公开(公告)号：US20220102186A1

公开(公告)日：2022-03-31

申请号：US17643600

申请日：2021-12-10

Applicant: NGK INSULATORS, LTD.

Inventor： Hiroshi TAKEBAYASHI ,  Kenichiro AIKAWA ,  Tatsuya KUNO

IPC: H01L21/687 ,  C23C4/02 ,  C23C4/134

Abstract: A wafer placement table is a ceramic sintered body with a surface provided with multiple projections that support a wafer. Of the surface of the ceramic sintered body, the area provided with no projection is a mirror surface which has a surface roughness Ra of 0.1 μm or less. The projections are formed of an aerosol deposition film or a thermal spray film made of the same material as for the ceramic sintered body.

公开(公告)号：US20210398840A1

公开(公告)日：2021-12-23

申请号：US17465943

申请日：2021-09-03

Applicant: NGK INSULATORS, LTD.

Inventor： Kenichiro AIKAWA ,  Hiroshi TAKEBAYASHI ,  Tatsuya KUNO

IPC: H01L21/683

Abstract: A wafer placement table includes: an electrostatic chuck that is a ceramic sintered body in which an electrode for electrostatic adsorption is embedded; a cooling member which is bonded to a surface on an opposite side of a wafer placement surface of the electrostatic chuck, and cools the electrostatic chuck; a hole for power supply terminal, the hole penetrating the cooling member in a thickness direction; and a power supply terminal which is bonded to the electrode for electrostatic adsorption from the surface on the opposite side of the wafer placement surface of the electrostatic chuck, and is inserted in the hole for power supply terminal. The outer peripheral surface of a portion of the power supply terminal is covered with an insulating thin film that is formed by coating of an insulating material, the portion being inserted in the hole for power supply terminal.