公开(公告)号：US20140266219A1

公开(公告)日：2014-09-18

申请号：US13827953

申请日：2013-03-14

Applicant: APPLIED MATERIALS, INC.

Inventor： Gregory J. Wilson ,  Paul R. McHugh ,  Daniel J. Woodruff

IPC: G01N17/02

CPC classification number: G01N27/18 ,  G01N33/004 ,  G01N33/006

Abstract: A detection fixture is provided with a processor for electroplating a substrate such as a semiconductor wafer, to detect the level of electrolyte in a bowl of the processor. The detected electrolyte level is used in controlling entry of the substrate into the electrolyte, to achieve desired electrolyte wetting characteristics. The processor has a substrate holder supported on a lifter for lowering the substrate holder into the bowl. The detection fixture may emulate a substrate and be held by the substrate holder in the same way that the substrate holder holds a substrate. The lifter lowers the detection fixture until it makes contact with the electrolyte, with the position of the fixture indicative the electrolyte level. The detection fixture is then removed from the processor.

Abstract translation: 检测夹具设置有用于电镀诸如半导体晶片的基板的处理器，以检测处理器的碗中的电解质的水平。 检测到的电解质水平用于控制基板进入电解质，以达到所需的电解液润湿特性。 处理器具有支撑在升降器上的衬底保持器，用于将衬底保持器降低到碗中。 检测夹具可以模仿衬底并且以与衬底保持器保持衬底相同的方式由衬底保持器保持。 升降器降低检测夹具直到与电解液接触，夹具的位置表示电解液液位。 然后将检测夹具从处理器中取出。