APPARATUS FOR ACCURATE AND EFFICIENT QUALITY AND RELIABILITY EVALUATION OF MICRO ELECTROMECHANICAL SYSTEMS
    53.
    发明申请
    APPARATUS FOR ACCURATE AND EFFICIENT QUALITY AND RELIABILITY EVALUATION OF MICRO ELECTROMECHANICAL SYSTEMS 失效
    微机电系统精确有效质量和可靠性评估的设备

    公开(公告)号:US20070090902A1

    公开(公告)日:2007-04-26

    申请号:US11163485

    申请日:2005-10-20

    IPC分类号: H01H51/22

    CPC分类号: H01H59/0009

    摘要: The present invention provides multiple test structures for performing reliability and qualification tests on MEMS switch devices. A Test structure for contact and gap characteristic measurements is employed having a serpentine layout simulates rows of upper and lower actuation electrodes. A cascaded switch chain test is used to monitor process defects with large sample sizes. A ring oscillator is used to measure switch speed and switch lifetime. A resistor ladder test structure is configured having each resistor in series with a switch to be tested, and having each switch-resistor pair electrically connected in parallel. Serial/parallel test structures are proposed with MEMS switches working in tandem with switches of established technology. A shift register is used to monitor the open and close state of the MEMS switches. Pull-in voltage, drop-out voltage, activation leakage current, and switch lifetime measurements are performed using the shift register.

    摘要翻译: 本发明提供用于在MEMS开关装置上执行可靠性和鉴定测试的多个测试结构。 采用具有蛇形布局的接触和间隙特性测量的测试结构来模拟上下驱动电极的行。 级联交换链测试用于监控大样本量的过程缺陷。 环形振荡器用于测量开关速度和开关寿命。 电阻梯形测试结构被配置为具有与要测试的开关串联的每个电阻器,并且每个开关电阻器对并联电连接。 提出了串联/并联测试结构,其中MEMS开关与成熟技术的开关串联工作。 移位寄存器用于监测MEMS开关的开启和关闭状态。 使用移位寄存器执行拉入电压,掉电电压,启动漏电流和开关寿命测量。

    Working electrode design for electrochemical processing of electronic components
    58.
    发明授权
    Working electrode design for electrochemical processing of electronic components 有权
    电子元器件电化学处理工作电极设计

    公开(公告)号:US08926820B2

    公开(公告)日:2015-01-06

    申请号:US13612661

    申请日:2012-09-12

    摘要: An electroplating apparatus including a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.

    摘要翻译: 一种电镀设备,包括用于容纳电镀电解质的电镀槽。 对电极,例如阳极,存在于镀槽的第一部分中。 阴极系统存在于镀槽的第二部分中。 阴极系统包括工作电极和小偷电极。 小电极存在于工作电极和对电极之间。 防窃电极包括与电镀电解质接触的外表面,其与工作电极的电镀表面偏移。 在一个实施例中,窃电电极围绕工作电极的周边重叠一部分工作电极。 在一个实施例中,提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。

    Working electrode design for electrochemical processing of electronic components
    60.
    发明授权
    Working electrode design for electrochemical processing of electronic components 有权
    电子元件电化学处理工作电极设计

    公开(公告)号:US08784618B2

    公开(公告)日:2014-07-22

    申请号:US12806719

    申请日:2010-08-19

    IPC分类号: C25D17/00 C25D7/12

    摘要: An electroplating apparatus is provided that includes a plating tank for containing a plating electrolyte. A counter electrode, e.g., anode, is present in a first portion of the plating tank. A cathode system is present in a second portion of the plating tank. The cathode system includes a working electrode and a thief electrode. The thief electrode is present between the working electrode and the counter electrode. The thief electrode includes an exterior face that is in contact with the plating electrolyte that is offset from the plating surface of the working electrode. In one embodiment, the thief electrode overlaps a portion of the working electrode about the perimeter of the working electrode. In one embodiment, a method is provided of using the aforementioned electroplating apparatus that provides increased uniformity in the plating thickness.

    摘要翻译: 提供一种电镀设备,其包括用于容纳电镀液的镀槽。 对电极,例如阳极,存在于镀槽的第一部分中。 阴极系统存在于镀槽的第二部分中。 阴极系统包括工作电极和小偷电极。 小电极存在于工作电极和对电极之间。 防窃电极包括与电镀电解质接触的外表面,其与工作电极的电镀表面偏移。 在一个实施例中,窃电电极围绕工作电极的周边重叠一部分工作电极。 在一个实施例中,提供了使用提供镀层厚度增加的均匀性的上述电镀设备的方法。