Resonant pressure sensor and method of manufacturing the same
    51.
    发明授权
    Resonant pressure sensor and method of manufacturing the same 有权
    共振压力传感器及其制造方法

    公开(公告)号:US09003889B2

    公开(公告)日:2015-04-14

    申请号:US13593311

    申请日:2012-08-23

    IPC分类号: G01L11/00 G01L9/00

    CPC分类号: G01L9/0016 G01L9/0045

    摘要: A resonant pressure sensor including one or more resonant-type strain gauges arranged on a diaphragm may include a sensor substrate made of silicon and including one surface on which one or more resonant-type strain gauge elements are arranged and the other surface which is polished to have a thickness corresponding to the diaphragm, a base substrate made of silicon and including one surface directly bonded with the other surface of the sensor substrate, a concave portion formed in a portion of the base substrate bonding with the sensor substrate, substantially forming the diaphragm in the sensor substrate, and including a predetermined gap that does not restrict a movable range of the diaphragm due to foreign substances and suppresses vibration of the diaphragm excited by vibration of the resonant-type strain gauge elements, one or more conducting holes, and a fluid.

    摘要翻译: 包括设置在隔膜上的一个或多个谐振型应变计的共振压力传感器可以包括由硅制成的传感器基板,并且包括一个表面,一个表面上布置有一个或多个谐振型应变计元件,另一个表面抛光到 具有对应于隔膜的厚度,由硅制成的基底基板,其包括与传感器基板的另一表面直接接合的一个表面;凹部,形成在与传感器基板接合的基底部分的一部分中,基本上形成隔膜 并且包括预定的间隙,其不会由于异物而限制隔膜的可移动范围,并且抑制由共振型应变计元件的振动激励的隔膜的振动,一个或多个导电孔和 流体。

    Pressure sensor
    52.
    发明授权
    Pressure sensor 有权
    压力传感器

    公开(公告)号:US08833171B2

    公开(公告)日:2014-09-16

    申请号:US13592570

    申请日:2012-08-23

    IPC分类号: G01L11/00 G01L9/12 G01L9/00

    摘要: As may be consistent with one or more embodiments discussed herein, an integrated circuit apparatus includes a membrane suspended over a cavity, with the membrane and cavity defining a chamber. The membrane has a plurality of openings therein that pass gas into and out of the chamber. As the membrane is actuated, the volume of the chamber changes to generate a gas pressure inside the chamber that is different than a pressure outside the chamber. A sensor detects a frequency-based characteristic of the membrane responsive to the change in volume, and therein provides an indication of the gas pressure outside the chamber.

    摘要翻译: 可以与本文所讨论的一个或多个实施例一致,集成电路设备包括悬挂在空腔上的膜,膜和空腔限定室。 膜在其中具有多个开口,其将气体进入和离开室。 当膜被致动时,室的体积变化以在室内产生不同于室外的压力的气体压力。 传感器响应于体积变化来检测膜的基于频率的特性,并且其中提供了室外的气体压力的指示。

    Contact force sensor package, blood pressure meter with the same, and method for fabricating the contact force sensor package
    53.
    发明授权
    Contact force sensor package, blood pressure meter with the same, and method for fabricating the contact force sensor package 有权
    接触力传感器封装,血压计相同,以及制造接触力传感器封装的方法

    公开(公告)号:US08800377B2

    公开(公告)日:2014-08-12

    申请号:US12055337

    申请日:2008-03-26

    申请人: Jong-pal Kim

    发明人: Jong-pal Kim

    IPC分类号: G01L9/06 A61B5/021

    摘要: A contact force sensor package includes a substrate layer having a vibration detection unit and a pair of first junction pads that are electrical connection ports which are provided on an upper surface of the substrate layer, a flexible circuit substrate layer having a pair of second junction pads provided at a position corresponding to the first junction pads and electrically connected to the first junction pad, a vibration transfer unit having one side contacting the vibration detection unit and the other side contacting a human body and transferring a sphygmus wave of the human body to the vibration detection unit, and an adhesion layer formed between the substrate layer and the flexible circuit substrate layer to reinforce a junction force between the substrate layer and the flexible circuit substrate layer, the adhesion layer being not formed in an area overlapping at least the vibration transfer unit.

