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公开(公告)号：US07641781B2
公开(公告)日：2010-01-05
申请号：US10534376
申请日：2003-11-03
Applicant: Andreas Dietz , Gebhard Klumpp , Juergen Olfe
Inventor： Andreas Dietz , Gebhard Klumpp , Juergen Olfe
CPC classification number: C25D15/02 , C23C18/1653 , Y02T50/67 , Y10T428/2991
Abstract: In a method for coating a substrate, and a coated object, in a first step, in an external current-less or electrolytic manner, nickel and/or cobalt and/or platinum are deposited on a substrate in a deposition bath. In the deposition bath, particles are additionally suspended which contain at least one metal selected from Mg, Al, Ti, Zn and no Cr, the particles becoming occluded in the coating. In a second step, the actual protective layer is produced by heat treatment. The coating of component parts may be used for aircraft turbines or gas turbines or for garbage incineration systems having temperature-resistant protective layers against high temperature corrosion.
Abstract translation: 在用于涂覆基材和被涂物体的方法中，在第一步骤中，以外部无电流或电解方式，在沉积浴中将镍和/或钴和/或铂沉积在基底上。 在沉积浴中，另外悬浮含有至少一种选自Mg，Al，Ti，Zn和不含Cr的金属的颗粒，颗粒在涂层中被堵塞。 在第二步中，通过热处理产生实际的保护层。 组件的涂层可用于飞机涡轮机或燃气轮机或具有耐高温腐蚀的耐温保护层的垃圾焚烧系统。
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公开(公告)号：US07396394B2
公开(公告)日：2008-07-08
申请号：US11632815
申请日：2005-08-22
Applicant: Akihiro Aiba , Kazumi Kawamura , Hirofumi Takahashi
Inventor： Akihiro Aiba , Kazumi Kawamura , Hirofumi Takahashi
IPC: C23C18/42
CPC classification number: C23C18/54
Abstract: The invention provides a displacement electroless gold plating solution that is low in toxicity, can be used at a pH near to neutrality, and affords good solder adhesion and film adhesion. The displacement electroless gold plating solution contains a non-cyanide water-soluble gold compound and a hydrogensulfite compound. Preferably, the plating solution further contains a thiosulfuric acid compound or an aminocarboxylic acid compound. Sodium hydrogensulfite, potassium hydrogensulfite, ammonium hydrogensulfite or the like can be used as the hydrogensulfite compound.
Abstract translation: 本发明提供一种毒性低的置换无电镀金溶液，可以在接近中性的pH下使用，并提供良好的焊接粘合性和膜粘合性。 位移无电镀金液含有非氰化物水溶性金化合物和亚硫酸氢盐化合物。 优选地，电镀液还含有硫代硫酸化合物或氨基羧酸化合物。 亚硫酸氢钠，亚硫酸氢钾，亚硫酸氢铵等可用作亚硫酸氢盐化合物。
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53.发明申请
公开(公告)号：US20050031895A1
公开(公告)日：2005-02-10
申请号：US10362386
申请日：2001-08-21
Applicant: Kazuyuki Suda , Yasushi Takizawa , Kazunori Hibi
Inventor： Kazuyuki Suda , Yasushi Takizawa , Kazunori Hibi
CPC classification number: C23C18/48 , C23C18/42 , Y10T428/12889 , Y10T428/265
Abstract: An object of the present invention is to provide an electroless displacement gold plating solution, an additive for use in preparing the plating solution, and a metal composite material obtained by treatment with the plating solution. The present invention provides an electroless displacement gold plating solution containing a water-soluble gold compound, a complexing agent, and a water-soluble silver compound, and optionally a water-soluble thallium compound, a water-soluble lead compound, a water-soluble copper compound or a water-soluble nickel compound, or any combination thereof. The plating solution has good stability and, even not only immediately after the preparation but also after a lapse of a certain time period from the preparation, can be used for production of a metal composite material exhibiting a even plated appearance and also having a thick gold coating film.
