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251 条记录 (耗时 0.029 秒)

    Decreasing the etch rate of silicon nitride by carbon addition
    52.
    发明申请
    Decreasing the etch rate of silicon nitride by carbon addition 有权
    通过碳添加降低氮化硅的蚀刻速率

    公开(公告)号：US20080014761A1

    公开(公告)日：2008-01-17

    申请号：US11478273

    申请日：2006-06-29

    申请人： Ritwik Bhatia ,  Li-Qun Xia ,  Chad Peterson ,  Hichem M'Saad

    发明人： Ritwik Bhatia ,  Li-Qun Xia ,  Chad Peterson ,  Hichem M'Saad

    IPC分类号： H01L21/31 ,  H01L21/469

    CPC分类号： H01L21/0332 ,  H01L21/3105 ,  H01L21/31111 ,  H01L21/31116 ,  H01L21/3185 ,  H01L21/76825 ,  H01L21/76829

    摘要： Methods for forming silicon nitride hard masks are provided. The silicon nitride hard masks include carbon-doped silicon nitride layers and undoped silicon nitride layers. Carbon-doped silicon nitride layers that are deposited from a mixture comprising a carbon source compound, a silicon source compound, and a nitrogen source in the presence of RF power are provided. Also provided are methods of UV post-treating silicon nitride layers to provide silicon nitride hard masks. The carbon-doped silicon nitride layers and UV post-treated silicon nitride layers have desirable wet etch rates and dry etch rates for hard mask layers.

    摘要翻译： 提供了形成氮化硅硬掩模的方法。 氮化硅硬掩模包括碳掺杂的氮化硅层和未掺杂的氮化硅层。 提供了在RF功率存在下从包含碳源化合物，硅源化合物和氮源的混合物沉积的碳掺杂氮化硅层。 还提供了UV后处理氮化硅层以提供氮化硅硬掩模的方法。 碳掺杂的氮化硅层和UV后处理的氮化硅层对于硬掩模层具有期望的湿蚀刻速率和干蚀刻速率。

    Oxide-like seasoning for dielectric low k films
    54.
    发明授权
    Oxide-like seasoning for dielectric low k films 有权
    电介质低k薄膜的氧化物调味料

    公开(公告)号：US07115508B2

    公开(公告)日：2006-10-03

    申请号：US10816606

    申请日：2004-04-02

    申请人： Sohyun Park ,  Wen H. Zhu ,  Tzu-Fang Huang ,  Li-Qun Xia ,  Hichem M'Saad

    发明人： Sohyun Park ,  Wen H. Zhu ,  Tzu-Fang Huang ,  Li-Qun Xia ,  Hichem M'Saad

    IPC分类号： H01L21/44 ,  H01L21/31

    CPC分类号： H01L21/02126 ,  C23C16/4404 ,  H01L21/02211 ,  H01L21/02274 ,  H01L21/31633 ,  H01L21/76829 ,  Y10S438/913

    摘要： A method for seasoning a chamber and depositing a low dielectric constant layer on a substrate in the chamber is provided. In one aspect, the method includes seasoning the chamber with a first mixture comprising one or more organosilicon compounds and one or more oxidizing gases and depositing a low dielectric constant layer on a substrate in the chamber from a second mixture comprising one or more organosilicon compounds and one or more oxidizing gases, wherein a ratio of the total flow rate of the organosilicon compounds to the total flow rate of the oxidizing gases in the first mixture is lower than the total flow rate of the organosilicon compounds to the total flow rate of the oxidizing gases in the second mixture.

