公开(公告)号：US20080149373A1

公开(公告)日：2008-06-26

申请号：US12000460

申请日：2007-12-12

申请人： Yong Suk Kim ,  Bu Wan Seo ,  Hoon Hur

发明人： Yong Suk Kim ,  Bu Wan Seo ,  Hoon Hur

IPC分类号： H05K1/03 ,  B60Q1/00 ,  F21V29/00 ,  H05K3/30

CPC分类号： H05K1/021 ,  H01L33/483 ,  H01L33/64 ,  H01L2224/48091 ,  H05K1/056 ,  H05K1/182 ,  H05K3/0047 ,  H05K3/3421 ,  H05K2201/09745 ,  H05K2201/10106 ,  H05K2203/0207 ,  Y10T29/4913 ,  H01L2924/00014

摘要： A printed circuit broad capable of improving reliability, a light emitting apparatus having the same and a manufacturing method thereof are disclosed. The printed circuit board mounted with a light emitting device package includes a first metal layer, an insulating layer disposed on the first metal layer, a second metal layer disposed on the insulating layer, and a mounting groove for mounting the light emitting device package, which has a depth reaching at least an upper surface of the first metal layer.

摘要翻译： 公开了一种能够提高可靠性的印刷电路，具有该印刷电路的发光装置及其制造方法。 安装有发光器件封装的印刷电路板包括第一金属层，设置在第一金属层上的绝缘层，设置在绝缘层上的第二金属层和用于安装发光器件封装的安装槽，其中 具有到达第一金属层的至少上表面的深度。

公开(公告)号：US20080107015A1

公开(公告)日：2008-05-08

申请号：US11723858

申请日：2007-03-22

申请人： Jun Haeng Cho ,  Jun Seo Lee ,  Chang Woo Seo ,  Yong Suk Kim ,  Seung Hwan Oh

发明人： Jun Haeng Cho ,  Jun Seo Lee ,  Chang Woo Seo ,  Yong Suk Kim ,  Seung Hwan Oh

IPC分类号： H04L12/56 ,  H04J1/16

CPC分类号： H04L12/2821 ,  H04L29/12264 ,  H04L29/12839 ,  H04L61/2046 ,  H04L61/6022 ,  H04W8/26

摘要： An apparatus for preventing a device address from conflicting in a WiMedia media access control (MAC), the apparatus including: a device address conflict determination unit which determines whether a conflict between a device address of the apparatus and alien device addresses included in a received alien beacon occurs; a device address generation unit which regenerates the device address of the apparatus when the conflict occurs and a beacon group of the apparatus is not a reference beacon group; a device address information generation unit which generates information about the regenerated device address of the apparatus; and a device information update unit which updates device information of the beacon group of the apparatus, when a beacon including information about a regenerated device address of the apparatus is received from another device included in the beacon group of the apparatus.

摘要翻译： 一种用于防止设备地址在WiMedia媒体访问控制（MAC）中冲突的装置，所述装置包括：设备地址冲突确定单元，其确定所述设备的设备地址与所接收的外来设备中包含的外部设备地址之间的冲突 信标发生; 设备地址生成单元，其在发生冲突时重新生成设备的设备地址，并且设备的信标组不是参考信标组; 设备地址信息生成单元，生成关于所述设备的再生设备地址的信息; 以及设备信息更新单元，当从包括在设备的信标组中的另一设备接收到包括关于设备的再生设备地址的信息的信标时，更新设备的信标组的设备信息。

公开(公告)号：US07203055B2

公开(公告)日：2007-04-10

申请号：US11011092

申请日：2004-12-15

申请人： Hyo Soon Shin ,  Seung Hyun Ra ,  Yong Suk Kim ,  Hyoung Ho Kim ,  Ho Sung Choo ,  Jung Woo Lee

发明人： Hyo Soon Shin ,  Seung Hyun Ra ,  Yong Suk Kim ,  Hyoung Ho Kim ,  Ho Sung Choo ,  Jung Woo Lee

IPC分类号： H01G4/228

CPC分类号： H01G4/30 ,  H01G4/1227 ,  Y10T29/417 ,  Y10T29/43 ,  Y10T29/435

摘要： Disclosed herein is a method of manufacturing a multilayered ceramic capacitor by a spin coating process, and a multilayered ceramic capacitor obtained by the above method. The method of the current invention provides a plurality of dielectric layers formed by spin coating, in which the process of coating the dielectric layer and the process of printing the inner electrode can be provided as a single process. Therefore, the thickness of the dielectric layer is easily controlled while the dielectric layer is formed to be thin. Further, since the dielectric layers and the inner electrodes are formed successively, the processes of separating and layering the dielectric layers, and the process of compressing the ceramic multilayered body can be omitted. Thereby, the ceramic multilayered body need not be compressed, and thus, a pillowing phenomenon does not occur in the multilayered ceramic capacitor.