Abstract translation: 本发明的目的是提供一种无电位移镀金液，用于制备电镀液的添加剂以及通过电镀液处理得到的金属复合材料。 本发明提供一种含有水溶性金化合物，络合剂和水溶性银化合物以及任选的水溶性铊化合物，水溶性铅化合物，水溶性 铜化合物或水溶性镍化合物，或其任意组合。 电镀溶液具有良好的稳定性，即使不仅在制备后立即，而且在制剂经过一段时间后，也可以用于制造具有均匀镀层外观的金属复合材料，并且还具有厚金 涂膜。
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54.发明授权
公开(公告)号：US6432200B2
公开(公告)日：2002-08-13
申请号：US72446700
申请日：2000-11-29
Applicant: LILLY TECHNOLOGIES INC
Inventor： SOLTYS JOSEPH
IPC: B32B15/04 , B32B17/06 , C03C17/36 , C03C17/38 , C23C18/16 , C23C18/31 , C23C18/42 , C23C28/00 , B05C5/02
CPC classification number: C03C17/3605 , C03C17/36 , C03C17/3644 , C03C17/3663 , C03C17/38 , Y10S423/08
Abstract: An apparatus is provided for making mirrors having enhanced reflective layer resistance to corrosion. The reflective layer of the mirror, typically silver, is contacted, preferably simultaneously, with a first solution containing a specific cation and a second solution containing a specific anion, or alkaline material which forms hydroxyl ions, the specific cation and specific anion or hydroxyl ion reacting to form a water insoluble precipitate on the silver surface. The mirror may then be painted to provide additional corrosion resistance to the mirror. The apparatus device for forming the precipitate eliminates the need for a device to form a copper layer on the silver surface and the device may be incorporated into existing mirror production lines as a replacement for the copper layering device. Also provided are mirrors made using the apparatus of the invention. A preferred cation containing solution contains tin (e.g., SnCl2) and a preferred anion containing solution contains hydroxyl ions (e.g, NaOH).
Abstract translation: 提供了一种用于制造具有增强的反射层抗腐蚀性的反射镜的装置。 反射镜的反射层（通常为银）优选同时与含有特定阳离子的第一溶液和含有特定阴离子的第二溶液或形成羟基离子的碱性材料，特定阳离子和特定阴离子或羟基离子 反应在银表面上形成水不溶性沉淀。 然后可以对镜子进行涂漆以对镜子提供额外的耐腐蚀性。 用于形成沉淀的装置装置消除了在银表面上形成铜层的装置的需要，并且该装置可以被并入现有的反射镜生产线中，作为铜层装置的替代。 还提供了使用本发明的设备制成的镜子。 优选的含阳离子溶液含有锡（例如SnCl 2），优选的含阴离子的溶液含有羟基离子（例如NaOH）。
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55.发明授权
公开(公告)号：US06017580A
公开(公告)日：2000-01-25
申请号：US143685
申请日：1998-08-28
Applicant: Joseph Soltys
Inventor： Joseph Soltys
IPC: B32B15/04 , B32B17/06 , C03C17/36 , C03C17/38 , C23C18/16 , C23C18/31 , C23C18/42 , C23C28/00 , B05D5/06 , B05D5/00
CPC classification number: C03C17/3605 , C03C17/36 , C03C17/3644 , C03C17/3663 , C03C17/38 , Y10S423/08
Abstract: A method is provided for making mirrors having enhanced reflective layer resistance to corrosion. The reflective layer of the mirror, typically silver, is contacted, preferably simultaneously, with a first solution containing a specific cation and a second solution containing a specific anion, or alkaline material which forms hydroxyl ions, the specific cation and specific anion or hydroxyl ion reacting to form a water insoluble precipitate on the silver surface. The mirror may then be painted to provide additional corrosion resistance to the mirror. The method eliminates the need for a copper layer on the silver surface and the method may be incorporated into existing mirror production lines as a replacement for the copper layering step. Also provided are an apparatus for making the mirrors and the mirrors made using the method and apparatus of the invention. A preferred cation containing solution contains tin (e.g., SnCl.sub.2) and a preferred anion containing solution contains hydroxyl ions (e.g., NaOH).
