公开(公告)号：US07750478B2

公开(公告)日：2010-07-06

申请号：US11808667

申请日：2007-06-12

申请人： Koujiro Kameyama ,  Akira Suzuki ,  Yoshio Okayama ,  Mitsuo Umemoto ,  Kenji Takahashi ,  Hiroshi Terao ,  Masataka Hoshino

发明人： Koujiro Kameyama ,  Akira Suzuki ,  Yoshio Okayama ,  Mitsuo Umemoto ,  Kenji Takahashi ,  Hiroshi Terao ,  Masataka Hoshino

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/12 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2224/05599

摘要： A semiconductor device with improved reliability and its manufacturing method is offered. The semiconductor device of this invention includes a semiconductor substrate, a pad electrode formed on the semiconductor substrate through an insulation layer made of silicon oxide, silicon nitride or the like, a supporting plate bonded to a top surface of the semiconductor substrate to cover the pad electrode and a via hole formed in the semiconductor substrate and extending from a back surface of the semiconductor substrate to the pad electrode, wherein an aperture of the via hole at a portion close to the pad electrode is larger than an aperture of the via hole at a portion close to the back surface of the semiconductor substrate.

摘要翻译： 提供了可靠性提高的半导体器件及其制造方法。 本发明的半导体器件包括半导体衬底，通过由氧化硅，氮化硅等形成的绝缘层在半导体衬底上形成的焊盘电极，接合到半导体衬底的顶表面以覆盖衬垫的支撑板 电极和形成在半导体衬底中并从半导体衬底的背表面延伸到焊盘电极的通孔，其中靠近焊盘电极的部分处的通孔的孔径大于通孔的孔径 靠近半导体衬底的背面的部分。

公开(公告)号：US07732925B2

公开(公告)日：2010-06-08

申请号：US11055707

申请日：2005-02-11

申请人： Yoshio Okayama ,  Akira Suzuki ,  Koujiro Kameyama ,  Mitsuo Umemoto ,  Kenji Takahashi ,  Hiroshi Terao ,  Masataka Hoshino

发明人： Yoshio Okayama ,  Akira Suzuki ,  Koujiro Kameyama ,  Mitsuo Umemoto ,  Kenji Takahashi ,  Hiroshi Terao ,  Masataka Hoshino

IPC分类号： H01L29/40

CPC分类号： H01L24/12 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/11 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/0508 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05181 ,  H01L2224/05548 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2224/05599

摘要： A semiconductor device with improved reliability and its manufacturing method is offered. The semiconductor device of this invention includes a semiconductor substrate, a pad electrode formed on the semiconductor substrate through an insulation layer made of silicon oxide, silicon nitride or the like, a supporting plate bonded to a top surface of the semiconductor substrate to cover the pad electrode and a via hole formed in the semiconductor substrate and extending from a back surface of the semiconductor substrate to the pad electrode, wherein an aperture of the via hole at a portion close to the pad electrode is larger than an aperture of the via hole at a portion close to the back surface of the semiconductor substrate.

摘要翻译： 提供了可靠性提高的半导体器件及其制造方法。 本发明的半导体器件包括半导体衬底，通过由氧化硅，氮化硅等形成的绝缘层在半导体衬底上形成的焊盘电极，接合到半导体衬底的顶表面以覆盖衬垫的支撑板 电极和形成在半导体衬底中并从半导体衬底的背表面延伸到焊盘电极的通孔，其中靠近焊盘电极的部分处的通孔的孔径大于通孔的孔径 靠近半导体衬底的背面的部分。

公开(公告)号：US20100127279A1

公开(公告)日：2010-05-27

申请号：US11599404

申请日：2006-11-15

申请人： Kenji Takahashi

发明人： Kenji Takahashi

IPC分类号： H01L27/146

CPC分类号： H01L27/14676 ,  H01L27/14663

摘要： A solid state radiation detector capable of improving the sharpness of obtained radiation images. The solid state radiation detector includes: two scintillator layers that convert irradiated radiation to light; and a solid state photodetector, disposed between the two scintillators, that detects the light converted by the two scintillator layers and converts the detected light to electrical signals. Here, the scattering length of each of the scintillators is not greater than 100 μm for the light propagating in the direction parallel to the surface of the scintillator.

