公开(公告)号：US11711902B2

公开(公告)日：2023-07-25

申请号：US17645545

申请日：2021-12-22

申请人： GE INFRASTRUCTURE TECHNOLOGY LLC

发明人： Mariah Inez Hake ,  Mark Stefan Maier

IPC分类号： H05K7/14

CPC分类号： H05K7/1402 ,  H05K7/1424 ,  H05K7/1439

摘要： Systems and methods for improved circuit board removal and/or reinstallation are provided. A circuit board removal system can include a frame including a channel arranged in a plate of the frame. A disengagement slider can include a mounting surface and a first portion including a first cam surface, where the disengagement slider is arranged within the frame. A separator can include a second cam surface and can be arranged in the channel of the plate. The first cam surface and the second cam surface can be nested with each other when the disengagement slider is in an inserted position. The disengagement slider can be configured to slide the separator in the longitudinal direction when the disengagement slider is removed from the frame due to the interaction of the first cam surface with the second cam surface.