Abstract translation: 提供了一种用于制造具有增强的反射层耐腐蚀性的反射镜的方法。 反射镜的反射层（通常为银）优选同时与含有特定阳离子的第一溶液和含有特定阴离子的第二溶液或形成羟基离子的碱性材料，特定阳离子和特定阴离子或羟基离子 反应在银表面上形成水不溶性沉淀。 然后可以对镜子进行涂漆以对镜子提供额外的耐腐蚀性。 该方法消除了对银表面上的铜层的需要，并且该方法可以被并入现有的反射镜生产线中作为铜层叠步骤的替代。 还提供了使用本发明的方法和装置制造镜子和镜子的装置。 优选的含阳离子溶液含有锡（例如SnCl 2），优选的含阴离子的溶液含有羟基离子（例如NaOH）。
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公开(公告)号：US5955141A
公开(公告)日：1999-09-21
申请号：US932392
申请日：1997-09-17
Applicant: Andrew McIntosh Soutar , Peter Thomas McGrath
Inventor： Andrew McIntosh Soutar , Peter Thomas McGrath
Abstract: In PCB manufacture, the pads and/or through-holes of a bare board are protected prior to mounting of other components by a silver plating process. The silver plate is applied from a plating composition by a replacement process in which silver ions oxidized copper and deposit a layer of silver at the surface. In the aqueous plating composition the silver ions are maintained in solution by the incorporation of a multidentate complexing agent. The compositions may contain a silver tarnish inhibitor and are free of reducing agent capable of reducing silver ions to silver metal, halide ions and substantially free of non-aqueous solvent. Surface mounted components can be soldered direct to the silver coated contact using any commercially available solder. Silver does not deposit onto solder mask, but only onto metal which is less electropositive than silver.
Abstract translation: 在PCB制造中，裸板的焊盘和/或通孔在通过镀银工艺安装其它部件之前得到保护。 通过银离子氧化铜并在表面沉积一层银的替换过程，由镀覆组合物施加银板。 在水性电镀组合物中，通过掺入多齿络合剂将银离子保持在溶液中。 组合物可以含有银晦暗抑制剂，并且不含能够将银离子还原成银金属，卤离子并基本上不含非水溶剂的还原剂。 表面安装的部件可以使用任何市售的焊料直接焊接到镀银触点。 银不会沉积在焊料掩模上，而只能沉积在比银正电的金属上。
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公开(公告)号：US5910340A
公开(公告)日：1999-06-08
申请号：US931832
申请日：1997-09-17
Applicant: Hiroki Uchida , Masayuki Kiso , Takayuki Nakamura , Tohru Kamitamari , Rumiko Susuki , Koichiro Shimizu
Inventor： Hiroki Uchida , Masayuki Kiso , Takayuki Nakamura , Tohru Kamitamari , Rumiko Susuki , Koichiro Shimizu
IPC: C23C18/34 , C23C18/42 , H01L21/302
Abstract: To an electroless nickel plating solution comprising a water-soluble nickel salt, a reducing agent, and a complexing agent is added a polythionate or dithionite. The invention also provides a high-build electroless gold plating method comprising the steps of immersing a workpiece in the electroless nickel plating bath, thereby chemically depositing a nickel coating on the workpiece, and immersing the nickel-plated workpiece in an electroless gold plating bath, thereby chemically depositing a gold coating on the workpiece.
