公开(公告)号：US5296189A

公开(公告)日：1994-03-22

申请号：US874901

申请日：1992-04-28

申请人： Sung K. Kang ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Subhash L. Shinde

发明人： Sung K. Kang ,  Sampath Purushothaman ,  John J. Ritsko ,  Jane M. Shaw ,  Subhash L. Shinde

IPC分类号： B01F3/18 ,  B22F1/00 ,  B22F9/04 ,  C22C1/10 ,  H05K1/09 ,  B22F7/00

CPC分类号： H05K1/092 ,  B22F9/04 ,  C22C1/1084 ,  B22F2009/043 ,  B22F2999/00

摘要： Methods of fabricating powders of metal particles containing grain growth control additives are described. A powder, metal particles, e.g., copper particles, are mixed with a powder of additive particles, e.g., alumina particles. The mixture is milled in a high energy ball mill to provide metal particles having substantially uniformly distributed therein of additive particles. The ball milled powder contains elongated high aspect ratio particles. The high aspect ratio particles are reduced in size by jet impact milling. The jet impact milled powder can be used to form a conductor forming paste in the fabrication of a metallized ceramic substrate for semiconductor chip packaging application. The jet impact milled powder has particles of sufficiently small in size to fill vias between metallization layers in the green ceramic precursor to the ceramic substrate. During sintering of the combination of ceramic precursor and conductor forming paste, the grain growth control additive results in a substantially void free via filled with metal having a fine grain morphology.

摘要翻译： 描述了制备含有晶粒生长控制添加剂的金属颗粒粉末的方法。 将粉末，金属颗粒（例如铜颗粒）与添加剂颗粒如氧化铝颗粒的粉末混合。 将混合物在高能球磨机中研磨，以提供基本均匀分布有添加剂颗粒的金属颗粒。 球磨粉末含有细长的高纵横比颗粒。 通过喷射冲击研磨，高纵横比颗粒的尺寸减小。 喷射冲击研磨粉末可用于在制造用于半导体芯片封装应用的金属化陶瓷衬底的过程中形成导体形成膏。 喷射冲击研磨的粉末具有足够小的颗粒，以在陶瓷衬底的生坯陶瓷前体中的金属化层之间填充通孔。 在烧结陶瓷前体和导体形成浆料的组合期间，晶粒生长控制添加剂导致填充有具有细晶粒形态的金属的基本上无空隙的通孔。

公开(公告)号：US5292477A

公开(公告)日：1994-03-08

申请号：US965149

申请日：1992-10-22

申请人： Dudley A. Chance ,  David B. Goland ,  Srinivasa S. N. Reddy ,  Subhash L. Shinde ,  Donald R. Wall

发明人： Dudley A. Chance ,  David B. Goland ,  Srinivasa S. N. Reddy ,  Subhash L. Shinde ,  Donald R. Wall

IPC分类号： H01L23/13 ,  C22C1/04 ,  H01L23/12 ,  H01L23/15 ,  H01L23/498 ,  B22F7/00

CPC分类号： C22C1/0466 ,  C22C1/0425 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701

摘要： Methods of fabricating powders of electrically conductive particles supersaturated with grain growth control additives are described. A molten admixture of an electrically conductive material and a grain growth control additive is atomized by spraying an inert atmosphere forming fine molten particles which rapidly cool to form solid particles which are supersaturated with the grain growth control additive. The supersaturated particles are heated to form an electrical conductor having grain sizes less than about 25 microns. The supersaturated particles can be combined with a binder to form an electrical conductor forming paste. Patterns of the paste can be embedded in a green ceramic which can be sintered to form a semiconductor chip packaging substrate having electrical conductors with controlled grain size. During sintering of the combination of ceramic precursor and conductor forming paste, the grain growth control additive results in a substantially void free and crack free via filled with metal having a fine grain morphology.

摘要翻译： 描述了用晶粒生长控制添加剂过饱和的导电颗粒的粉末的制造方法。 导电材料和晶粒生长控制添加剂的熔融混合物通过喷雾形成精细熔融颗粒的惰性气氛而雾化，其迅速冷却以形成与晶粒生长控制添加剂过饱和的固体颗粒。 过饱和颗粒被加热以形成具有小于约25微米的颗粒尺寸的电导体。 过饱和颗粒可与粘合剂组合以形成电导体形成浆料。 糊状物的图案可以嵌入生坯陶瓷中，该陶瓷可以被烧结以形成具有受控晶粒尺寸的电导体的半导体芯片封装基板。 在陶瓷前体和导体形成膏的组合的烧结期间，晶粒生长控制添加剂通过填充有具有细晶粒形态的金属而导致基本上无空隙和无裂纹。