摘要:
A resonant pressure sensor including one or more resonant-type strain gauges arranged on a diaphragm may include a sensor substrate made of silicon and including one surface on which one or more resonant-type strain gauge elements are arranged and the other surface which is polished to have a thickness corresponding to the diaphragm, a base substrate made of silicon and including one surface directly bonded with the other surface of the sensor substrate, a concave portion formed in a portion of the base substrate bonding with the sensor substrate, substantially forming the diaphragm in the sensor substrate, and including a predetermined gap that does not restrict a movable range of the diaphragm due to foreign substances and suppresses vibration of the diaphragm excited by vibration of the resonant-type strain gauge elements, one or more conducting holes, and a fluid.
摘要:
As may be consistent with one or more embodiments discussed herein, an integrated circuit apparatus includes a membrane suspended over a cavity, with the membrane and cavity defining a chamber. The membrane has a plurality of openings therein that pass gas into and out of the chamber. As the membrane is actuated, the volume of the chamber changes to generate a gas pressure inside the chamber that is different than a pressure outside the chamber. A sensor detects a frequency-based characteristic of the membrane responsive to the change in volume, and therein provides an indication of the gas pressure outside the chamber.
摘要:
A contact force sensor package includes a substrate layer having a vibration detection unit and a pair of first junction pads that are electrical connection ports which are provided on an upper surface of the substrate layer, a flexible circuit substrate layer having a pair of second junction pads provided at a position corresponding to the first junction pads and electrically connected to the first junction pad, a vibration transfer unit having one side contacting the vibration detection unit and the other side contacting a human body and transferring a sphygmus wave of the human body to the vibration detection unit, and an adhesion layer formed between the substrate layer and the flexible circuit substrate layer to reinforce a junction force between the substrate layer and the flexible circuit substrate layer, the adhesion layer being not formed in an area overlapping at least the vibration transfer unit.
摘要:
A device for measuring pressure having at least one pressure sensor with at least one active sensor surface, an oscillating and/or variable temperature counter-surface arranged opposite the at least one sensor surface, wherein the sensor surface and the counter-surface are arranged in a hollow body, and the hollow body has at least one opening, and wherein at least one alternating signal amplifier is provided.
摘要:
Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.
摘要:
A pressure sensor for sensing a pressure of a process fluid includes a sensor body exposed to the pressure of the process fluid. The sensor body deforms in response to the pressure. A diaphragm suspended from the sensor body has a tension which changes in response to deformation of the sensor body. A resonate frequency of the diaphragm is measured. The measured resonant frequency is indicative of the line pressure of the process fluid and integrity of the isolation fill fluid system. In addition to measuring the resonant frequency, the oscillation mode itself can be used as a diagnostic tool to assess sensor health.
摘要:
An MEMS sensor includes: a semiconductor substrate having an opening extending therethrough; a vibration diaphragm opposed to the opening in an opposing direction and capable of vibrating in the opposing direction; and a piezoelectric element or a strain gage provided in association with the vibration diaphragm.
摘要:
A pressure sensor of the present invention includes a lower substrate which has an insulating layer having a through-hole penetrating from one side to the other side, and an active layer formed to have a uniform thickness on the insulating layer and having a portion facing the through-hole as an oscillating portion capable of oscillating in a direction opposing the through-hole; a lower electrode formed on the oscillating portion; an upper substrate arranged opposite to the active layer and having a recess at a portion opposed to the oscillating portion; and an upper electrode formed on the recess.
摘要:
A diaphragm structure for a MEMS device includes a through-hole formed so as to penetrate from an upper surface to a bottom surface of a substrate; and a vibrating electrode film formed on the upper surface of the substrate so as to cover the through-hole. An opening shape of the through-hole in the upper surface of the substrate is substantially hexagonal.
摘要:
A pressure sensor is a micro-electro-mechanical vibrating device, with a silicon substrate (15; 15′) onto which a single-layer or multilayer vibrating assembly (121; 221; 321) is formed. It comprises an electrode (21; 21′), which makes the assembly to oscillate relative to the substrate at the resonance frequency or at another known frequency, and a detector for detecting the actual frequency and/or amplitude of said oscillation. The actual frequency and/or amplitude are affected by the conditions, in particular the pressure, of the external environment and the variations of the frequency and amplitude with respect to the values set by the electrode is used to measure pressure variations in the surrounding environment.