Abstract translation: 向包含水溶性镍盐，还原剂和络合剂的无电镀镍溶液中加入多硫酸盐或连二亚硫酸盐。 本发明还提供了一种高结构化学镀金方法，包括以下步骤：将工件浸入无电镀镍浴中，从而在工件上化学沉积镍涂层，并将镀镍工件浸入无电镀金浴中， 从而在工件上化学沉积金涂层。
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58.发明授权
公开(公告)号：US5312480A
公开(公告)日：1994-05-17
申请号：US42631
申请日：1993-04-05
Applicant: Marion Lotze , Hans Mehner
Inventor： Marion Lotze , Hans Mehner
IPC: C07F1/12 , C04B41/46 , C07C323/52 , C23C18/42
CPC classification number: C07C323/52 , C03C17/009 , C04B41/009 , C04B41/5116 , C04B41/88 , C07C2103/66
Abstract: Novel gold(I) mercaptocarboxylic acid esters of the formula (I) ##STR1## in which X is a C.sub.1 - to C.sub.3 alkylene group and Z is a group from the series tricyclo(5,2,1,0.sup.2.6)decane-8- or -9-yl or tricyclo(5,2,1,0.sup.2.6)decyl-3- or -4-methyl. These esters can be prepared from mercaptocarboxylic acid esters of the formula (II) ##STR2## and from a gold(I) chloride-dialkylsulfide complex. The novel esters can be used in gold preparations for gilding solid bases, especially ceramic materials. Compared to known gold(I) mercaptocarboxylic acid esters, the novel esters result in considerably shorter drying times for gold preparations.
Abstract translation: 式（I）的新型金（I）巯基羧酸酯，其中X是C 1 -C 3亚烷基，Z是来自三环（5,2,1,02.6）癸烷-8- 或-9-基或三环（5,2,1,02.6）癸基-3-或-4-甲基。 这些酯可以由式（II）的巯基羧酸酯和氯化金（I） - 二烷基硫化物络合物制备。 新的酯可用于金制剂中，用于烫发固体碱，特别是陶瓷材料。 与已知的金（I）巯基羧酸酯相比，新型酯对金制剂的干燥时间要短得多。
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公开(公告)号：US5186984A
公开(公告)日：1993-02-16
申请号：US545439
申请日：1990-06-28
Applicant: James D. Gabbert
Inventor： James D. Gabbert
IPC: C23C18/42
CPC classification number: C23C18/42
Abstract: A cyanide-free, ammoniacal silver solution comprising a chelant, e.g. EDTA, and soluble copper, e.g. cupric nitrate, at a level of at least about 1 mole copper/mole silver provides silver replacement coatings on copper-coated articles. Silver coatings have a low surface electrical resistivity, e.g. as low as about 0.02 to 0.05 ohms/square.
Abstract translation: 一种不含氰化物的氨溶液，其包含螯合剂，例如， EDTA和可溶性铜，例如 硝酸铜，至少约1摩尔铜/摩尔银的水平提供铜涂层制品上的银替代涂层。 银涂层具有低的表面电阻率，例如 低至约0.02至0.05欧姆/平方。
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公开(公告)号：US5110633A
公开(公告)日：1992-05-05
申请号：US570499
申请日：1990-08-21
Applicant: Robert Cassat , Jean-Pierre Logel
Inventor： Robert Cassat , Jean-Pierre Logel
CPC classification number: C23C18/206 , C23C18/2013 , C23C18/208 , C23C18/2086 , C23C18/30 , C23C18/42 , H05K1/0373 , H05K2201/0236 , H05K2203/1157 , H05K2203/125 , H05K3/105 , H05K3/181
Abstract: A process for coating a plastics article with a thin layer of noble metal, wherein said plastics article contains a finely particulate, homogenized filler selected from the group consisting of MnO, NiO, Cu.sub.2 O, SnO and Bi.sub.2 O.sub.3, and said plastics article is coated with an acid aqueous solution of a noble metal salt.
Abstract translation: 一种用贵金属薄层涂覆塑料制品的方法，其中所述塑料制品含有选自由MnO，NiO，Cu2O，SnO和Bi2O3组成的组的精细颗粒的均化填料，并且所述塑料制品涂覆有 酸性贵金属盐水溶液。