摘要翻译： 一种固态辐射检测器，能够提高所获得的辐射图像的清晰度。 固态放射线检测器包括：将照射的辐射转换成光的两个闪烁体层; 以及设置在两个闪烁器之间的固态光电检测器，其检测由两个闪烁体层转换的光并将检测到的光转换成电信号。 这里，对于在与闪烁体的表面平行的方向上传播的光，每个闪烁体的散射长度不大于100μm。

公开(公告)号：US07719707B2

公开(公告)日：2010-05-18

申请号：US11042071

申请日：2005-01-26

申请人： Nobuo Onuma ,  Masao Kato ,  Yoshiro Udagawa ,  Kenji Takahashi ,  Kenji Kyuma ,  Futoshi Sasaki ,  Ryuichi Kobayashi

发明人： Nobuo Onuma ,  Masao Kato ,  Yoshiro Udagawa ,  Kenji Takahashi ,  Kenji Kyuma ,  Futoshi Sasaki ,  Ryuichi Kobayashi

IPC分类号： G06F3/12

CPC分类号： H04N1/00278 ,  H04N2201/001 ,  H04N2201/0015 ,  H04N2201/0084 ,  H04N2201/33328

摘要： Improvement of printing speed is set out in an image processing apparatus, which is connected communicably with a printing apparatus, for transferring a recorded image to the printing apparatus and having the printing apparatus print the image. To achieve this object, the present invention has the following configuration. Namely, the invention provides an image processing method of an image capturing apparatus, communicably connected with a printing apparatus which prints transmitted image data. The image processing method comprises: a receiving step (step S101, S104) of receiving information regarding a printing condition of the printing apparatus for printing the transmitted image data; a processing step (step S103, S106) of processing image data to be transmitted to the printing apparatus based on the information regarding the printing condition received in the receiving step; and a transmitting step (step S108) of transmitting the image data processed in the processing step to the printing apparatus.

摘要翻译： 在与打印装置可通信地连接的图像处理装置中提出了打印速度的提高，用于将记录图像传送到打印装置并使打印装置打印图像。 为了实现该目的，本发明具有以下结构。 即，本发明提供了一种图像捕获装置的图像处理方法，其与打印发送的图像数据的打印装置通信地连接。 该图像处理方法包括：接收步骤（步骤S101，S104），其接收关于用于打印所发送的图像数据的打印装置的打印条件的信息; 基于在接收步骤中接收的关于打印条件的信息，处理要发送到打印设备的图像数据的处理步骤（步骤S103，S106） 以及将在处理步骤中处理的图像数据发送到打印装置的发送步骤（步骤S108）。

公开(公告)号：US07718922B2

公开(公告)日：2010-05-18

申请号：US11492824

申请日：2006-07-26

申请人： Tomoko Fukunaka ,  Masashi Ishiguro ,  Mamoru Watanabe ,  Kazuhiko Yamashita ,  Masahiro Sato ,  Ryoji Inutsuka ,  Kenji Takahashi ,  Toshikazu Yoneda

发明人： Tomoko Fukunaka ,  Masashi Ishiguro ,  Mamoru Watanabe ,  Kazuhiko Yamashita ,  Masahiro Sato ,  Ryoji Inutsuka ,  Kenji Takahashi ,  Toshikazu Yoneda

IPC分类号： B23K26/08 ,  B23K31/02

CPC分类号： B23K1/0056 ,  B23K31/125

摘要： An optical processing apparatus that is capable of detecting accurately the sticking status of deposits sticking to optical means in a background of same color as deposits, preventing occurrence of defective soldering due to feeding failure of wire solder, and detecting solder failure when the leading end portion of the wire solder does not reach up to the processing area. This optical processing apparatus comprises light energy output means for producing light energy, a first optical path for guiding the light energy into a work, optical means disposed in the first optical path for shaping the light energy, a second optical path sharing part of the first optical path for guiding the light from the work to photo receiving means, and driving means for changing the relative positions of at least the optical means and the work.

摘要翻译： 一种光学处理装置，其能够准确地检测在与沉积物相同颜色的背景下粘附到光学装置的沉积物的粘附状态，防止由于焊丝的供给故障而发生焊接不良，并且当前端部 的焊丝不能达到加工区域。 该光学处理装置包括用于产生光能的光能输出装置，用于将光能引导到工件中的第一光路，设置在用于成形光能的第一光路中的光学装置，第二光路共享第一 用于将光从工件引导到光接收装置的光路，以及用于改变至少光学装置和工件的相对位置的驱动装置。

