-
公开(公告)号:US20050151240A1
公开(公告)日:2005-07-14
申请号:US11076938
申请日:2005-03-11
申请人: Eriko Takeda , Atsushi Isobe , Satoshi Tanaka , Hiroshi Okabe
发明人: Eriko Takeda , Atsushi Isobe , Satoshi Tanaka , Hiroshi Okabe
CPC分类号: H01L23/345 , H01L23/3677 , H01L24/73 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2924/15153 , H01L2924/15313 , H01L2924/16251 , H01L2924/19105 , H05K1/0201 , H05K1/0206 , H05K1/0298 , H05K1/0306 , H05K2201/062 , H01L2924/00012
摘要: In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the first chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.
摘要翻译: 在紧凑型射频模块中,第一芯片形成加热元件,第二芯片形成其工作特性随温度变化而变化或其最大工作温度低于第一芯片的最大工作温度的器件。 多层基板具有多个电介质层和多个导体层,并且机械地支撑第一芯片和第二芯片,其中一些导体层与这些芯片电连接。 该模块可以在整个模块中传导第一芯片产生的热量; 将第一芯片产生的热量从模块的顶面引导到其底面; 并且将来自第一芯片的第一导体图案的热传导中断到放置第二芯片的第二导体图案。