摘要翻译： 本文公开了通过旋涂工艺制造多层陶瓷电容器的方法和通过上述方法获得的多层陶瓷电容器。 本发明的方法提供了通过旋涂形成的多个电介质层，其中涂覆介电层的过程和印刷内电极的过程可以作为单一工艺提供。 因此，在电介质层形成得较薄的同时容易控制电介质层的厚度。 此外，由于电介质层和内部电极依次形成，所以可以省略介电层的分离和分层工艺以及压缩陶瓷多层体的工艺。 因此，陶瓷多层体不需要被压缩，因此在多层陶瓷电容器中不会发生卷绕现象。

公开(公告)号：US09311874B2

公开(公告)日：2016-04-12

申请号：US13081043

申请日：2011-04-06

申请人： Yong Sung Ahn ,  Jong Soo Lee ,  Yu Na Shin ,  Yong Suk Kim

发明人： Yong Sung Ahn ,  Jong Soo Lee ,  Yu Na Shin ,  Yong Suk Kim

IPC分类号： G09G3/36

CPC分类号： G09G3/3648 ,  G09G2300/0413 ,  G09G2300/0426 ,  G09G2320/0223 ,  G09G2330/02

摘要： A power connection structure of a driver IC chip including a first power terminal unit formed on one side thereof, a second power terminal unit formed on the other side thereof, and a dummy power terminal unit formed between the first power terminal unit and the second power terminal unit. The driver IC chip is mounted to a liquid crystal panel of a liquid crystal display device in a chip-on-glass (COG) type. Both of the first power terminal unit and the dummy power terminal unit and both of the dummy power terminal unit and the second power terminal unit are connected through routing lines in the driver IC chip.

摘要翻译： 驱动器IC芯片的电源连接结构，包括形成在其一侧的第一电力端子单元，形成在其另一侧的第二电力端子单元和形成在第一电力端子单元和第二电力之间的虚拟电源端子单元 终端单元。 驱动IC芯片安装在玻璃（COG）型液晶显示装置的液晶面板上。 第一电源端子单元和虚拟电源端子单元以及虚拟电源端子单元和第二电力端子单元都通过驱动器IC芯片中的布线来连接。

公开(公告)号：US08506106B2

公开(公告)日：2013-08-13

申请号：US12706661

申请日：2010-02-16

申请人： Yong Suk Kim ,  Won Do Kee ,  Chan Sung Jeong ,  Seung Se Kim

发明人： Yong Suk Kim ,  Won Do Kee ,  Chan Sung Jeong ,  Seung Se Kim

IPC分类号： G02F1/13357

CPC分类号： G02B6/0038 ,  G02B6/0031 ,  G02B6/0046 ,  G02B6/0068 ,  G02B6/0073 ,  G02B6/008 ,  G02B6/0088 ,  G02B6/0091 ,  G02F1/1336 ,  G02F1/133603

摘要： A back-light unit including a plurality of substrates, a plurality of light sources respectively disposed on the plurality of substrates and configured to emit light, and N (N≧2) light guide panels respectively disposed adjacent to the plurality of light sources, a corresponding light guide panel including a light incidence part having a light incidence surface for receiving light emitted from a corresponding light source, and a light emission part for emitting the received incident light. Further, the corresponding light guide panel includes protruding surface patterns protruding from an upper surface the light emission part.

摘要翻译： 背光单元，包括多个基板，多个光源分别设置在所述多个基板上并被配置为发光;以及分别设置在所述多个光源附近的N（N> = 2）个导光板， 对应的导光板包括具有用于接收从相应的光源发射的光的光入射表面的光入射部分和用于发射所接收的入射光的发光部分。 此外，对应的导光板包括从发光部的上表面突出的突出面图案。

公开(公告)号：US20120042921A1

公开(公告)日：2012-02-23

申请号：US12926671

申请日：2010-12-02

申请人： Yong Suk Kim ,  Sung Ho Lee ,  Young Soo Oh ,  Tae Kon Koo

发明人： Yong Suk Kim ,  Sung Ho Lee ,  Young Soo Oh ,  Tae Kon Koo

IPC分类号： H01L35/20 ,  H05K13/00 ,  H01L35/22

CPC分类号： H01L35/34 ,  H01L35/08 ,  Y10T29/49002

摘要： The present invention provides a method for manufacturing a thermoelectric module and a thermoelectric module manufactured from the same. The method includes the steps of: forming each of first and second green laminates; forming first and second preliminary electrodes by printing a conductive paste on each of the first and second green laminates; disposing thermoelectric elements on any one of the first and second preliminary electrodes; stacking the first and second green laminates in such a manner that the thermoelectric elements are interposed between the first and second preliminary electrodes; and firing the stacked first and second green sheet laminates, thereby forming the first and second electrodes, and first and second ceramic substrates, and simultaneously bonding the first ceramic substrate to the first electrode, the first and second electrodes to the thermoelectric elements, and the second ceramic substrate to the second electrode.

