公开(公告)号：US06545346B2

公开(公告)日：2003-04-08

申请号：US09816665

申请日：2001-03-23

申请人： David G. Figueroa ,  Debendra Mallik ,  Jorge Pedro Rodriguez

发明人： David G. Figueroa ,  Debendra Mallik ,  Jorge Pedro Rodriguez

IPC分类号： H01L2302

CPC分类号： H01L23/49822 ,  H01L23/642 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/3011 ,  H01L2224/0401

摘要： An apparatus includes a package having a first surface and a conductive contact exposed at the first surface. A capacitor is inside the package. The capacitor has a first conductive contact exposed at a first surface of the capacitor. The first conductive contact has a first portion spanning a width of the first surface of the capacitor. The first surface of the capacitor is substantially parallel to the first surface of the package. A conductive path connects the first portion of the first conductive contact of the capacitor to the first conductive contact proximate the first surface of the package.

公开(公告)号：US6016852A

公开(公告)日：2000-01-25

申请号：US865551

申请日：1997-05-29

申请人： Debendra Mallik ,  Rudra Kar

发明人： Debendra Mallik ,  Rudra Kar

IPC分类号： H01L21/00 ,  H01L21/48 ,  B21F45/00

CPC分类号： H01L21/67092 ,  H01L21/4842

摘要： An integrated circuit package with a two dimensional array of leads that each have a foot portion which is bent at an angle relative to a vertical column portion of the leads. The foot portion of the leads are typically soldered to the surface pads of a printed circuit board. The leads are formed by a tooling apparatus which has a bending device that bends the foot portions of the leads onto a bending die. The tooling apparatus insures that the foot portions of the leads are all coplanar with the printed circuit board.

摘要翻译： 一种具有二维导线阵列的集成电路封装，每个引脚具有相对于引线的垂直柱部分以一定角度弯曲的脚部分。 引线的脚部通常焊接到印刷电路板的表面焊盘。 引线由具有将引线的脚部弯曲到弯曲模具上的弯曲装置的工具装置形成。 工具设备确保引线的脚部全部与印刷电路板共面。

公开(公告)号：US5777265A

公开(公告)日：1998-07-07

申请号：US861242

申请日：1997-05-21

申请人： Bidyut K. Bhattacharyya ,  Debendra Mallik ,  Ron Vitt ,  David B. Kline

发明人： Bidyut K. Bhattacharyya ,  Debendra Mallik ,  Ron Vitt ,  David B. Kline

IPC分类号： H01L23/495 ,  H01L23/02 ,  H01L23/48 ,  H01L23/52

CPC分类号： H01L24/49 ,  H01L23/49527 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49109 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/30107

摘要： A multi-layer integrated circuit package which contains layers of dielectric that substantially reduce metal migration between the metal conductors of the package. The package has metal baseplates that are separated from a lead frame by a plurality of dielectric tapes. The integrated circuit is mounted to the baseplate which has a plurality of tabs that are connected to the lead frame of the package. The power or ground leads of the package are bonded to the corresponding baseplate through the tabs of the metal plate. The lead frame, metal baseplate and dielectric tapes all have center openings to provide clearance for the integrated circuit. The center opening of the tapes are such that the dielectric material extends beyond the ends of the baseplates and lead frame.

摘要翻译： 一种多层集成电路封装，其包含电介质层，其大大减少了封装金属导体之间的金属迁移。 该封装具有通过多个介质带与引线框架分离的金属基板。 集成电路安装到底板上，该底板具有连接到封装的引线框架的多个突片。 封装的电源或接地引线通过金属板的接头连接到相应的底板上。 引线框架，金属基板和介质带均具有中心开口，为集成电路提供间隙。 带的中心开口使得电介质材料延伸超过底板和引线框架的端部。

公开(公告)号：US5444602A

公开(公告)日：1995-08-22

申请号：US201895

申请日：1994-02-25

申请人： Koushik Banerjee ,  Siva Natarajan ,  Debendra Mallik ,  Praveen Jain

发明人： Koushik Banerjee ,  Siva Natarajan ,  Debendra Mallik ,  Praveen Jain

IPC分类号： H01L23/433 ,  H01L23/495 ,  H05K7/20

CPC分类号： H01L23/49524 ,  H01L23/4334 ,  H01L2924/0002

摘要： An electronic package which has a heat sink that is attached to the lead frame of the package with a material that is both electrically and thermally conductive. The lead frame is also coupled to a first surface of an integrated circuit die with tape automated bonded (TAB) leads. The low thermal resistance of the heat sink increases the thermal performance of the package. The heat sink may also be mounted directly to the die with a conductive material so that the die is electrically grounded to the heat sink. The heat sink is then bonded to the leads of the lead frame that are dedicated to ground. In this embodiment, the heat sink provides the dual functions of a ground plate and a heat spreader.