公开(公告)号：US07588838B2

公开(公告)日：2009-09-15

申请号：US11049639

申请日：2005-02-04

申请人： Hiroshi Fujimoto ,  Tomotake Ikada ,  Kenji Takahashi

发明人： Hiroshi Fujimoto ,  Tomotake Ikada ,  Kenji Takahashi

IPC分类号： H01L51/54 ,  B05D5/12

CPC分类号： C09K11/612 ,  C09K11/574 ,  C09K11/595 ,  C09K11/621 ,  C09K11/642 ,  C09K11/671 ,  C09K11/7718 ,  C09K11/7729 ,  C09K11/773 ,  C09K11/7731 ,  C09K11/7734 ,  C09K11/7747 ,  C09K11/7762 ,  C09K11/7786 ,  C09K11/7789 ,  H05B33/14 ,  Y10S428/917 ,  Y10T428/2991

摘要： Providing a particle distributed electroluminescent device which is improved in luminescent color control, prevention of luminescent color change over time and heavy circuit load, and/or representation of a delicate gradation sequence, as well as capable of providing high brightness and luminous efficiency, and a display unit using such an electroluminescence device. Two types of luminescent particles, each having a dielectric core and a fluorescent coating layer are used as luminescent particles distributed in a luminescent layer of a particle distributed electroluminescence device. The dielectric cores of the two types of luminescent particles are formed of dielectric materials having different dielectric constants with each other.

摘要翻译： 提供一种在发光颜色控制方面得到改进的颗粒分布电致发光器件，防止随着时间的发光颜色变化和重电路负载，和/或精细等级序列的表示，以及能够提供高亮度和发光效率，以及 显示单元。 使用具有电介质芯和荧光涂层的两种发光颗粒作为分布在分布电致发光装置的发光层中的发光粒子。 两种发光粒子的介质芯由具有不同介电常数的介电材料形成。

公开(公告)号：US07532749B2

公开(公告)日：2009-05-12

申请号：US10986893

申请日：2004-11-15

申请人： Mamoru Watanabe ,  Masashi Ishiguro ,  Tomoko Fukunaka ,  Kazuhiko Yamashita ,  Masahiro Sato ,  Manabu Nishihara ,  Kenji Takahashi ,  Shinsuke Shimabayashi

发明人： Mamoru Watanabe ,  Masashi Ishiguro ,  Tomoko Fukunaka ,  Kazuhiko Yamashita ,  Masahiro Sato ,  Manabu Nishihara ,  Kenji Takahashi ,  Shinsuke Shimabayashi

IPC分类号： G06K9/00

CPC分类号： B23K26/032 ,  B23K1/0056 ,  B23K26/03 ,  B23K26/382 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/16 ,  B23K2103/42 ,  B23K2103/50

摘要： Provided is a light processing apparatus which can judge goodness or badness of small amount and various kind processing, and is useful for small amount and various kind processing, and can realize light processing at an appropriate position in conformity with a state of a substrate, at low cost, and can prevent production of a bad item before it happens, and enables local heating by focusing light energy, and is useful for a processing apparatus such as solder joint or heat processing of resin and a production equipment which used this. A state of an object to be processed enters into an image receiving unit, through a first light path and a second light path. This image and an image which was set up in a storage device in advance are compared, and goodness or badness judgment is carried out. There occurs a change of a point to be irradiated, in an approximately horizontal direction to the first light path, between a case that the object to be processed is in a warp age state, and a case that it is not so. The change is read as a change of an image shooting position of reflected light by the image receiving unit. It is possible to realize error stop of processing, by a level of a change amount, and to prevent processing bad item production before it happens.

摘要翻译： 本发明提供一种能够判断少量和不同种类处理的良好或不良的光处理装置，对于少量和各种处理是有用的，并且可以在与基板的状态相适应的适当位置处实现光处理 低成本，可以防止在发生之前产生不良物品，并且通过聚焦光能实现局部加热，并且可用于诸如焊接接头或树脂的热处理的加工设备以及使用它的生产设备。 待处理对象的状态通过第一光路和第二光路进入图像接收单元。 将该图像和预先设置在存储装置中的图像进行比较，并进行良好或不良判断。 在待处理物体处于翘曲状态的情况下，在与第一光路大致水平的方向上发生要照射的点的变化和不那样的情况。 该改变被读取为由图像接收单元改变反射光的图像拍摄位置。 可以通过改变量的水平来实现处理的错误停止，并且防止在发生之前处理不良的产品。

