki Ohsawa ,  Inetaro Kurosawa ,  Kazuo Sakuma ,  Toshihiko Asano ,  Kimitaka Endo

发明人： Tomoo Iijima ,  Yoshiro Kato ,  Hiroshi Odaira ,  Masayuki Ohsawa ,  Inetaro Kurosawa ,  Kazuo Sakuma ,  Toshihiko Asano ,  Kimitaka Endo

IPC分类号： B24B1/00 ,  B24B7/22 ,  B24B37/04 ,  H05K3/06 ,  H05K3/40 ,  H05K3/46 ,  H01R3/00 ,  B23P19/00

CPC分类号： H05K3/4614 ,  B24B1/00 ,  B24B7/228 ,  B24B37/04 ,  H05K3/06 ,  H05K3/4038 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2203/0143 ,  H05K2203/025 ,  H05K2203/0384 ,  H05K2203/061 ,  Y10T29/5313

摘要： A plurality of multi-layer metal plates (1) each being composed of a bump forming metal layer (2), an etching stop layer (3), and a wiring film forming metal layer (4), and in which a wiring film (4a) is formed from the wiring film forming metal layer and a bump 2a is formed from the bump forming metal layer are prepared, and on a bump forming surface of a multi-layer metal plate, a wiring film of another multi-layer metal plate is overlapped. Such lamination process is repeated in succession for multi-layering. In addition, a polishing machine for multi-layer wiring board (11a) which includes metal plate holding means (13) for holding a metal plate (1a), cutter holding means (25) for holding a cutter (26) above the metal plate, height adjustment mechanism (20) for adjusting the height of the cutter holding means, and cutter parallel moving mechanism (15) for relatively moving the cutter holding means in parallel to the surface of the metal plate is used to conduct polishing.

摘要翻译： 多个多层金属板（1）各自由凸块形成金属层（2），蚀刻停止层（3）和布线膜形成金属层（4）构成，其中布线膜 由凸极形成金属层形成由布线膜形成金属层形成的凸块2a，并且在多层金属板的凸块形成表面上形成另一多层的布线膜 金属板重叠。 这样的层压方法被连续重复进行多层。 另外，包括用于保持金属板（1a）的金属板保持装置（13）的多层布线板（11a）的抛光机，用于将切割器（26）保持在其上方的切割器保持装置（25） 金属板，用于调节刀具保持装置的高度的高度调节机构（20）以及用于使刀具保持装置平行于金属板的表面相对移动的刀具平行移动机构（15）进行抛光。