公开(公告)号：US08080121B2

公开(公告)日：2011-12-20

申请号：US12309706

申请日：2007-05-21

申请人： Yoshihiro Inao

发明人： Yoshihiro Inao

IPC分类号： B32B37/14 ,  B32B38/10

CPC分类号： C09J5/04 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/10

摘要： An adhesive agent layer for bonding a support plate (1) and a wafer (5) is in a three-layer configuration in which a hard layer (31) is sandwiched between soft layers (32) and (33) from above and below. Both the top and bottom surfaces of the adhesive agent layer are soft adhesive agent layers, which results in an excellent bonding affinity with the wafer 5 and the support plate (1). Accordingly, the peripheral portion of the wafer (5) can be prevented from being lifted before a dicing process. Further, because the sandwiched adhesive agent layer is the hard adhesive agent layer (31), even when the non-adhesive surface of the support plate (1) is vacuum suctioned, or when a pressure is applied from a grinder, the hard adhesive agent layer (31) is not deformed according to the soft adhesive agent layer (33) being drawn or pushed into through holes (2).

摘要翻译： 用于粘合支撑板（1）和晶片（5）的粘合剂层是从上下方向将软质层（32）和（33）夹在其中的硬质层（31）的三层结构。 粘合剂层的顶表面和底表面都是软粘合剂层，这导致与晶片5和支撑板（1）的极好的粘结亲和性。 因此，可以防止晶片（5）的周边部分在切割处理之前被提升。 此外，由于夹层粘合剂层是硬粘合剂层（31），所以即使当支撑板（1）的非粘合表面被真空抽吸时，或者当从研磨机施加压力时，硬粘合剂 层（31）根据软性粘合剂层（33）被拉入或推入通孔（2）而不变形。

公开(公告)号：US20090199957A1

公开(公告)日：2009-08-13

申请号：US12309706

申请日：2007-05-21

申请人： Yoshihiro Inao

发明人： Yoshihiro Inao

IPC分类号： B32B38/00 ,  B32B37/14 ,  B32B38/10

CPC分类号： C09J5/04 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/78 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381 ,  Y10T156/10

摘要： An adhesive agent layer for bonding a support plate (1) and a wafer (5) is in a three-layer configuration in which a hard layer (31) is sandwiched between soft layers (32) and (33) from above and below. Both the top and bottom surfaces of the adhesive agent layer are soft adhesive agent layers, which results in an excellent bonding affinity with the wafer 5 and the support plate (1). Accordingly, the peripheral portion of the wafer (5) can be prevented from being lifted before a dicing process. Further, because the sandwiched adhesive agent layer is the hard adhesive agent layer (31), even when the non-adhesive surface of the support plate (1) is vacuum suctioned, or when a pressure is applied from a grinder, the hard adhesive agent layer (31) is not deformed according to the soft adhesive agent layer (33) being drawn or pushed into through holes (2).

摘要翻译： 用于粘合支撑板（1）和晶片（5）的粘合剂层是从上下方向将软质层（32）和（33）夹在其中的硬质层（31）的三层结构。 粘合剂层的顶表面和底表面都是软粘合剂层，这导致与晶片5和支撑板（1）的极好的粘结亲和性。 因此，可以防止晶片（5）的周边部分在切割处理之前被提升。 此外，由于夹层粘合剂层是硬粘合剂层（31），所以即使当支撑板（1）的非粘合表面被真空抽吸时，或者当从研磨机施加压力时，硬粘合剂 层（31）根据软性粘合剂层（33）被拉入或推入通孔（2）而不变形。