Abstract:
In DRAM comprising a read pass transistor, a write pass transistor and a storage transistor, a depletion transistor is connected to a source of the storage transistor. On a part of the source and drain of the depletion transistor, by forming an impurity region of same conductivity as that of the substrate on which the transistors are formed, a substrate voltage applied to the substrate is supplied to the storage transistor through the depletion transistor. An additional metal wire for connecting the source of the storage transistor to Vss voltage(ground voltage or substrate voltage)terminal and a contact hole area for such metal wire are not required. Accordingly, a high integration of the semiconductor can be accomplished and a a reduction of reliability thereof can be decreased.
Abstract:
A memory 200 including an array 201 of rows and columns of 2-transistor, 1-capacitor memory cells 301 of the cells of each row coupled to first and second wordlines 303a, 303b and the cells of each column coupled to a pair of bitlines 302a, 302b. Refresh circuitry 208 activates the first wordline 303a plus selected said row and refreshes the cells 301 of that row through a first one of the bitlines 302a of each of the columns. Data access circuitry 202, 204 substantially simultaneously activates the second said wordline 303b of a second selected row and accesses selected cells of the second row through a second one of the bitlines 302b in the corresponding columns.
Abstract:
A DRAM cell is provided which includes a read bit line capable of being precharged to a first voltage level, a write bit line capable of carrying data, a read word line capable of being asserted at a second voltage level, and a write word line capable of being asserted at about the first voltage level. A first switching device having an enable input is coupled between the read bit line and the word read line. A second switching device having an enable input coupled to the write word line is coupled between the write bit line and the enable input of the first switching device.
Abstract:
When stored data of a plurality of memory cells (MC00 to MC03, MC10 to MC13, MC20 to MC23, MC30 to MC33) arranged in a matrix are sequentially read out, a reading access control circuit (101) outputs a row address and a column address to a row decoder (102) and a reading bit-line selector (103), respectively, for an access to the memory cells. The reading access control circuit (101) outputs the row address and the column address so that an n-type memory cell may be first selected by the reading bit-line selector (103) after activation of the selected reading word line every time one of the reading word lines (RWL0 to RWL3) is selected by the row decoder (102). With this configuration, data can be sequentially read out at higher speed from a plurality of memory cells arranged in a matrix.
Abstract:
The present invention provides a DRAM cell comprising: an input/output bit line; a first word line being activated by a write control signal; a second word line being activated by a read control signal; a first transistor having a first terminal coupled to said input/output bit line, a second terminal, and having a gate electrode coupled to said first word line for coupling said first terminal to said second terminal responsive to said write control signal; and a second transistor having a gate electrode coupled to said second word line, a first terminal coupled to a reference voltage terminal, a second terminal coupled to said input/output bit line, and having a floating gate electrode coupled to said second terminal of said first transistor for coupling said first terminal to said second terminal responsive to said read control signal, wherein the voltage level of said input/output bit line is transferred to said floating gate, and wherein said first transistor varies the threshold voltage of said second transistor at a write operation and is turned off at a read operation, and said second transistor transfers the voltage level of said reference voltage terminal to said input/output bit line at said read operation and is turned off at said write operation.
Abstract:
Individual cells in a memory array are structured and interconnected to permit detection and identification of the locations of errors known as Single Event Upsets (SEUs), with the correction and identification of an affected cell made using only a single parity bit for a group of cells in a memory array, eliminating the necessity for reading an entire memory in order to detect SEUs immediately, and eliminate large numbers of non-useful correction-code cells in order to increase the net useful density of cells in a memory and tolerate a larger rate of SEU events than for previous methods, additionally eliminate the need for purification of packaging materials for memory arrays by removing most radioactive materials and providing a further economic benefit by eliminating the need for organic coatings, which can cause reliability hazards, and to block alpha particles originating in packaging.
Abstract:
A semiconductor memory device comprises a memory array in which word lines are driven by a single decoder or a plurality of memory arrays driven by a plurality of decoders operating with the same row address, in the memory array or memory arrays memory cell units in which a plurality of memory cells are connected in series being arranged in the form of an array, a plurality of sense amplifier arrays constituted by arranging a plurality of sense amplifiers each provided for a pair of bit lines or a plurality of pairs of bit lines to read out data from the memory cells of the memory cell arrays, the sense amplifier arrays being divided into a plurality of blocks, and the blocks corresponding to one memory cell array, a register array having a plurality of registers for storing data read out by the plurality of sense amplifiers, the register array being divided into a plurality of blocks, and the blocks corresponding to the sense amplifier block and one memory cell array, and a control circuit for independently controlling the blocks of the sense amplifier arrays and the register array and independently reading out data from the registers in the blocks.
Abstract:
Dummy information of a third level, which is between first and second levels written in a plurality of memory cells, is written in a dummy memory cell from a source node through transistors. Thus, a potential difference is caused between a read bit line and a dummy read bit line in reading. A potential comparison circuit indicates the level of information read from any memory cell on the basis of the comparison result as to the potentials of the dummy read bit line and the read bit line. Thus, the read rate is increased, the read operation is stabilized and increase of the chip area is suppressed.
Abstract:
A DRAM memory having shared read/write lines. The DRAM memory is comprised of an array of 3T memory cells. Data is digitally stored in the form of capacitors that are either charged or discharged. Horizontal data lines are used to convey data bits to be stored in the array of memory cells. Vertical read/write lines are used to perform both read and write functions. Activating a single read/write line causes a bit of data from a memory cell to be placed onto a corresponding data line. Simultaneously, an inverted copy of that data bit is stored in an adjacent memory cell. Hence, instead of having a separate read line and a separate word line for each memory cell, the present invention has a dual function read/write word line.
Abstract:
A NAND-type dynamic semiconductor memory device having a folded bit architecture which reduces chip size and decreases array noise and soft error. The device is comprised of a plurality of memory cell groups, each group comprised of a plurality of bit memory cells connected in series, each bit memory cell having a MOS transistor and a capacitor. Two adjacent memory cell groups are connected respectively to one of a pair of bit lines. Each bit line is coupled respectively to a first one of the transistors located at the end of each memory cell group. A pair of first word lines are coupled respectively to the gates of the first one of the transistors coupled to the paired bit lines. A plurality of second word lines are each commonly coupled to the gates of corresponding ones of the transistors of the memory cell groups coupled to the paired bit lines.