摘要翻译： 一种电子封装，其具有散热器，该散热器具有导电和导热的材料附接到封装的引线框架。 引线框架还耦合到具有带自动接合（TAB）引线的集成电路管芯的第一表面。 散热片的低热阻增加了封装的热性能。 散热器也可以用导电材料直接安装到管芯上，使得管芯与散热器电接地。 然后将散热器接合到专用于接地的引线框架的引线。 在该实施例中，散热器提供接地板和散热器的双重功能。

公开(公告)号：US5420461A

公开(公告)日：1995-05-30

申请号：US225420

申请日：1994-04-07

申请人： Debendra Mallik ,  Bidyut K. Bhattacharyya

发明人： Debendra Mallik ,  Bidyut K. Bhattacharyya

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/34 ,  H01L23/48 ,  H01L23/02 ,  H01L23/12 ,  H01L29/40

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49861 ,  H05K3/3426 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/10772 ,  H05K2201/10946 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53174

摘要： An integrated circuit device having an array of flexible leads attached to the bottom of an integrated circuit package. There is provided a sheet of electrically conductive material. A plurality of slots are punched into the sheet, such that there is formed a plurality of beams. The beams are then bent into a spring shape. The sheet is placed over an integrated circuit package which has an array of contact pads extending across a bottom surface of the package. The beams are aligned and attached to the contact pads. The beams are then cut and separated from the remainder of the sheet. The sheet is removed, wherein there is constructed an integrated circuit package that has a two dimensional array of flexible leads.

摘要翻译： 一种具有附接到集成电路封装的底部的柔性引线阵列的集成电路器件。 提供了一块导电材料。 多个槽被冲压成片材，使得形成多个梁。 然后将梁弯曲成弹簧形状。 片材放置在集成电路封装上，该集成电路封装具有穿过封装的底表面延伸的接触焊盘阵列。 梁对准并连接到接触垫。 然后将梁切割并与片材的其余部分分离。 去除片材，其中构建了具有柔性引线的二维阵列的集成电路封装。

公开(公告)号：US5210939A

公开(公告)日：1993-05-18

申请号：US870542

申请日：1992-04-17

申请人： Debendra Mallik ,  Bidyut K. Bhattacharyya

发明人： Debendra Mallik ,  Bidyut K. Bhattacharyya

IPC分类号： H01L21/48 ,  H01L21/60 ,  H01L23/498 ,  H05K3/34

CPC分类号： H01L24/81 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49861 ,  H05K3/3426 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K2201/10772 ,  H05K2201/10946 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/53174

摘要： A method for attaching an array of flexible leads to the bottom of an integrated circuit package. There is provided a sheet of electrically conductive material. A plurality of slots are punched into the sheet, such that there is formed a plurality of beams. The beams are then bent into a spring shape. The sheet is placed over an integrated circuit package which has an array of contact pads extending across a bottom surface of the package. The beams are aligned and attached to the contact pads. The beams are then cut and separated from the remainder of the sheet. The sheet is removed, wherein there is constructed an integrated circuit package that has a two dimensional array of flexible leads.

摘要翻译： 一种用于将柔性引线阵列附接到集成电路封装的底部的方法。 提供了一块导电材料。 多个槽被冲压成片材，使得形成多个梁。 然后将梁弯曲成弹簧形状。 片材放置在集成电路封装上，该集成电路封装具有穿过封装的底表面延伸的接触焊盘阵列。 梁对准并连接到接触垫。 然后将梁切割并与片材的其余部分分离。 去除片材，其中构建了具有柔性引线的二维阵列的集成电路封装。