    摘要翻译： 提供了调节室的方法和在室中的基板上沉积低介电常数层。 在一个方面，所述方法包括用包含一种或多种有机硅化合物和一种或多种氧化性气体的第一混合物来调节室，并且从室内的衬底上沉积低介电常数层，所述第二混合物包含一种或多种有机硅化合物和 一种或多种氧化性气体，其中有机硅化合物的总流量与第一混合物中的氧化气体的总流量的比率低于有机硅化合物的总流量与氧化物的总流量的比率 第二混合物中的气体。

    Method of depositing boron nitride and boron nitride-derived materials
    55.
    发明授权
    Method of depositing boron nitride and boron nitride-derived materials 有权
    沉积氮化硼和氮化硼衍生材料的方法

    公开(公告)号：US08084105B2

    公开(公告)日：2011-12-27

    申请号：US11765257

    申请日：2007-06-19

    申请人： Jeong-Uk Huh ,  Mihaela Balseanu ,  Li-Qun Xia ,  Victor T. Nguyen ,  Derek R. Witty ,  Hichem M'Saad

    发明人： Jeong-Uk Huh ,  Mihaela Balseanu ,  Li-Qun Xia ,  Victor T. Nguyen ,  Derek R. Witty ,  Hichem M'Saad

    IPC分类号： H05H1/24

    CPC分类号： C23C16/342 ,  C23C16/45523

    摘要： Methods for forming boron-containing films are provided. The methods include introducing a boron-containing precursor and a nitrogen or oxygen-containing precursor into a chamber and forming a boron nitride or boron oxide film on a substrate in the chamber. In one aspect, the method includes depositing a boron-containing film and then exposing the boron-containing film to the nitrogen-containing or oxygen-containing precursor to incorporate nitrogen or oxygen into the film. The deposition of the boron-containing film and exposure of the film to the precursor may be performed for multiple cycles to obtain a desired thickness of the film. In another aspect, the method includes reacting the boron-containing precursor and the nitrogen-containing or oxygen-containing precursor to chemically vapor deposit the boron nitride or boron oxide film.

    摘要翻译： 提供了形成含硼膜的方法。 所述方法包括将含硼前体和含氮或含氧前体引入室中，并在室中的基底上形成氮化硼或氧化硼膜。 一方面，该方法包括沉积含硼膜，然后将含硼膜暴露于含氮或含氧前体以将氮或氧引入膜中。 含硼膜的沉积和膜暴露于前体可以进行多个循环以获得所需的膜厚度。 另一方面，该方法包括使含硼前体和含氮或含氧前体反应以化学气相沉积氮化硼或氧化硼膜。

    DECREASING THE ETCH RATE OF SILICON NITRIDE BY CARBON ADDITION
    57.
    发明申请
    DECREASING THE ETCH RATE OF SILICON NITRIDE BY CARBON ADDITION 有权
    通过碳添加降低硅氮的含量

    公开(公告)号：US20090137132A1

    公开(公告)日：2009-05-28

    申请号：US12365669

    申请日：2009-02-04

    申请人： Ritwik Bhatia ,  Li-Qun Xia ,  Chad Peterson ,  Hichem M'Saad

    发明人： Ritwik Bhatia ,  Li-Qun Xia ,  Chad Peterson ,  Hichem M'Saad

    IPC分类号： H01L21/31

    CPC分类号： H01L21/0332 ,  H01L21/3105 ,  H01L21/31111 ,  H01L21/31116 ,  H01L21/3185 ,  H01L21/76825 ,  H01L21/76829

    摘要： Methods for forming silicon nitride hard masks are provided. The silicon nitride hard masks include carbon-doped silicon nitride layers and undoped silicon nitride layers. Carbon-doped silicon nitride layers that are deposited from a mixture comprising a carbon source compound, a silicon source compound, and a nitrogen source in the presence of RF power are provided. Also provided are methods of UV post-treating silicon nitride layers to provide silicon nitride hard masks. The carbon-doped silicon nitride layers and UV post-treated silicon nitride layers have desirable wet etch rates and dry etch rates for hard mask layers.

