公开(公告)号：US5764053A

公开(公告)日：1998-06-09

申请号：US502509

申请日：1995-07-14

Applicant: John Robbins ,  Shachar Nadler

Inventor： John Robbins ,  Shachar Nadler

IPC: G01J3/02 ,  G01J3/04 ,  G01J3/28 ,  G01J3/32 ,  G01B7/14 ,  G01J3/42 ,  G01N33/00

CPC classification number: G01J3/02 ,  G01J3/0232 ,  G01J3/04 ,  G01J3/32 ,  G01J2003/2866

Abstract: An apparatus for use in Differential Optical Absorption Spectroscopy (DOAS) or in other optical apparatus provides a moveable or oscillating aperture. It has a sensor for detecting the position of the aperture, and a drive for oscillating the aperture; the drive and sensor can comprise coils forming a linear variable differential transformer, and the aperture can be spring biased to a neutral position. A control circuit is connected between the coil or other sensor and the drive coils, so that the motion of the aperture follows a desired profile. This enables significant parts of the apertures motion to be constrained to be linear. The aperture can be provided in a shuttle mounted on extension arms, whose ends are connected to resilient biassing means which serve both to support the shuttle and to bias it. More preferably, extension arms extend through pole pieces of magnets, which provide a magnetic field for drive coils. Another aspect of the invention provides a telescope apparatus, for a DOAS technique, including a baffle moveable between calibration and operational positions. This enables light from the light source to be transmitted either for measurement or for calibration allowing for changes in lamp output, etc.

Abstract translation: 用于差分光吸收光谱（DOAS）或其他光学装置的装置提供可移动或摆动的光圈。 它具有用于检测孔的位置的传感器和用于使孔径摆动的驱动器; 驱动器和传感器可以包括形成线性可变差动变压器的线圈，并且孔可以被弹簧偏压到中立位置。 控制电路连接在线圈或其它传感器与驱动线圈之间，使得孔的运动遵循期望的轮廓。 这使得孔的大部分运动被限制为线性的。 孔可以设置在安装在延伸臂上的穿梭件中，其端部连接到弹性偏压装置，其用于支撑梭子并偏置。 更优选地，延伸臂延伸穿过磁体的极片，磁体片为驱动线圈提供磁场。 本发明的另一方面提供了一种用于DOAS技术的望远镜装置，其包括可在校准位置和操作位置之间移动的挡板。 这使得来自光源的光被传输用于测量或校准，从而允许灯输出的变化等。

公开(公告)号：US5197271A

公开(公告)日：1993-03-30

申请号：US674822

申请日：1981-03-22

Applicant: John Robbins ,  Ricky L. Boston

Inventor： John Robbins ,  Ricky L. Boston

IPC: H01L21/304 ,  H01L21/322

CPC classification number: H01L21/02016 ,  H01L21/3221

Abstract: A method of backside damaging a silicon semiconductor wafer by abrading the wafer in an abrasive powder is disclosed. The wafer is rotated or translated in the powder while the powder is being vibrated. A fixture holds one or more semiconductor wafers during the processing and allows the wafer to be rotated during processing if desired.

Abstract translation: 公开了通过研磨研磨粉末中的晶片来破坏硅半导体晶片的方法。 当粉末振动时，晶片被旋转或翻转成粉末。 夹具在加工期间保持一个或多个半导体晶片，并且如果需要，允许晶片在加工期间旋转。