公开(公告)号：US09570883B2

公开(公告)日：2017-02-14

申请号：US13976419

申请日：2011-12-28

申请人： Edward A. Zarbock ,  Debendra Mallik

发明人： Edward A. Zarbock ,  Debendra Mallik

IPC分类号： G02B6/00 ,  G02B27/00 ,  H01S5/00 ,  H01L25/16 ,  G02B6/42

CPC分类号： G02B6/4214 ,  G02B6/4206 ,  G02B6/4238 ,  G02B6/4249 ,  G02B6/4269 ,  G02B6/4274 ,  H01L25/167 ,  H01L2924/0002 ,  H01S5/0071 ,  H01S5/021 ,  H01S5/0224 ,  H01S5/02248 ,  H01S5/02469 ,  H01S5/0261 ,  H01L2924/00

摘要： A photonic package includes a photonic device having a photon emitter on the front side of the die. A beam of photons from the photon emitter passing from the front side to the backside of the die, passes through the substrate material of the die which is substantially transparent to the beam of photons, to the backside of the die. Other embodiments are also described.

摘要翻译： 光子封装包括在裸片前侧具有光子发射器的光子器件。 来自光子发射器的光束从模具的前侧延伸到背面，穿过基本上对于光子束透明的管芯的衬底材料到管芯的背面。 还描述了其它实施例。

公开(公告)号：US09478476B2

公开(公告)日：2016-10-25

申请号：US13976098

申请日：2011-12-16

申请人： Debendra Mallik ,  Sridhar Narasimhan ,  Mathew J. Manusharow ,  Thomas A. Boyd

发明人： Debendra Mallik ,  Sridhar Narasimhan ,  Mathew J. Manusharow ,  Thomas A. Boyd

IPC分类号： H01L23/48 ,  H01L23/34 ,  H01L23/36 ,  H01L21/50 ,  H01L23/367 ,  H01L23/42 ,  H01L23/498 ,  H01L25/065

CPC分类号： H01L23/34 ,  H01L21/50 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/42 ,  H01L23/49833 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/01327 ,  H01L2924/00

摘要： A package for a microelectronic die (110) includes a first substrate (120) adjacent to a first surface (112) of the die, a second substrate (130) adjacent to the first substrate, and a heat spreader (140) adjacent to a second surface (111) of the die. The heat spreader makes contact with both the first substrate and the second substrate.

摘要翻译： 用于微电子管芯（110）的封装包括邻近管芯的第一表面（112）的第一衬底（120），与第一衬底相邻的第二衬底（130）和邻近第一衬底的散热器 模具的第二表面（111）。 散热器与第一基板和第二基板接触。

公开(公告)号：US09355242B2

公开(公告)日：2016-05-31

申请号：US13717433

申请日：2012-12-17

申请人： Sasikanth Manipatruni ,  Kelin J. Kuhn ,  Debendra Mallik ,  John C. Johnson

发明人： Sasikanth Manipatruni ,  Kelin J. Kuhn ,  Debendra Mallik ,  John C. Johnson

IPC分类号： G06F21/44 ,  G06F21/10 ,  G06F21/35

CPC分类号： G06F21/44 ,  G06F21/10 ,  G06F21/35

摘要： Managing and accessing personal data is described. In one example, an apparatus has an application processor, a memory to store data, a receive and a transmit array coupled to the application processor to receive data to store in the memory and to transmit data stored in the memory through a wireless interface, and an inertial sensor to receive user commands to authorize the processor to receive and transmit data through the receive and transmit array.

摘要翻译： 描述管理和访问个人数据。 在一个示例中，设备具有应用处理器，用于存储数据的存储器，耦合到应用处理器的接收和发送阵列，以接收存储在存储器中的数据并通过无线接口传输存储在存储器中的数据，以及 惯性传感器，用于接收用户命令，以授权处理器通过接收和发送阵列接收和发送数据。

公开(公告)号：US09210809B2

公开(公告)日：2015-12-08

申请号：US14097932

申请日：2013-12-05

申请人： Debendra Mallik ,  Mihir Roy

发明人： Debendra Mallik ,  Mihir Roy

IPC分类号： H01L23/52 ,  H01L23/48 ,  H05K1/11 ,  H01L21/48 ,  H01L23/498

CPC分类号： H01L23/49827 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L2224/16225 ,  H05K1/113 ,  H05K1/115

摘要： Embodiments are directed to semiconductor packaging having reduced sized plated through hole (PTH) pads by eliminating the margin of the pad-to-PTH alignment and enabling finer traces on the core of the substrate.

摘要翻译： 实施例涉及具有减小尺寸的电镀通孔（PTH）焊盘的半导体封装，通过消除焊盘到PTH对准的边缘并且使得能够在衬底的芯上更细的迹线。