公开(公告)号：US10686157B2

公开(公告)日：2020-06-16

申请号：US15707383

申请日：2017-09-18

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Akihiro Chida ,  Tomoya Aoyama

IPC: H01L51/52 ,  H01L51/00

Abstract: A highly reliable flexible light-emitting device is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, a light-emitting element between the first flexible substrate and the second flexible substrate, a first bonding layer; and a second bonding layer in a frame shape surrounding the first bonding layer. The first bonding layer and the second bonding layer are between the second flexible substrate and the light-emitting element. The light-emitting element includes layer containing a light-emitting organic compound between the pair of electrodes. The second bonding layer has a higher gas barrier property than the first bonding layer.

公开(公告)号：US10170662B2

公开(公告)日：2019-01-01

申请号：US14800892

申请日：2015-07-16

Applicant: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.

Inventor： Tomoya Aoyama ,  Ryu Komatsu ,  Takayuki Ohide

IPC: H01L33/00 ,  H01L51/00 ,  H01L21/768 ,  H01L25/075 ,  G02F1/13357 ,  G02B6/00 ,  H05K1/18 ,  H05K3/32 ,  G02F1/1335 ,  F21S6/00 ,  F21Y105/10 ,  F21Y115/10

Abstract: A method for manufacturing a circuit board includes a first process, a second process, a third process, and a fourth process. The first process includes a step of providing a circuit and an electrode over a first surface of a first substrate. The second process includes a step of providing a reflective layer on the first surface side of the first substrate or a second surface side of a second substrate. The third process includes a step of attaching the first surface and the second surface to each other with a bonding layer therebetween to face each other so that the reflective layer overlaps with the electrode and the reflective layer surrounds part of the electrode. The fourth process includes a step of irradiating at least part of the reflective layer with laser light from a side opposite to the electrode.

公开(公告)号：US10164219B2

公开(公告)日：2018-12-25

申请号：US15671453

申请日：2017-08-08

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Tomoya Aoyama ,  Akihiro Chida ,  Ryu Komatsu

IPC: H01L51/52 ,  H01L51/56 ,  H01L51/00

Abstract: To improve the yield in a peeling process and improve the yield in a manufacturing process of a flexible light-emitting device or the like, a peeling method includes a first step of forming a peeling layer over a first substrate, a second step of forming a layer to be peeled including a first layer in contact with the peeling layer over the peeling layer, a third step of curing a bonding layer in an overlapping manner with the peeling layer and the layer to be peeled, a fourth step of removing part of the first layer overlapping with the peeled layer and the bonding layer to form a peeling starting point, and a fifth step of separating the peeling layer and the layer to be peeled. The peeling starting point is preferably formed by laser light irradiation.

公开(公告)号：US20180026228A1

公开(公告)日：2018-01-25

申请号：US15707383

申请日：2017-09-18

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Akihiro Chida ,  Tomoya Aoyama

IPC: H01L51/52

Abstract: A highly reliable flexible light-emitting device is provided. The light-emitting device includes a first flexible substrate, a second flexible substrate, a light-emitting element between the first flexible substrate and the second flexible substrate, a first bonding layer; and a second bonding layer in a frame shape surrounding the first bonding layer. The first bonding layer and the second bonding layer are between the second flexible substrate and the light-emitting element. The light-emitting element includes layer containing a light-emitting organic compound between the pair of electrodes. The second bonding layer has a higher gas barrier property than the first bonding layer.

公开(公告)号：US20160240822A1

公开(公告)日：2016-08-18

申请号：US15141157

申请日：2016-04-28

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Akihiro Chida ,  Kaoru Hatano ,  Tomoya Aoyama ,  Ryu Komatsu ,  Masatoshi Kataniwa

IPC: H01L51/56 ,  H01L27/32 ,  H01L51/52

CPC classification number: H01L51/56 ,  H01L27/1225 ,  H01L27/3246 ,  H01L27/3276 ,  H01L51/5203 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5253 ,  H01L2227/323 ,  H01L2227/326 ,  H01L2251/5338 ,  H01L2251/5361

Abstract: A method for exposing an electrode terminal covered with an organic film in a light-emitting device without damaging the electrode terminal is provided. In a region of the electrode terminal to which electric power from an external power supply or an external signal is input, an island-shaped organic compound-containing layer is formed and the organic film is formed thereover. The organic film is removed by utilizing low adhesion of an interface between the organic compound-containing layer and the electrode terminal, whereby the electrode terminal can be exposed without damage to the electrode terminal.

