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公开(公告)号:US11927987B2
公开(公告)日:2024-03-12
申请号:US16903844
申请日:2020-06-17
Applicant: Samsung Display Co., Ltd.
Inventor: Sun Hee Lee , Sunho Kim , Hyun Kim
IPC: G06F1/16 , B32B3/02 , B32B7/12 , B32B27/08 , B32B37/10 , B32B37/12 , H04M1/02 , B32B38/00 , H04M1/18
CPC classification number: G06F1/1637 , B32B3/02 , B32B7/12 , B32B27/08 , B32B37/10 , B32B37/12 , G06F1/1643 , H04M1/0266 , B32B2038/0076 , B32B2307/546 , B32B2457/20 , G06F1/1626 , H04M1/185
Abstract: A display device includes a window, a display module, a protection film, a circuit board, a first area adhesive member, and a second area adhesive member. The window includes a first area providing a front surface and a second area bent from the first area to provide a side surface. The display module includes a first portion coupled to the window and a second portion extending from the first portion. The protection film includes a first film portion corresponding to the first portion and a second film portion corresponding to the second portion, and is disposed below the display module. The first area adhesive member couples the first portion and the first film portion. The second area adhesive member couples the second portion and the second film portion, and has an elastic modulus greater than that of the first area adhesive member. The circuit board is coupled to the second portion.
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公开(公告)号:US11521850B2
公开(公告)日:2022-12-06
申请号:US16440740
申请日:2019-06-13
Inventor: Jun Hyung Lim , Hyung Jun Kim , Sun Hee Lee , Seung Gi Seo , Whang Je Woo
Abstract: A method for manufacturing a semiconductor device according to an, exemplary embodiment of the present disclosure includes: forming a semiconductor layer on a substrate in a chamber; and forming a semiconductor layer on a substrate in a chamber. Forming the insulation layer includes: (a) injecting precursors that include a metal into a surface of the semiconductor layer; (b) removing precursors that are not adsorbed; (c) injecting reactants onto the surface of the semiconductor layer; and (d) removing residual reactants. The semiconductor layer includes a semiconductor material that has a layered structure.
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公开(公告)号:US11367770B2
公开(公告)日:2022-06-21
申请号:US16789102
申请日:2020-02-12
Applicant: Samsung Display Co., LTD.
Inventor: Ju Chan Park , Sun Hee Lee , Sun Ho Kim , Hyun Kim
IPC: H01L27/32 , H01L51/00 , G09G3/3225 , H01L27/12
Abstract: Provided is a display device. The display device has a display area and a non-display area disposed around the display area and includes pixels disposed in the display area; and an intra-pixel bending area disposed along a direction of each of the pixels.
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公开(公告)号:US20180308916A1
公开(公告)日:2018-10-25
申请号:US15926421
申请日:2018-03-20
Applicant: SAMSUNG DISPLAY CO., LTD.
Inventor: Sun Ho Kim , Ju Chan Park , Young Gug Seol , Sun Hee Lee
IPC: H01L27/32 , H01L51/50 , H01L51/56 , G09G3/3233
CPC classification number: H01L27/3276 , G09G3/3233 , G09G2300/0426 , H01L27/3258 , H01L27/3265 , H01L51/5096 , H01L51/56
Abstract: A display device includes a substrate including a pixel region and a peripheral region. The display device also includes a plurality of pixels provided in the pixel region for displaying an image. The display device also includes a light emitting element provided in each pixel for emitting light. The display device includes a first transistor provided in each pixel for driving the light emitting element, and a second transistor connected to the first transistor. The display device includes an insulating layer disposed between a second semiconductor layer of the second transistor and the substrate; and a crack blocking layer disposed between the insulating layer and the second semiconductor layer of the second transistor. A first semiconductor layer of the first transistor and the second semiconductor layer of the second transistor are provided in layers different from each other.
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