公开(公告)号：US20090065906A1

公开(公告)日：2009-03-12

申请号：US12207288

申请日：2008-09-09

申请人： Kazumasa Tanida ,  Masahiro Sekiguchi ,  Ninao Sato ,  Kenji Takahashi

发明人： Kazumasa Tanida ,  Masahiro Sekiguchi ,  Ninao Sato ,  Kenji Takahashi

IPC分类号： H01L23/52 ,  H01L21/4763

CPC分类号： H01L21/76898 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/94 ,  H01L2224/0401 ,  H01L2224/13022 ,  H01L2224/94 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2224/11

摘要： A semiconductor device includes a semiconductor substrate having a through hole. An active layer is formed on a first surface of the semiconductor substrate. An inner wall surface of the through hole, a bottom surface of the through hole closed by the active layer and a second surface of the semiconductor substrate are covered with an insulating layer. A first opening is formed in the insulating layer which is present on the bottom surface of the through hole. A second opening is formed in the insulating layer which is present on the second surface of the semiconductor substrate. A first wiring layer is formed from within the through hole onto the second surface of the semiconductor substrate. A second wiring layer is formed to connect to the second surface through the second opening.

摘要翻译： 半导体器件包括具有通孔的半导体衬底。 在半导体衬底的第一表面上形成有源层。 通孔的内壁表面，由有源层封闭的通孔的底表面和半导体衬底的第二表面被绝缘层覆盖。 在存在于通孔底面的绝缘层中形成第一开口。 在存在于半导体基板的第二表面上的绝缘层中形成第二开口。 第一布线层由贯通孔形成在半导体基板的第二面上。 第二布线层形成为通过第二开口连接到第二表面。

公开(公告)号：US07453598B2

公开(公告)日：2008-11-18

申请号：US10637881

申请日：2003-08-08

申请人： Kenji Takahashi

发明人： Kenji Takahashi

IPC分类号： H04N1/50 ,  H04N1/58 ,  H04N1/60 ,  G06K9/00

CPC分类号： H04N9/643 ,  H04N1/62 ,  H04N5/2621

摘要： Arbitrary source image data, and destination image data obtained by retouching the source image data are recorded. When the user sets, using an image sensing mode setting unit, an image sensing mode, image reproduction parameters of which are to be changed, and instructs to execute a parameter change process, a parameter determination unit changes the image reproduction parameters using the source and destination image data. The parameter determination unit generates a color conversion list by comparing the two image data, and changes the image reproduction parameters in the image sensing mode set by the image sensing mode setting unit using the color conversion list. In this way, an image can be reproduced using the image reproduction parameters that reflect the contents retouched by the user, and color setups of user's preference can be given to an image to be reproduced.

摘要翻译： 记录任意源图像数据和通过修饰源图像数据获得的目的图像数据。 当用户使用图像感测模式设置单元设置要改变其图像再现参数并指示执行参数改变处理的图像感测模式时，参数确定单元使用源改变图像再现参数，并且 目的地图像数据。 参数确定单元通过比较两个图像数据来生成颜色转换列表，并且使用颜色转换列表改变由图像感测模式设置单元设置的图像感测模式中的图像再现参数。 以这种方式，可以使用反映用户改变的内容的图像再现参数再现图像，并且可以给予要再现的图像的用户偏好的颜色设置。

公开(公告)号：US20080205956A1

公开(公告)日：2008-08-28

申请号：US11793471

申请日：2005-12-20

申请人： Michael Andrew Price ,  Richard Anthony Cudd ,  Kenji Takahashi

发明人： Michael Andrew Price ,  Richard Anthony Cudd ,  Kenji Takahashi

IPC分类号： B41J5/30

CPC分类号： G06F3/1229 ,  G06F3/1204 ,  G06F3/1205 ,  G06F3/1267 ,  G06F3/1285

摘要： A print control device connects via a network to an information processing device that sends an instruction and data thereto. The print control device includes: a receiver for receiving from the information processing device editing information created by an editing application which edits data layout indicating printable data; and a controller for controlling the data layout based on editing information received by the receiver, wherein said data layout is displayed on an operation part of the print control device so that a user of the print control device selects one of the data to be printed by the print control device.

摘要翻译： 打印控制装置经由网络连接到向其发送指令和数据的信息处理装置。 所述打印控制装置包括：接收器，用于从所述信息处理装置接收编辑由编辑应用程序创建的信息，所述编辑应用程序编辑指示可打印数据的数据布局; 以及控制器，用于基于由接收器接收的编辑信息来控制数据布局，其中所述数据布局显示在打印控制装置的操作部分上，使得打印控制装置的用户选择要打印的数据之一 打印控制装置。