公开(公告)号：US20150044792A1

公开(公告)日：2015-02-12

申请号：US14450463

申请日：2014-08-04

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Tomoya Aoyama ,  Akihiro Chida ,  Ryu Komatsu

IPC: H01L51/56 ,  H01L51/52 ,  H01L51/00

CPC classification number: H01L51/56 ,  H01L51/0024 ,  H01L51/003 ,  H01L51/524

Abstract: To improve the yield in a peeling process and improve the yield in a manufacturing process of a flexible light-emitting device or the like, a peeling method includes a first step of forming a peeling layer over a first substrate, a second step of forming a layer to be peeled including a first layer in contact with the peeling layer over the peeling layer, a third step of curing a bonding layer in an overlapping manner with the peeling layer and the layer to be peeled, a fourth step of removing part of the first layer overlapping with the peeled layer and the bonding layer to form a peeling starting point, and a fifth step of separating the peeling layer and the layer to be peeled. The peeling starting point is preferably formed by laser light irradiation.

Abstract translation: 为了提高剥离工序的产率，提高柔性发光装置等的制造工序的成品率，剥离方法包括在第一基板上形成剥离层的第一工序，第二工序， 要剥离的层包括在剥离层上与剥离层接触的第一层，第三步骤，以与剥离层和被剥离层重叠的方式固化接合层;第四步骤， 第一层与剥离层和接合层重叠以形成剥离起点，以及分离剥离层和被剥离层的第五步骤。 剥离起始点优选通过激光照射形成。

公开(公告)号：US08815419B2

公开(公告)日：2014-08-26

申请号：US13964161

申请日：2013-08-12

Applicant: Semiconductor Energy Laboratory Co., Ltd.

Inventor： Yuji Iwaki ,  Satoshi Seo ,  Takahiro Kawakami ,  Hisao Ikeda ,  Junichiro Sakata ,  Tomoya Aoyama

IPC: H05B33/12

CPC classification number: H01L51/0052 ,  H01L51/0071 ,  H01L51/0081 ,  H01L51/5052 ,  H01L51/5088 ,  H05B33/22 ,  Y10S428/917

Abstract: A light emitting device comprises a pair of electrodes and a mixed layer provided between the pair of electrodes. The mixed layer contains an organic compound which contains no nitrogen atoms, i.e., an organic compound which dose not have an arylamine skeleton, and a metal oxide. As the organic compound, an aromatic hydrocarbon having an anthracene skeleton is preferably used. As such an aromatic hydrocarbon, t-BuDNA, DPAnth, DPPA, DNA, DMNA, t-BuDBA, and the like are listed. As the metal oxide, molybdenum oxide, vanadium oxide, ruthenium oxide, rhenium oxide, and the like are preferably used. Further, the mixed layer preferably shows absorbance per 1 μm of 1 or less or does not show a distinct absorption peak in a spectrum of 450 to 650 nm when an absorption spectrum is measured.

Abstract translation: 发光器件包括一对电极和设置在该对电极之间的混合层。 混合层含有不含氮原子的有机化合物即不具有芳胺骨架的有机化合物和金属氧化物。 作为有机化合物，优选使用具有蒽骨架的芳香族烃。 作为这样的芳烃，列举了t-BuDNA，DPAnth，DPPA，DNA，DMNA，t-BuDBA等。 作为金属氧化物，优选使用氧化钼，氧化钒，氧化钌，氧化铼等。 此外，当测量吸收光谱时，混合层优选显示每1μm的吸光度为1或更小，或者在450至650nm的光谱中不显示不同的吸收峰。