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51 条记录 (耗时 0.038 秒)

    Method for forming thin film photovoltaic interconnects using self-aligned process
    47.
    发明授权
    Method for forming thin film photovoltaic interconnects using self-aligned process 有权
    使用自对准工艺形成薄膜光伏互连的方法

    公开(公告)号：US07547570B2

    公开(公告)日：2009-06-16

    申请号：US11394721

    申请日：2006-03-31

    申请人： Peter Borden ,  David Eaglesham

    发明人： Peter Borden ,  David Eaglesham

    IPC分类号： H01L21/00

    CPC分类号： H01L31/0322 ,  H01L31/0463 ,  Y02E10/541

    摘要： Processing steps that are useful for forming interconnects in a photovoltaic module are described herein. According to one aspect, a method according to the invention includes processing steps that are similar to those performed in conventional integrated circuit fabrication. For example, the method can include etches to form a conductive step adjacent to the grooves that can be used to form interconnects between cells. According to another aspect the method for forming the conductive step can be self-aligned, such as by positioning a mirror above the module and exposing photoresist from underneath the substrate at an angle one or more times, and etching to expose the conductive step.

    摘要翻译： 本文描述了可用于在光伏模块中形成互连的处理步骤。 根据一个方面，根据本发明的方法包括与常规集成电路制造中执行的步骤相似的处理步骤。 例如，该方法可以包括蚀刻以形成邻近凹槽的导电步骤，其可用于在单元之间形成互连。 根据另一方面，用于形成导电步骤的方法可以是自对准的，例如通过在模块上方定位反射镜并以一个或多个角度从基底下方曝光光致抗蚀剂，以及蚀刻以暴露导电步骤。

    PRECISION PRINTING ELECTROPLATING THROUGH PLATING MASK ON A SOLAR CELL SUBSTRATE
    48.
    发明申请
    PRECISION PRINTING ELECTROPLATING THROUGH PLATING MASK ON A SOLAR CELL SUBSTRATE 失效
    精密印刷通过太阳能电池基板上的电镀掩模进行电镀

    公开(公告)号：US20080132082A1

    公开(公告)日：2008-06-05

    申请号：US11566205

    申请日：2006-12-01

    申请人： Sergey Lopatin ,  John O. Dukovic ,  David Eaglesham ,  Nicolay Y. Kovarsky ,  Robert Bachrach ,  John Busch ,  Charles Gay

    发明人： Sergey Lopatin ,  John O. Dukovic ,  David Eaglesham ,  Nicolay Y. Kovarsky ,  Robert Bachrach ,  John Busch ,  Charles Gay

    IPC分类号： H01L21/469 ,  B05C13/02

    CPC分类号： H01L31/022425 ,  H01L31/02008 ,  Y02E10/50

    摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel electroplating apparatus and method to form a metal contact structure having metal lines formed using an electrochemical plating process. The apparatus and methods described herein remove the need to perform the often costly processing steps of performing a mask preparation and formation steps, such as screen printing, lithographic steps and inkjet printing steps, to form a contact structure. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper. Embodiments of the invention may provide an apparatus and method of forming a solar cell device that utilizes a reusable masking device during one or more electrochemical deposition steps.

    摘要翻译： 本发明的实施例考虑使用新型电镀设备和方法形成低成本太阳能电池，以形成具有使用电化学电镀工艺形成的金属线的金属接触结构。 本文描述的装置和方法不需要执行经常昂贵的处理步骤来执行掩模准备和形成步骤，例如丝网印刷，光刻步骤和喷墨印刷步骤，以形成接触结构。 在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。 因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。 因此，本文描述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。 本发明的实施例可以提供一种形成在一个或多个电化学沉积步骤期间利用可重复使用的掩模装置的太阳能电池装置的装置和方法。

    METHOD OF METALLIZING A SOLAR CELL SUBSTRATE
    49.
    发明申请
    METHOD OF METALLIZING A SOLAR CELL SUBSTRATE 审中-公开
    金属化太阳能电池基板的方法

    公开(公告)号：US20080128019A1

    公开(公告)日：2008-06-05

    申请号：US11566201

    申请日：2006-12-01

    申请人： Sergey LOPATIN ,  Nicolay Y. Kovarsky ,  David Eaglesham ,  John O. Dukovic ,  Charles Gay

    发明人： Sergey LOPATIN ,  Nicolay Y. Kovarsky ,  David Eaglesham ,  John O. Dukovic ,  Charles Gay

    IPC分类号： H01L31/00 ,  C25D5/10 ,  C25D5/12

    CPC分类号： H01L31/022425 ,  C25D5/022 ,  C25D5/10 ,  C25D7/126 ,  Y02E10/50

    摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel high speed electroplating method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.

    摘要翻译： 本发明的实施例考虑使用新颖的高速电镀方法和装置形成低成本太阳能电池，以形成具有使用电化学电镀工艺的选择性形成的金属线的金属接触结构。 本文所述的装置和方法消除了执行一个或多个高温丝网印刷工艺以在太阳能电池基板的表面上形成导电特征的需要。 在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。 因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。 因此，本文描述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。