摘要翻译： 本发明提供一种制造由其制造的热电模块和热电模块的方法。 该方法包括以下步骤：形成第一和第二生坯层压板中的每一个; 通过在所述第一和第二层压板中的每一个上印刷导电浆料来形成第一和第二初级电极; 在所述第一和第二预备电极中的任何一个上设置热电元件; 堆叠第一和第二生坯层压板，使得热电元件插入在第一和第二初级电极之间; 以及烧结堆叠的第一和第二生片层压板，从而形成第一和第二电极以及第一和第二陶瓷衬底，并且同时将第一陶瓷衬底与第一电极，第一和第二电极接合到热电元件，并且 第二陶瓷衬底到第二电极。

公开(公告)号：US20110290293A1

公开(公告)日：2011-12-01

申请号：US12923079

申请日：2010-08-31

申请人： Yong Suk Kim ,  Sung Ho Lee ,  Tae Kon Koo ,  Yong Soo Oh

发明人： Yong Suk Kim ,  Sung Ho Lee ,  Tae Kon Koo ,  Yong Soo Oh

IPC分类号： H01L35/02 ,  H01L35/34 ,  H01L21/02

CPC分类号： H01L35/08

摘要： Disclosed herein is a thermoelectric module. The thermoelectric module includes: first and second substrates that are disposed to be separated from each other, facing each other and includes first and second grooves each formed on inner sides thereof; first and second electrodes that are received in the first and second grooves, respectively; and a thermoelectric device that is interposed between the first and second electrodes and is electrically bonded to the first and second electrodes. As a result, the present invention provide a thermoelectric module and a method for manufacturing the same capable of improving the figure of merit and reliability of the thermoelectric module.

摘要翻译： 这里公开了一种热电模块。 热电模块包括：第一和第二基板，被设置成彼此分离，彼此面对，并且包括各自形成在其内侧的第一和第二槽; 分别容纳在第一和第二凹槽中的第一和第二电极; 以及插入在第一和第二电极之间并且电连接到第一和第二电极的热电装置。 结果，本发明提供一种能够提高热电模块的品质因数和可靠性的热电模块及其制造方法。

公开(公告)号：US08012778B2

公开(公告)日：2011-09-06

申请号：US12259576

申请日：2008-10-28

申请人： Yong Suk Kim ,  Young Soo Oh ,  Hyoung Ho Kim ,  Taek Jung Lee ,  Seog Moon Choi

发明人： Yong Suk Kim ,  Young Soo Oh ,  Hyoung Ho Kim ,  Taek Jung Lee ,  Seog Moon Choi

IPC分类号： H01L21/00

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/16225

摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.

摘要翻译： 本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。 为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。 在LED封装中，准备在底面上具有至少一个沟槽的衬底。 多个电极形成在基板的顶表面上。 此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。 此外，碳纳米管填料填充在基板的槽中。

公开(公告)号：US07733573B2

公开(公告)日：2010-06-08

申请号：US11902779

申请日：2007-09-25

申请人： Yong Suk Kim ,  Hoon Hurh ,  Geun Ho Kim ,  Yu Ho Won

发明人： Yong Suk Kim ,  Hoon Hurh ,  Geun Ho Kim ,  Yu Ho Won

IPC分类号： G02B3/00 ,  G02B7/00 ,  G02B9/00 ,  G02B11/00 ,  G02B13/00 ,  G02B15/00 ,  G02B17/00 ,  G02B25/00

CPC分类号： G02B7/022 ,  H01L33/483 ,  H01L33/54

摘要： A lens and a light emitting device package formed by introducing surface mount technology (SMT) are disclosed. The lens includes a refractive portion which refracts incident light, and at least one surface mount portion, wherein a portion of the surface mount portion is formed in the refractive portion.

摘要翻译： 公开了通过引入表面贴装技术（SMT）形成的透镜和发光器件封装。 透镜包括折射入射光的折射部分和至少一个表面安装部分，其中表面安装部分的一部分形成在折射部分中。

公开(公告)号：US07453093B2

公开(公告)日：2008-11-18

申请号：US11489578

申请日：2006-07-20

申请人： Yong Suk Kim ,  Young Soo Oh ,  Hyoung Ho Kim ,  Taek Jung Lee ,  Seog Moon Choi

发明人： Yong Suk Kim ,  Young Soo Oh ,  Hyoung Ho Kim ,  Taek Jung Lee ,  Seog Moon Choi

IPC分类号： H01L27/15 ,  H01L23/34

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/641 ,  H01L2224/16225

摘要： The invention provides an LED package capable of effectively releasing heat emitted from an LED chip out of the package and a fabrication method thereof. For this purpose, at least one groove is formed on an underside surface of the substrate to package the LED chip and the groove is filled with carbon nanotube material. In the LED package, a substrate having at least one groove on the underside surface is prepared. A plurality of electrodes are formed on a top surface of the substrate. Also, at least the one LED chip is mounted over the substrate to have both terminals electrically connected to the upper electrodes. In addition, carbon nanotube filler is filled in the groove of the substrate.

摘要翻译： 本发明提供一种LED封装，其能够有效地从LED封装中散发从LED芯片发出的热量及其制造方法。 为此，在基板的下侧表面上形成至少一个凹槽以封装LED芯片，并且凹槽填充有碳纳米管材料。 在LED封装中，准备在底面上具有至少一个沟槽的衬底。 多个电极形成在基板的顶表面上。 此外，至少将一个LED芯片安装在基板上，以使两个端子电连接到上电极。 此外，碳纳米管填料填充在基板的槽中。