公开(公告)号：US11440322B2

公开(公告)日：2022-09-13

申请号：US17206816

申请日：2021-03-19

Applicant: Microjet Technology Co., Ltd.

Inventor： Hao-Jan Mou ,  Rong-Ho Yu ,  Cheng-Ming Chang ,  Hsien-Chung Tai ,  Wen-Hsiung Liao ,  Chi-Feng Huang ,  Yung-Lung Han

IPC: B41J2/14

Abstract: A narrow type inkjet print head chip is disclosed and includes a silicon substrate, an active component layer and a passive component layer. The active component layer is stacked on the silicon substrate and includes plural ESD protection units, plural encoder switches, plural discharge protection units and plural heater switches. The ESD protection units, the encoder switches, the discharge protection units and the heater switches are disposed in each of at least two high-precision regions of the active component layer. The corresponding positions and quantities of these components are the same in the at least two high-precision regions. The passive component layer is stacked on the active component layer and includes plural heaters, plural electrode pads, plural encoders and plural circuit traces. The circuit traces are electrically connected to the ESD protection units, the encoder switches, the heater switches, the heaters, the electrode pads and the encoders.

公开(公告)号：US20220219454A1

公开(公告)日：2022-07-14

申请号：US17528524

申请日：2021-11-17

Applicant: Microjet Technology Co., Ltd.

Inventor： Hao-Jan Mou ,  Ying-Lun Chang ,  Hsien-Chung Tai ,  Yung-Lung Han ,  Chi-Feng Huang ,  Chun-Yi Kuo

IPC: B41J2/14 ,  B41J2/155

Abstract: A wafer structure is disclosed and includes a chip substrate and a plurality of inkjet chips. The chip substrate is a silicon substrate fabricated by a semiconductor process on a wafer of at least 12 inches. The inkjet chips include at least one first inkjet chip and at least one second inkjet chip directly formed on the chip substrate by the semiconductor process, respectively, and the plurality of inkjet chips are diced into the at least one first inkjet chip and the at least one second inkjet chip for inkjet printing. Each of the first inkjet chip and the second inkjet chip includes a plurality of ink-drop generators produced by a semiconductor process and formed on the chip substrate. Each of the ink-drop generators includes a thermal-barrier layer, a resistance heating layer, a conductive layer, a protective layer, a barrier layer, an ink-supply chamber and a nozzle.

公开(公告)号：US20220134748A1

公开(公告)日：2022-05-05

申请号：US17116340

申请日：2020-12-09

Applicant: Microjet Technology Co., Ltd.

Inventor： Hao-Jan Mou ,  Ying-Lun Chang ,  Hsien-Chung Tai ,  Chi-Feng Huang ,  Yung-Lung Han ,  Wei-Ming Lee

IPC: B41J2/14 ,  B41J2/16

Abstract: A wafer structure is disclosed and includes a chip substrate and at least one inkjet chip. The chip substrate is a silicon substrate which is fabricated by a semiconductor process on a wafer of at least 12 inches. The at least one inkjet chip is directly formed on the chip substrate by the semiconductor process, and the wafer is diced into the at least one inkjet chip, to be implemented for inkjet printing.

公开(公告)号：US11085554B2

公开(公告)日：2021-08-10

申请号：US16740839

申请日：2020-01-13

Applicant: Microjet Technology Co., Ltd.

Inventor： Hao-Jan Mou ,  Rong-Ho Yu ,  Cheng-Ming Chang ,  Hsien-Chung Tai ,  Wen-Hsiung Liao ,  Chi-Feng Huang ,  Yung-Lung Han ,  Hsuan-Kai Chen

IPC: F16K99/00 ,  B81C1/00

Abstract: A micro fluid actuator includes a first substrate, a chamber layer, a vibration layer, a first metal layer, a piezoelectric actuation layer, a second metal layer, a second substrate, an inlet layer, a resonance layer and an aperture array plate. The first substrate includes a plurality of first outflow apertures and a plurality of second outflow apertures. The chamber layer includes a storage chamber. The second metal layer includes an upper electrode pad and a lower electrode pad. While driving power having different phase charges is provided to the upper electrode pad and the lower electrode pad to drive and control the vibration layer to displace in a reciprocating manner, the fluid is inhaled from the exterior through the inlet layer, converged to the storage chamber, compressed and pushes out the aperture array plate, and then is discharged out from the micro fluid actuator to achieve fluid transportation.

公开(公告)号：US20200088185A1

公开(公告)日：2020-03-19

申请号：US16570352

申请日：2019-09-13

Applicant: MICROJET TECHNOLOGY CO., LTD.

Inventor： Hao-Jan Mou ,  Rong-Ho Yu ,  Cheng-Ming Chang ,  Hsien-Chung Tai ,  Wen-Hsiung Liao ,  Chi-Feng Huang ,  Yung-Lung Han ,  Chang-Yen Tsai

IPC: F04B43/04 ,  H01L41/083

Abstract: A MEMS pump includes a first substrate, a first oxide layer, a second substrate, a second oxide layer, a third substrate and a piezoelectric element sequentially stacked to form the entire structure of the MEMS pump. The first substrate has a first thickness and at least one inlet aperture. The first oxide layer has at least one fluid inlet channel and a convergence chamber, wherein the fluid inlet channel communicates with the convergence chamber and the inlet aperture. The second substrate has a second thickness and a through hole, and the through hole is misaligned with the inlet aperture and communicates with the convergence chamber. The second oxide layer has a first chamber with a concave central portion. The third substrate has a third thickness and a plurality of gas flow channels, wherein the gas flow channels are misaligned with the through hole.