Abstract:
A shielding module is used for shielding an electrical device. In this case, the shielding module includes a heat-dissipating component, a casing and a connection component. The heat-dissipating component has a contacting portion to contact with the electrical device. The electrical device is located in the casing, which has an opening. The heat-dissipating component is disposed in the opening. The connection component and the casing fasten the heat-dissipating component on the electrical device. Furthermore, an electrical apparatus is provided and includes an electrical device, a heat-dissipating component, a casing, and a connection component. In this case, the electrical device is fastened on a circuit board. The heat-dissipating component has a contacting portion adjacent to the electrical device. The electrical device is disposed in the casing, which has an opening. The heat-dissipating component is disposed in the opening. The connection component and the casing fasten the heat-dissipating component on the electrical device.
Abstract:
A thin film transistor array substrate and method for repairing the same are provided. Each pixel unit of the thin film transistor array substrate has a plurality of upper electrodes, which are coupled to a common line to form a plurality of storage capacitors. If a storage capacitor defects, the portion of the pixel electrode corresponding to the defective storage capacitor is electrically isolated from the other portion of the pixel electrode in the pixel unit. Therefore, the other storage capacitors in the pixel unit can normally display. The thin film transistor array substrate and method for repairing the same provided by the present invention repair the defective storage capacitor in the thin film transistor array substrate and improve the manufacturing yield.
Abstract:
A portable computer and a shock absorber assembly thereof. The portable computer includes a body, a hard disc drive, a supporting member, an isolator, a vibration absorber, and a damper. The hard disc drive is disposed in the body. The supporting member is disposed on the hard disc drive. The isolator is disposed on the supporting member. The vibration absorber is disposed on the hard disc drive. The damper is disposed on the vibration absorber. Thus, the hard disc drive is connected to the body via the isolator, and connected to the vibration absorber via the damper. As a result, the vibration of the hard disc drive can be reduced.