摘要:
A slapper detonator includes an explosive pellet disposed within a detonator housing and a bridge chip disposed within a pocket defined between a pair of printed circuit boards. One of the printed circuit boards is disposed between the bridge chip and the explosive pellet and includes an opening centered over the bridge element to permit a flyer to accelerate before impacting the explosive pellet. The printed circuit board with the opening also establishes a connection between the bridge contact pads and metalized patterns or pads on the other printed circuit board which are, in turn, connected with metalized patterns or pads on an opposite side of the board. Various input contacts can be attached to the metalized pads, including an adapter board which converts side-by-side pads to concentric pads to permit coaxial connectors to be used. The slapper detonator can be used with a hermetic feed-through assembly having a feed-through housing which connects to a fuze housing in hermetically sealed relation and output contacts which mate in a detachable manner with the input contacts on the slapper detonator to permit removal of the detonator from the fuze electronics for periodic inspection and testing.
摘要:
A method for forming a semiconductor fuse device (23) having a fuse element (20) for an igniter device, comprises the steps of providing a semiconductor substrate (12), forming an insulator layer (14) on the semiconductor substrate, forming a single active layer (16) on the insulator layer, having a predetermined depth (18) of greater than 4 microns and patterning and etching the active layer to form the fuse element (20). Preferably, the forming a single active layer step includes the step of atomic bonding an active layer to the insulator layer.
摘要:
Disclosed is an electroexplosive device including a semiconductor igniter chip with improved crack detection features and which fires in a known location. The chip includes diffused regions so that cracks formed therethrough will result in high leakage currents which are easily detected.
摘要:
An RF-insensitive semiconductor slapper ignitor is created using a siliconubstrate having a first metallized portion centrally located on its bottom face to form a Schottky barrier diode thereon, and a second substantially smaller metallized portion centrally located on its top face to form a consumable plug. A flyer disc is disposed atop the second metallized portion and is propelled when the consumable plug vaporizes in response to the high current density associated with ignition. In various embodiments the flyer disc is either an insulating material such as plastic, or polyimide, or formed integral to a top contact metal layer.
摘要:
An integrated field-effect initiator useful for the pyrotechnic initiation or detonation of explosives includes a semiconductor channel of a first conductivity type bounded on opposite ends by semiconductor material of an opposite conductivity type to define two PN junctions in the conduction path. The semiconductor channel is doped to define a conduction path of sufficiently high impedance to prevent unintended initiation. A gate electrode is positioned adjacent the channel and separated therefrom by an insulation layer to affect the conductivity of the channel as a function of a potential applied to the gate. In normal operation, an initiation electrical potential is applied to the opposite ends of the conduction path and a gate potential is applied to the gate to effect field-enhanced conduction in the path sufficient to allow vaporization of the path to cause initiation of an explosive material in contact with the path. In another embodiment, a slapper structure is mounted adjacent the channel and is propelled into the explosive to effect detonation. The initiator can be manufactured by conventional integrated circuit fabrication techniques and provides a normally inhibited device that requires application of a gate potential prior to initiation.
摘要:
An RF-insensitive semiconductor ignitor and primer cup assembly is createdsing a double polished n-type silicon substrate having its top and bottom surfaces partially metallized to form Schottky barrier diodes. The metallized portion of the back side of the substrate is placed in contact with a conductive surface, and means are provided to electrically isolate those portions of the substrate which have not been metallized from both the metallized portions and the conductive surface. In one embodiment, the isolating means is an integral oxide ring which extends from the periphery of the contact metal to the edge of the substrate. In another embodiment, the means of isolation is a separate plastic ring.
摘要:
In an electric detonator or blasting cap of the type including a base charge of high explosive material, an initiator means or initiator for creating an abrupt eruption in response to application of a selected voltage across the igniter and means for detonating the base charge upon creation of the abrupt eruption of the initiator, there is provided an improvement comprising forming the initiator as a junction of energetic material, such as a PN junction of an LED chip, encapsulated in a plastic or glass confinement housing. The housing has a directional controlling partition means facing in a selected direction. This partition has an effective spacing from the junction substantially less than the remainder of the confinement housing whereby application of a voltage pulse of over about 500 volts causes the junction to form an electric arc to create a plasma by a confined, high temperature, high pressure exothermic reaction. The effective spacing of the aforementioned partition at the junction is thick enough to confine the exothermic reaction until creation of the plastic and thin enough to allow the plasma to rupture the controlled partition and penetrate through the partition a given distance in the selected direction. The base charge is located in the selected direction and spaced from the partition a distance less than the given distance of plasma penetration whereby the plasma impacts against the base charge, thus, detonating the base charge.
摘要:
A non electrically conductive substrate includes both an SCB and a semiconductor switch, the switch being electrically connected to cause the SCB to fire when the switch is triggered.
摘要:
A detonator firing element which includes a miniature energy dissipation device located on a substrate which forms part of an integrated electronic circuit. An explosive or pyrotechnic compound is exposed to the effects of energy dissipated by the device. The device may be resistive, be formed by a semi-conductor device, or be a field effect device. The integrated circuit includes timing, testing, control, communication and interlock circuits to implement stand alone or computer controlled blast systems. Protection against over-voltages and induced currents is provided. Due to the integrated circuit approach power consumption is kept to a minimum and a detonator incorporating the firing element can be powered for a substantial time period by an energy storage device such as a capacitor.
摘要:
A solid state detonator is made using a silicon chip with appropriate surnding sections to provide the resistance path necessary to detonate a primary explosive. The chip is set on a metal-to-glass-to-metal header to provide uniformity of current and insulation capabilities. A gold mesh is used as a conductor connected to a chromium-silicon resistor film. This provides a uniform annular heating ring for detonation purposes. The silicon chip may be doped for high conductivity and low resistance. This arrangement provides fast function with moderate power pulses while the thermal design permits high no-fire current levels.