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169 条记录 (耗时 0.044 秒)

    Copper plating bath and plating method
    53.
    发明申请
    Copper plating bath and plating method 审中-公开
    镀铜浴和电镀方法

    公开(公告)号：US20050072683A1

    公开(公告)日：2005-04-07

    申请号：US10816168

    申请日：2004-04-02

    申请人： Tsutomu Nakada ,  Tsuyoshi Sahoda ,  Koji Mishima ,  Ryoichi Kimizuka ,  Takeshi Kobayashi

    发明人： Tsutomu Nakada ,  Tsuyoshi Sahoda ,  Koji Mishima ,  Ryoichi Kimizuka ,  Takeshi Kobayashi

    IPC分类号： C25D3/38 ,  C25D5/18 ,  H05K3/42

    CPC分类号： C25D3/38 ,  C25D5/18 ,  H05K3/423

    摘要： An acid copper plating solution comprises copper ions, an organic acid or an inorganic acid, chloride ions, a high molecular weight surfactant that controls the electrodeposition reaction, and a sulfur-containing saturated organic compound that promotes the electrocoating rate. The high molecular weight surfactant comprises two or more types of surfactants with different hydrophobicities. The plating solution is used for forming a plating film on a conductor layer.

    摘要翻译： 酸性铜电镀液包含铜离子，有机酸或无机酸，氯离子，控制电沉积反应的高分子量表面活性剂，以及促进电泳率的含硫饱和有机化合物。 高分子量表面活性剂包含两种或多种具有不同疏水性的表面活性剂。 电镀液用于在导体层上形成镀膜。

    Plating method and plating solution
    54.
    发明申请
    Plating method and plating solution 审中-公开
    电镀方法和镀液

    公开(公告)号：US20050045486A1

    公开(公告)日：2005-03-03

    申请号：US10885136

    申请日：2004-07-07

    申请人： Tsuyoshi Sahoda ,  Tsutomu Nakada ,  Koji Mishima ,  Ryoichi Kimizuka

    发明人： Tsuyoshi Sahoda ,  Tsutomu Nakada ,  Koji Mishima ,  Ryoichi Kimizuka

    IPC分类号： C25D3/38 ,  C25D5/02 ,  C25D7/12 ,  H01L21/288 ,  H01L21/445 ,  H01L21/768 ,  H05K3/18 ,  H05K3/42

    CPC分类号： H05K3/423 ,  C25D3/38 ,  H01L21/2885 ,  H01L21/76877

    摘要： The present invention provides a plating method which can embed copper in interconnect recesses, such as vias and interconnect trenches, having an opening width or size of several tens of μm and an aspect ratio of at least 1.5. The plating method comprises: providing a substrate having interconnect recesses, whose surfaces are covered with a conductive layer, formed in a surface of the substrate; bringing the surface of the substrate into contact with a plating solution containing copper ions, an organic or inorganic acid, chloride ions, a polymeric surfactant for suppressing electrodeposition, a sulfur-containing saturated organic compound for promoting the growth of a plated film, and a nitrogen-containing polymer for flattening a surface of the plated film; and applying a voltage between the conductive layer and an anode immersed in the plating solution.

    摘要翻译： 本发明提供一种电镀方法，其可以将铜嵌入诸如通路和互连沟槽的互连凹槽中，其具有几十个开口宽度或尺寸，并且纵横比至少为1.5。 电镀方法包括：提供具有互连凹槽的基板，其表面被形成在基板的表面中的导电层覆盖; 使基板的表面与含有铜离子，有机或无机酸，氯离子的电镀溶液，用于抑制电沉积的聚合物表面活性剂接触，用于促进镀膜生长的含硫饱和有机化合物，以及 用于使镀膜表面变平的含氮聚合物; 以及在所述导电层和浸在所述电镀液中的阳极之间施加电压。

    Optical recording medium and recording method for optical recording medium
    55.
    发明申请
    Optical recording medium and recording method for optical recording medium 失效
    光记录介质和光记录介质的记录方法

    公开(公告)号：US20050013963A1

    公开(公告)日：2005-01-20

    申请号：US10499877

    申请日：2002-12-06

    申请人： Tetsuro Mizushima ,  Koji Mishima ,  Jiro Yoshinari

    发明人： Tetsuro Mizushima ,  Koji Mishima ,  Jiro Yoshinari

    IPC分类号： B41M5/26 ,  B32B3/02 ,  G11B7/0045 ,  G11B7/006 ,  G11B7/125 ,  G11B7/24 ,  G11B7/243

    CPC分类号： G11B7/0062 ,  G11B7/24038 ,  G11B7/24067 ,  G11B7/243 ,  G11B7/253 ,  G11B7/254 ,  G11B7/257 ,  G11B7/258 ,  Y10T428/21

    摘要： To obtain an optical recording medium capable of recording at various recording transfer rates from a low speed to a high speed, by using a simple recording strategy. A recording layer 18 of a write-once optical recording medium capable of recording from a low speed to a high speed is formed by laminating a first sub recording layer 18A and a second sub recording layer 18B each containing a metal as its main component. When the recording layer (laminated recording layer) 18 is irradiated with a laser beam having a wavelength equal to or shorter than a blue wavelength by using a recording strategy comprising only a ratio of write power to bias power, the main component metals contained in the first and second sub recording layers 18A, 18B diffuse and are thus mixed together, forming the sub recording layers into a single layer by means of such mixing and forming recording marks whose reflectance have been irreversibly changed. Since the recording mark formation process does not need to select a recording strategy, it is possible to obtain many subordinate advantages such as a variable speed recording.

