摘要:
Optical couplers having attachment features are disclosed. A typical coupler according to the present invention couples an optical signal from an optical fiber to a channel waveguide by overlapping the cores of the optical fiber and channel waveguide along a portion of their waveguide lengths, with a spacing distance between the cores of not more than 20 microns for single-mode light coupling, and not more than 100 microns for multi-mode light coupling. This is in contrast to a prior art coupler, which seeks to position the ends of the two cores in a facing relationship. In embodiments according to the present invention, attachment films may be disposed in the overlapping regions to provide advantageous coupling arrangements and new types of opto-electric devices.
摘要:
Methods and apparatuses for measuring the optical properties of solids, gels, and liquids are disclosed. The apparatuses may be constructed on miniature substrates using conventional semiconductor wafer and packaging processes. The substrates may be mass-produced on wafers, which are then diced to provide individual miniature substrates. High measurement precision, low-manufacturing costs, and other benefits are provided by the present inventions.
摘要:
The present invention provides an optical interconnection platform, comprising a substrate, a plurality of integrated circuits attached to a surface of the substrate wherein each integrated circuit having an array of transmitters and an array of receivers, an optical integrated circuit module attached to an opposing surface of the substrate wherein the optical integrated circuit module comprising a highly transparent photosensitive material having an input microlens that collimate the light beams before entering the optical integrated circuit module and an output microlens that focuses the light beams into the array of receivers, and input and output Bragg diffractive gratings that are formed inside of the optical integrated circuit module.
摘要:
Disclosed are apparatuses and methods for fast and reliable integration of opto-electric components onto optical routing substrates. Accurate alignment of optical signals to and from the opto-electric components, and short electrical interconnect paths to the components to reduce signal delays to the devices on the components are enabled. In an exemplary embodiment, an attachment area is set out on the optical routing substrate to receive each component. One or more optical waveguides for coupling optical signals with the component are located adjacent to the attachment area. A plurality of conductive pads are located within the attachment area, and are for interconnecting to the component by way of bodies of solder, conductive adhesive, or the like. Interspersed between the conductive pads are a plurality of spacers that set a spacing distance between the attachment area and the opposing surface of the component, resulting in accurate alignment of optical signals.
摘要:
An apparatus for attenuating a light signal is disclosed. The apparatus causes optical attenuation in a waveguide, where the waveguide has an input port for receiving a light signal and an output port for output of an attenuated light signal. First, an electric field is generated in at least a portion of the waveguide, such that a first refractive index in that portion of the waveguide is changed to a second refractive index. Next, the light signal in the waveguide is directed from the input port to the output port through the electric field. And lastly, the light signal is attenuated as a function of the electric field. The light signal may be attenuated, for example, by changing the deflection angle, changing the beam collimation width or from emitting part of the light signal from the waveguide before the light signal reaches the output port.
摘要:
The present invention is directed to an apparatus and related methods related to an optical bump for optically coupling devices. An exemplary apparatus includes a first device, a second device, and at least one optical bump. The first device has a first surface including at least one first optically active area. The second device has a second surface including at least one second optically active area positioned in an opposed and spaced-apart relationship with respect to the at least one first optically active area. The first surface is separated from the second surface by a distance. The at least one optical bump is coupled to the first surface between the at least one first optically active area and the at least one second optically active area. The at least one optical bump has a height that is less than the distance between the first surface and the second surface. The at least one optical bump is configured to couple light between the at least one second optically active area and the at least one first optically active area.
摘要:
The intensity of signals in optical networks can be controlled using a variable optical attenuator (VOA). The present invention is a VOA that is particularly well suited for optical networks, for example to provide channel-by-channel normalization of gain control of wavelength division multiplexed signals. The inventive VOA includes a waveguide having a cladding that includes an electro-optical material and electrodes that produce an electric field within the electro-optical material when a voltage difference is applied to the electrodes. The VOA also includes a layer that is parallel to the core of the waveguide and that optically couples to the core to receive light from the attenuated signal. A power meter receives light from the layer as an indication of the amount of light attenuated from the signal and for controlling the voltage to the electrodes.
摘要:
Disclosed are apparatuses and methods for fast and reliable integration of opto-electric components onto optical routing substrates. Accurate alignment of optical signals to and from the opto-electric components, and short electrical interconnect paths to the components to reduce signal delays to the devices on the components are enabled. In an exemplary embodiment, an attachment area is set out on the optical routing substrate to receive each component. One or more optical waveguides for coupling optical signals with the component are located adjacent to the attachment area. A plurality of conductive pads are located within the attachment area, and are for interconnecting to the component by way of bodies of solder, conductive adhesive, or the like. Interspersed between the conductive pads are a plurality of spacers that set a spacing distance between the attachment area and the opposing surface of the component, resulting in accurate alignment of optical signals.
摘要:
A polyimide resin composition comprising a polyimide resin (A) and at least one 1H-tetrazole (B) selected from the group consisting of 1H-tetrazole, 5,5′-bis-1H-tetrazole, and derivatives thereof, and having an excellent rust preventing effect on copper and copper alloys.
摘要:
A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30° C. to 100° C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100° C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.