    摘要翻译： 提供了形成氮化硅硬掩模的方法。 氮化硅硬掩模包括碳掺杂的氮化硅层和未掺杂的氮化硅层。 提供了在RF功率存在下由包含碳源化合物，硅源化合物和氮源的混合物沉积的碳掺杂氮化硅层。 还提供了UV后处理氮化硅层以提供氮化硅硬掩模的方法。 碳掺杂的氮化硅层和UV后处理的氮化硅层对于硬掩模层具有期望的湿蚀刻速率和干蚀刻速率。

    Oxide-like seasoning for dielectric low k films
    58.
    发明申请
    Oxide-like seasoning for dielectric low k films 有权
    电介质低k薄膜的氧化物调味料

    公开(公告)号：US20050227499A1

    公开(公告)日：2005-10-13

    申请号：US10816606

    申请日：2004-04-02

    申请人： Sohyun Park ,  Wen Zhu ,  Tzu-Fang Huang ,  Li-Qun Xia ,  Hichem M'Saad

    发明人： Sohyun Park ,  Wen Zhu ,  Tzu-Fang Huang ,  Li-Qun Xia ,  Hichem M'Saad

    IPC分类号： C23C16/44 ,  H01L21/316 ,  H01L21/469 ,  H01L21/768

    CPC分类号： H01L21/02126 ,  C23C16/4404 ,  H01L21/02211 ,  H01L21/02274 ,  H01L21/31633 ,  H01L21/76829 ,  Y10S438/913

    摘要： A method for seasoning a chamber and depositing a low dielectric constant layer on a substrate in the chamber is provided. In one aspect, the method includes seasoning the chamber with a first mixture comprising one or more organosilicon compounds and one or more oxidizing gases and depositing a low dielectric constant layer on a substrate in the chamber from a second mixture comprising one or more organosilicon compounds and one or more oxidizing gases, wherein a ratio of the total flow rate of the organosilicon compounds to the total flow rate of the oxidizing gases in the first mixture is lower than the total flow rate of the organosilicon compounds to the total flow rate of the oxidizing gases in the second mixture.

    摘要翻译： 提供了调节室的方法和在室中的基板上沉积低介电常数层。 在一个方面，所述方法包括用包含一种或多种有机硅化合物和一种或多种氧化性气体的第一混合物来调节室，并且从室内的衬底上沉积低介电常数层，所述第二混合物包含一种或多种有机硅化合物和 一种或多种氧化性气体，其中有机硅化合物的总流量与第一混合物中的氧化气体的总流量的比率低于有机硅化合物的总流量与氧化物的总流量的比率 第二混合物中的气体。

    Selective copper-silicon-nitride layer formation for an improved dielectric film/copper line interface
    59.
    发明授权
    Selective copper-silicon-nitride layer formation for an improved dielectric film/copper line interface 有权
    用于改进的介电膜/铜线接口的选择性铜 - 氮化硅层形成

    公开(公告)号：US07718548B2

    公开(公告)日：2010-05-18

    申请号：US11950691

    申请日：2007-12-05

    申请人： Sang M. Lee ,  Vladimir Zubkov ,  Zhenijiang Cui ,  Meiyee Shek ,  Li-Qun Xia ,  Hichem M'Saad

    发明人： Sang M. Lee ,  Vladimir Zubkov ,  Zhenijiang Cui ,  Meiyee Shek ,  Li-Qun Xia ,  Hichem M'Saad

    IPC分类号： H01L21/469

    CPC分类号： H01L21/76856 ,  H01L21/76826 ,  H01L21/76849 ,  H01L21/76864 ,  H01L21/76867

    摘要： A process to form a copper-silicon-nitride layer on a copper surface on a semiconductor wafer is described. The process may include the step of exposing the wafer to a first plasma made from helium. The process may also include exposing the wafer to a second plasma made from a reducing gas, where the second plasma removes copper oxide from the copper surface, and exposing the wafer to silane, where the silane reacts with the copper surface to selectively form copper silicide. The process may further include exposing the wafer to a third plasma made from ammonia and molecular nitrogen to form the copper silicon nitride layer.

    摘要翻译： 描述了在半导体晶片上的铜表面上形成铜 - 氮化硅层的工艺。 该方法可以包括将晶片暴露于由氦制成的第一等离子体的步骤。 该方法还可以包括将晶片暴露于由还原气体制成的第二等离子体，其中第二等离子体从铜表面去除氧化铜，并将晶片暴露于硅烷，硅烷与铜表面反应以选择性地形成硅化铜 。 该方法还可以包括将晶片暴露于由氨和分子氮制成的第三等离子体，以形成铜氮化硅层。