摘要:
A synchronous motor drive system improves the design flexibility regarding torque characteristics as compared with conventionally available design flexibility. A synchronous motor has a rotor and a stator. Each of at least two adjacent stator teeth has a slit formed at the tip thereof. Each of a plurality of stator teeth has a main coil wound therearound in concentrated winding. Between each two adjacent teeth having a slit, a sub-coil is wound around in a manner of being accommodated in the respective slits. The drive device separately controls electric current supplied to the main coils and electric current supplied to the sub-coil.
摘要:
An electron emission element includes a substrate, a cathode electrode formed on the substrate, an anode electrode disposed so as to be opposed to the cathode electrode, an electron emission member disposed on the cathode electrode, a control electrode disposed between the cathode electrode and the anode electrode, and an insulating layer. The electron emission member includes a first member having a hole and a second member filling the hole, wherein the second member is more likely to emit electrons than the first member.
摘要:
In an electron-emitting device, an electron supplying layer for supplying electrons is composed of an n-GaN layer. An electron transferring layer for moving electrons toward the surface is composed of non-doped (intrinsic) AlxGa1−xN (0≦x≦1) having a graded composition for the Al concentration x. A surface layer is composed of non-doped AlN having a negative electron affinity (NEA). The electron transferring layer composed of AlxGa1−xN has a band gap which is enlarged nearly continuously from the electron supplying layer to the surface layer and a negative electron affinity or a positive electron affinity close to zero. If such a voltage V as to render the surface electrode side positive is applied, the band of AlxGa1−xN is bent, whereby a current derived mainly from a diffused current flows from the electron supplying layer to the surface layer through the electron transferring layer. Thereby excellent electron emitting characteristic is obtained.
摘要翻译:在电子发射器件中,用于提供电子的电子供应层由n-GaN层组成。 用于向表面移动电子的电子转移层由具有Al浓度x的梯度组成的非掺杂(本征)Al x Ga 1-x N(0 <= x <= 1)组成。 表面层由具有负电子亲和力(NEA)的非掺杂AlN组成。 由Al x Ga 1-x N组成的电子转移层具有从电子供给层到表面层几乎连续扩大的带隙,接近零的负电子亲和力或正电子亲和力。 如果施加使表面电极侧为正的电压V,则Al x Ga 1-x N的带被弯曲,主要由扩散电流导出的电流从电子供给层通过电子转移层流向表面层。 由此获得优异的电子发射特性。
摘要:
A method for manufacturing a device of silicon carbide (SiC) and a single crystal thin film, which are wide band gap semiconductor materials and can be applied to semiconductor devices such as high power devices, high temperature devices, and environmentally resistant devices, is provided by heating a silicon carbide crystal in an oxygen atmosphere to form a silicon (di)oxide thin film on a silicon carbide crystal surface, and etching the silicon (di)oxide thin film formed on the silicon carbide crystal surface to prepare a clean SiC surface. The above SiC device comprises a clean surface having patterned steps and terraces, has a surface defect density of 108 cm−2 or less, or has at least a layered structure in which an n-type silicon carbide crystal is formed on an n-type Si substrate surface.
摘要:
Cluster particles including a plurality of molecules or atoms are prepared by a gas cluster method, are accelerated, and are then irradiated onto a diamond in a low pressure atmosphere, so that the unevenness surfaces of the diamond are smoothed with no damages in the diamond. The cluster particles are prepared by the steps of forming, ionizing, mass-separating, and accelerating cluster particles. The cluster particles with a certain energy are irradiated onto the surface of the diamond. Irradiated cluster particles collide with the surface of the diamond, and then break apart into each molecule or atom while changing momentum (direction and speed) or energy. Thus, the surface of the diamond is efficiently smoothed and etched.
摘要:
A method of fabricating a semiconductor thin film is initiated with preparing a substrate having a surface consisting of a single crystal of Si. The surface has an oxide film. Then, the oxide film is removed. The dangling bonds of the Si atoms on the surface are terminated with hydrogen atoms. An initial layer is formed on the substrate of the single crystal of Si terminated with the hydrogen atoms, of at least one selected from the group consisting of Al, Ga, and In. A buffer layer containing at least In and Sb is formed on the initial layer. A semiconductor thin film containing at least In and Sb is formed on the buffer layer at a temperature higher than the temperature at which the buffer layer is started to be formed. There is also disclosed a method of fabricating a Hall-effect device. This method is initiated with forming a semiconductor thin film by making use of the above-described fabrication method. Then, electrodes are attached to the thin film.
摘要:
In a power conversion circuit operating with high frequency, an off-voltage control circuit 101u of a lower-arm gate drive circuit 24u controls the output voltage of a gate drive power supply 103u to change the output voltage to a voltage lower than a predetermined off voltage during a time period from termination of turn-off operation of a lower arm 22u until start of turn-on operation of an upper arm 21u, and thereafter return the output voltage to the predetermined off voltage immediately after termination of the turn-on operation of the upper arm 21u. With this control, short-circuiting through the upper and lower arms occurring due to a high voltage change dv/dt can be avoided, and the life of a switching element constituting the power conversion circuit improves, increasing the reliability of the power conversion circuit.
摘要:
Provided is a small-sized load drive system which, even with three three-phase inverters, significantly reduces noise regardless of control duty ratio. The load drive system includes three-phase inverters 301 to 303, and first, second, and third control units 401 to 403. The inverters 301 to 303 are connected to loads 211 to 213, respectively. The first control unit 401 generates sawtooth wave voltage and controls the inverter 301 according to the sawtooth wave voltage. The second control unit 402 generates inverse sawtooth wave voltage and controls the inverter 302 according to the inverse sawtooth wave voltage. The third control unit 403 generates triangular wave voltage which has ramps respectively equal to the sawtooth/inverse sawtooth wave voltage and either has a same phase or is out of phase by half a period relative to the sawtooth/inverse sawtooth wave voltage, and also controls the inverter 303 according to the triangular wave voltage.
摘要:
In a power conversion circuit operating with high frequency, an off-voltage control circuit 101u of a lower-arm gate drive circuit 24u controls the output voltage of a gate drive power supply 103u to change the output voltage to a voltage lower than a predetermined off voltage during a time period from termination of turn-off operation of a lower arm 22u until start of turn-on operation of an upper arm 21u, and thereafter return the output voltage to the predetermined off voltage immediately after termination of the turn-on operation of the upper arm 21u. With this control, short-circuiting through the upper and lower arms occurring due to a high voltage change dv/dt can be avoided, and the life of a switching element constituting the power conversion circuit improves, increasing the reliability of the power conversion circuit.
摘要:
A semiconductor module (10) includes a heat sink (1), an electronic component (2), a semiconductor device (3), and a thermally-conductive sheet member (4). The thermally-conductive sheet member (4) covers a part of the semiconductor device (3) and has a lower part (4b) and a side part (4c). The lower part (4b) is in contact with a mounting face (11a) of the heat sink (1). The side part (4c) extends from the lower part (4b) and covers a first side surface (3c) of the semiconductor device (3). The electronic component (2) is disposed across the side part (4c) of the thermally-conductive sheet member (4) from the semiconductor device (3).