摘要:
A method for producing a semiconductor device includes steps of: a) a positioning board forming process in which concave portions, each of which is located at a position corresponding to a position of a respective projecting electrode of a semiconductor device, and first positioning portions, which are used for determining a position of a sealing resin with respect to the projecting electrode, are integrally formed on a flat-plate member so as to form a positioning board; b) a filling process in which an electrode material for forming the projecting electrode is filled in the concave portions formed on the positioning board; c) a bonding process in which a composite board is formed by mounting a circuit board on the positioning board so as to bond each of the electrode material filled in the concave portions to the circuit board; d) a sealing resin forming process in which a mold having a cavity for forming a sealing resin and second positioning portions for determining a position of the positioning board with respect to the cavity is fixed to the composite board in a state that the position of the positioning board is determined with respect to the cavity by engaging the first positioning portions with the respective second positioning portions, and resin is filled in the cavity so as to form the sealing resin, and e) a positioning board removing process in which the positioning board is removed.
摘要:
A semiconductor device comprises a plurality of leads respectively made up of an inner lead and an outer lead, a semiconductor chip electrically connected to the inner leads of the leads, and a package encapsulating at least the inner leads of the leads and the semiconductor chip so that the outer leads extend outwardly of the package. The package has an upper part and a lower part which have mutually different sizes such that a stepped part is formed between the upper and lower parts by the different sizes, and each of the outer leads have a wide part which is wider than other parts of the outer lead extending outwardly of the package only within the stepped part of the package.
摘要:
A semiconductor device including a substrate, solder bumps provided on a lower major surface of the substrate, a semiconductor chip provided on an upper major surface of the substrate, a resin package body provided on the upper major surface of the substrate so as to bury the semiconductor chip therein, a thermally conductive frame member having a flange part supporting the substrate at a rim part of the substrate, wherein the thermal conductive frame member has a thermal conductivity substantially larger than that of the resin package body and extending along to and in an intimate contact with side walls of the resin package body.
摘要:
A semiconductor process includes a stage, a semiconductor chip which is mounted on the stage, a plurality of electrode members which are wire bonded to the semiconductor chip, where a first gap is formed between the stage and one electrode member and a second gap is formed between two electrode members, a plurality of leads including inner leads which are wire bonded to at least one of the semiconductor chip and the electrode members and electrically connected thereto, and a resin package which encapsulates the semiconductor chip, the stage, the electrode members and the inner leads by a resin. The resin fills the first and second gaps, so that the stage and the one electrode member are isolated and the two electrode members are isolated.
摘要:
A semiconductor device includes a stage, a semiconductor chip which is mounted on the stage, a plurality of electrode members which are wire bonded to the semiconductor chip, where a first gap is formed between the stage and one electrode member and a second gap is formed between two electrode members, a plurality of leads including inner leads which are wire bonded to at least one of the semiconductor chip and the electrode members and electrically connected thereto, and a resin package which encapsulates the semiconductor chip, the stage, the electrode members and the inner leads by a resin. The resin fills the first and second gaps, so that the stage and the one electrode member are isolated and the two electrode members are isolated.
摘要:
A method of design of a circuit board enabling high density conductor lines to be drawn efficiently. A rats nest is formed by connecting pads to which terminals of an electronic device are connected and external connection terminals by lines. A region with the highest density of lines of the rats nest is then selected and design rules relating to routes and dimensions of conductor lines are set in the region with the highest density of lines of the rats nest. Conductor lines are then laid at the region with the highest density of lines of the rats nest, and whether or not the conductor lines can be laid at the region with the highest density of lines of the rats nest is confirmed. Setting of the design rules and laying of conductor lines are if the conductor lines cannot be laid, and the conductor lines of the remaining regions are laid by the set design rules if the conductor lines can be laid.
摘要:
The present invention provides an advantageous method for producing an intermediate which is useful for production of a compound which exhibits excellent VLA-4 inhibitory effect and safety. An intermediate (14) is produced through the following reaction scheme.
摘要:
A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located in predetermined positions of the redistribution layer. Metal posts configured to be provided with external connection electrodes are formed on the electrode pads of the redistribution layer. A mark member made of the same material as the metal posts is formed on the redistribution layer. The mark member serves as an alignment mark located in a predetermined positional relationship with the metal posts.
摘要:
A semiconductor device substrate has fine terminals with a small pitch and is able to be easily produced at a low cost without using a special process. A mounting terminal has a pyramidal shape and extending between a front surface and a back surface of a silicon substrate. An end of the mounting terminal protrudes from the back surface of the silicon substrate. A wiring layer is formed on the front surface of the silicon substrate. The wiring layer includes a conductive layer that is electrically connected to the mounting terminal.
摘要:
A semiconductor device substrate has fine terminals with a small pitch and is able to be easily produced at a low cost without using a special process. A mounting terminal has a pyramidal shape and extending between a front surface and a back surface of a silicon substrate. An end of the mounting terminal protrudes from the back surface of the silicon substrate. A wiring layer is formed on the front surface of the silicon substrate. The wiring layer includes a conductive layer that is electrically connected to the mounting terminal.