    摘要翻译： 为了获得能够以各种记录传送速率​​从低速到高速记录的光记录介质，通过使用简单的记录策略。 通过层叠以金属为主要成分的第一子记录层18A和第二子记录层18B，形成能够从低速到高速记录的一次写入光记录介质的记录层18。 当通过使用仅包括写入功率与偏置功率的比率的记录策略，用波长等于或短于蓝色波长的激光束照射记录层（层压记录层）18时，主要成分金属 第一和第二子记录层18A，18B漫射并因此混合在一起，通过这样的混合形成反射率不可逆地改变的记录标记，形成单层。 由于记录标记形成处理不需要选择记录策略，因此可以获得许多从属优点，例如变速记录。

    Apparatus and method for processing a substrate
    56.
    发明申请
    Apparatus and method for processing a substrate 审中-公开
    用于处理衬底的装置和方法

    公开(公告)号：US20050000820A1

    公开(公告)日：2005-01-06

    申请号：US10854252

    申请日：2004-05-27

    申请人： Koji Mishima ,  Kunihito Ide ,  Hidenao Suzuki ,  Kazufumi Nomura ,  Hiroyuki Kanda

    发明人： Koji Mishima ,  Kunihito Ide ,  Hidenao Suzuki ,  Kazufumi Nomura ,  Hiroyuki Kanda

    IPC分类号： C25D7/12 ,  C25C7/00 ,  C25D5/00 ,  C25D17/00 ,  C25D21/04 ,  C25D21/12 ,  C25D21/14 ,  H01L21/288 ,  H01L21/445

    CPC分类号： C25D17/002 ,  C25D17/001 ,  C25D21/04 ,  H01L21/2885

    摘要： A method and apparatus are set forth capable of processing a substrate with a high uniformity within the surface area even for a thin feeding layer. The method comprises arranging a counter electrode and the substrate to confront each other; providing a membrane between the counter electrode and the substrate to define a substrate side region and a counter electrode side region. The substrate side region and the counter electrode side region are capable of accommodating respective electrolytes. The substrate side region and the counter electrode side region are supplied with respective electrolytes having different specific resistances. A processing current is also supplied between the substrate and the counter electrode.

    摘要翻译： 提出了一种方法和装置，即使对于薄的进料层，也能够在表面积内处理高均匀性的基板。 该方法包括将对置电极和基板相互对置布置; 在对电极和基板之间提供膜以限定基板侧区域和对电极侧区域。 基板侧区域和对置电极侧区域能够容纳各种电解质。 向基板侧区域和对电极侧区域供给具有不同比电阻的各电解质。 在基板和对置电极之间也提供处理电流。

    Electroplating apparatus and electroplating method
    57.
    发明授权
    Electroplating apparatus and electroplating method 失效
    电镀设备和电镀方法

    公开(公告)号：US06767437B2

    公开(公告)日：2004-07-27

    申请号：US09860514

    申请日：2001-05-21

    申请人： Tetsuo Matsuda ,  Hisashi Kaneko ,  Koji Mishima ,  Natsuki Makino ,  Junji Kunisawa

    发明人： Tetsuo Matsuda ,  Hisashi Kaneko ,  Koji Mishima ,  Natsuki Makino ,  Junji Kunisawa

    IPC分类号： C25D1700

    CPC分类号： C25D17/001 ,  Y10S204/07

    摘要： In an electroplating apparatus, an electrolytic agent is filled into the portion between an anode and a dummy cathode which is opposite substantially face to face and parallel to the anode, and an electric current is supplied to this portion, thereby suppressing changes in properties of a black film during the period in which plating to a substrate to be processed is stopped. In particular, by applying an electric current to the anode immediately before plating to the substrate is resumed, the film formation characteristics of plating to the substrate can be maximally stabilized. This can reduce the consumption power and dissolution of the anode. This apparatus is particularly effective in copper plating in which the formation of a black film is significant.

    摘要翻译： 在电镀装置中，电解质被填充到阳极和虚拟阴极之间的与阳极基本上面对并且平行的方向相反的部分中，并且向该部分提供电流，从而抑制了 在停止对待处理的基板的电镀期间的黑色膜。 特别地，通过在电镀到基板之前立即向阳极施加电流，电镀到基板的成膜特性可以最大程度地稳定。 这可以降低阳极的消耗功率和溶解度。 该装置在形成黑色膜的铜电镀中特别有效。