    摘要翻译: 接触力传感器封装包括:具有振动检测单元和一对第一接合点的基板层,所述第一接合点是设置在基板层的上表面上的电连接端口;柔性电路基板层,具有一对第二接合点 设置在与第一接合焊盘对应的位置并电连接到第一接合焊盘;振动传递单元,其一侧接触振动检测单元,另一侧接触人体并将人体的血流传送到 振动检测单元,以及形成在基板层和柔性电路基板层之间的粘合层,以加强基板层和柔性电路基板层之间的接合力,粘合层不形成在至少与振动传递重叠的区域中 单元。

    Device for Measuring a Pressure with at Least One Pressure Sensor Having at Least One Active Sensor Surface
    54.
    发明申请
    Device for Measuring a Pressure with at Least One Pressure Sensor Having at Least One Active Sensor Surface 有权
    用于在具有至少一个主动传感器表面的至少一个压力传感器中测量压力的装置

    公开(公告)号:US20140174188A1

    公开(公告)日:2014-06-26

    申请号:US14085949

    申请日:2013-11-21

    发明人: Armin Conrad

    IPC分类号: G01L9/00 G01L9/08

    摘要: A device for measuring pressure having at least one pressure sensor with at least one active sensor surface, an oscillating and/or variable temperature counter-surface arranged opposite the at least one sensor surface, wherein the sensor surface and the counter-surface are arranged in a hollow body, and the hollow body has at least one opening, and wherein at least one alternating signal amplifier is provided.

    摘要翻译: 一种用于测量压力的装置,其具有至少一个具有至少一个有源传感器表面的压力传感器,与所述至少一个传感器表面相对布置的振荡和/或可变温度对置面,其中所述传感器表面和所述对置面布置在 中空体,并且所述中空体具有至少一个开口,并且其中提供至少一个交变信号放大器。

    SENSORS FOR MEASURING AT LEAST ONE OF PRESSURE AND TEMPERATURE, SENSOR ARRAYS AND RELATED METHODS
    55.
    发明申请
    SENSORS FOR MEASURING AT LEAST ONE OF PRESSURE AND TEMPERATURE, SENSOR ARRAYS AND RELATED METHODS 有权
    用于测量至少一个压力和温度的传感器,传感器阵列和相关方法

    公开(公告)号:US20120181900A1

    公开(公告)日:2012-07-19

    申请号:US13350577

    申请日:2012-01-13

    IPC分类号: E21B47/06 H01L41/22

    摘要: Arrays of resonator sensors include an active wafer array comprising a plurality of active wafers, a first end cap array coupled to a first side of the active wafer array, and a second end cap array coupled to a second side of the active wafer array. Thickness shear mode resonator sensors may include an active wafer coupled to a first end cap and a second end cap. Methods of forming a plurality of resonator sensors include forming a plurality of active wafer locations and separating the active wafer locations to form a plurality of discrete resonator sensors. Thickness shear mode resonator sensors may be produced by such methods.

    摘要翻译: 谐振器传感器的阵列包括主动晶片阵列,其包括多个有源晶片,耦合到有源晶片阵列的第一侧的第一端盖阵列和耦合到有源晶片阵列的第二侧的第二端盖阵列。 厚度剪切模式谐振器传感器可以包括联接到第一端盖和第二端盖的活动晶片。 形成多个谐振器传感器的方法包括形成多个有源晶片位置并分离有源晶片位置以形成多个分立的谐振器传感器。 可以通过这种方法制造厚度剪切模式谐振器传感器。

    RESONANT FREQUENCY BASED PRESSURE SENSOR
    56.
    发明申请
    RESONANT FREQUENCY BASED PRESSURE SENSOR 有权
    谐振频率传感器

    公开(公告)号:US20110239773A1

    公开(公告)日:2011-10-06

    申请号:US12749885

    申请日:2010-03-30

    IPC分类号: G01L9/12

    摘要: A pressure sensor for sensing a pressure of a process fluid includes a sensor body exposed to the pressure of the process fluid. The sensor body deforms in response to the pressure. A diaphragm suspended from the sensor body has a tension which changes in response to deformation of the sensor body. A resonate frequency of the diaphragm is measured. The measured resonant frequency is indicative of the line pressure of the process fluid and integrity of the isolation fill fluid system. In addition to measuring the resonant frequency, the oscillation mode itself can be used as a diagnostic tool to assess sensor health.

    摘要翻译: 用于感测过程流体的压力的压力传感器包括暴露于过程流体的压力的传感器主体。 传感器体因压力而变形。 从传感器主体悬挂的隔膜具有响应于传感器主体的变形而变化的张力。 测量隔膜的谐振频率。 测量的谐振频率表示过程流体的管线压力和隔离填充流体系统的完整性。 除了测量谐振频率之外,振荡模式本身也可以用作诊断工具来评估传感器的健康状况。

    MEMS sensor, silicon microphone, and pressure sensor
    57.
    发明申请
    MEMS sensor, silicon microphone, and pressure sensor 审中-公开
    MEMS传感器,硅麦克风和压力传感器

    公开(公告)号:US20110006382A1

    公开(公告)日:2011-01-13

    申请号:US12801971

    申请日:2010-07-06

    申请人: Goro Nakatani

    发明人: Goro Nakatani

    IPC分类号: H01L29/84

    摘要: An MEMS sensor includes: a semiconductor substrate having an opening extending therethrough; a vibration diaphragm opposed to the opening in an opposing direction and capable of vibrating in the opposing direction; and a piezoelectric element or a strain gage provided in association with the vibration diaphragm.

