公开(公告)号：US07327027B2

公开(公告)日：2008-02-05

申请号：US11360825

申请日：2006-02-23

申请人： Sabina J. Houle ,  James Christopher Matayabas, Jr.

发明人： Sabina J. Houle ,  James Christopher Matayabas, Jr.

IPC分类号： H01L23/34

CPC分类号： H01L23/3736 ,  H01L2224/13109 ,  H01L2924/00014 ,  H01L2924/01327 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provide composite thermal conduction and circulated liquid cooling. Embodiments are further shown that require simple, low numbers of manufacturing steps and reduced thermal interface thickness.

摘要翻译： 提供了一种用于导热的方法和装置。 描述了一种热界面装置和形成方法，其包括诸如改进的界面强度和改进的界面接触的优点。 示出了提供复合热传导和循环液体冷却的热传导结构的实施例。 进一步示出了实施例，其需要简单，低数量的制造步骤和降低的热界面厚度。