    摘要翻译: MEMS传感器包括:具有延伸穿过其中的开口的半导体衬底; 振动膜,其相对于所述开口在相反方向上相对并能够沿相反方向振动; 以及与振动膜相关联地设置的压电元件或应变计。

    Pressure sensor and method for manufacturing the pressure sensor
    58.
    发明申请
    Pressure sensor and method for manufacturing the pressure sensor 有权
    压力传感器及制造压力传感器的方法

    公开(公告)号:US20100090297A1

    公开(公告)日:2010-04-15

    申请号:US12588241

    申请日:2009-10-08

    申请人: Goro Nakatani

    发明人: Goro Nakatani

    IPC分类号: H01L29/84 H01L21/02

    CPC分类号: G01L9/0073 G01L9/0016

    摘要: A pressure sensor of the present invention includes a lower substrate which has an insulating layer having a through-hole penetrating from one side to the other side, and an active layer formed to have a uniform thickness on the insulating layer and having a portion facing the through-hole as an oscillating portion capable of oscillating in a direction opposing the through-hole; a lower electrode formed on the oscillating portion; an upper substrate arranged opposite to the active layer and having a recess at a portion opposed to the oscillating portion; and an upper electrode formed on the recess.

    摘要翻译: 本发明的压力传感器包括具有绝缘层的下基板,该绝缘层具有从一侧到另一侧贯通的通孔,以及形成为在绝缘层上具有均匀厚度的有源层,并且具有面向 通孔作为能够在与通孔相反的方向上振荡的振荡部; 形成在所述振荡部上的下电极; 与所述有源层相对布置并且在与所述振荡部相对的部分处具有凹部的上基板; 以及形成在所述凹部上的上电极。

    DIAPHRAGM STRUCTURE AND MEMS DEVICE
    59.
    发明申请
    DIAPHRAGM STRUCTURE AND MEMS DEVICE 有权
    膜片结构和MEMS器件

    公开(公告)号:US20100077863A1

    公开(公告)日:2010-04-01

    申请号:US12630179

    申请日:2009-12-03

    IPC分类号: G01L9/06

    CPC分类号: G01L9/0016 H04R19/005

    摘要: A diaphragm structure for a MEMS device includes a through-hole formed so as to penetrate from an upper surface to a bottom surface of a substrate; and a vibrating electrode film formed on the upper surface of the substrate so as to cover the through-hole. An opening shape of the through-hole in the upper surface of the substrate is substantially hexagonal.

    摘要翻译: 用于MEMS器件的隔膜结构包括形成为从衬底的上表面到底表面穿透的通孔; 以及形成在基板的上表面上以覆盖通孔的振动电极膜。 基板的上表面中的通孔的开口形状基本上是六边形。

    Pressure sensor
    60.
    发明申请
    Pressure sensor 失效
    压力传感器

    公开(公告)号:US20050126295A1

    公开(公告)日:2005-06-16

    申请号:US10971885

    申请日:2004-10-22

    摘要: A pressure sensor is a micro-electro-mechanical vibrating device, with a silicon substrate (15; 15′) onto which a single-layer or multilayer vibrating assembly (121; 221; 321) is formed. It comprises an electrode (21; 21′), which makes the assembly to oscillate relative to the substrate at the resonance frequency or at another known frequency, and a detector for detecting the actual frequency and/or amplitude of said oscillation. The actual frequency and/or amplitude are affected by the conditions, in particular the pressure, of the external environment and the variations of the frequency and amplitude with respect to the values set by the electrode is used to measure pressure variations in the surrounding environment.

    摘要翻译: 压力传感器是微电子机械振动装置,其上形成有单层或多层振动组件(121; 221; 321)的硅衬底(15; 15')。 它包括一个电极(21; 21'),它使组件以共振频率或另一已知频率相对于衬底振荡;以及检测器,用于检测所述振荡的实际频率和/或振幅。 实际的频率和/或振幅受外部环境的条件,特别是压力的影响,并且相对于由电极设定的值的频率和振幅的变化用于测量周围环境中的压力变化。