摘要:
An imaging apparatus which outputs image data to be processed by an image processing apparatus. The imaging apparatus includes an image acquiring unit, a storage, and a communication unit. The image acquiring unit is adapted to acquire image data from an image storing medium. The storage is adapted to store information of an image processing condition suited to the image processing apparatus. The information is usable to control image processing for the image data acquired by the image acquiring unit. The communication unit is adapted to communicate with the image processing apparatus to transmit the image data and the information of an image processing condition.
摘要:
The invention provides an ultra-sonic jet multi-photon resonance ionization type mass analyzing device. The laser beam ionization mass analyzing device includes a pulsed gas ejecting device 12 for ejecting in pulse mode carrier gas containing sample molecules into a vacuum vessel 17, a laser beam irradiation system for irradiating laser beam for selective photo-reaction of sample molecules in said pulsed gas, repeller and extraction electrodes 18 and 19 generating an electric field for extraction of sample molecular ions generated by the photo reaction and a mass analyzing device 26 for mass analysis of extracted sample molecular ions. The laser beam irradiation system is set to irradiate laser beam to sample molecules near a position whereat a pressure time distribution of pulsed gas translating in the vacuum vessel 17 transitions from a flat-top pressure distribution to a triangular pressure distribution.
摘要:
The invention provides a semiconductor chip manufacturing method including the steps of: forming a concave portion extended in the thickness direction of a semiconductor substrate which has a front surface and a rear surface and has a function device formed on the front surface, from the front surface; forming an oxidation preventive film made of an inert first metal material by supplying the first metal material onto the inner wall surface of the concave portion; supplying a second metal material containing a metal which is oxidized more easily than the first metal material to the inside of the concave portion after the step of forming the oxidation preventive film; electrically connecting the second metal material supplied to the inside of the concave portion and the function device; and thinning the semiconductor substrate so that the thickness thereof becomes thinner than the depth of the concave portion by removing the semiconductor substrate from the rear surface while leaving the oxidation preventive film.
摘要:
The connector includes a connector housing having two terminal fittings and terminal receiving chambers for receiving the terminal fittings, and a spacer 4 to be inserted into the connector housing through an opening. A receptacle for inserting an unlocking jig is formed on the spacer. The receptacle is opened at an outer wall of the spacer and a boundary wall to the connector housing 3. The receptacle is disposed in a manner not to spread across two terminal-receiving chambers. The receptacle communicates with one of the terminal-receiving chambers. A block of a main body of the spacer blocks a path between the receptacle and the other terminal-receiving chamber.
摘要:
An information processing apparatus includes an image taking means for taking images of a subject, a class-classification means for classifying a first image outputted by the image taking means into a class according to a characteristics thereof, a storage means for storing plural coefficient memories having different image taking conditions at the time of image taking, which store prediction coefficients according to the class acquired by learning, a designation means for designating one coefficient memory from among the plural coefficient memories based on the image taking condition when the image was taken by the image taking means, and a calculation means for calculating a second image in which noise is removed from the first image by calculating a prediction coefficient of the class of the first image, which is in the designated coefficient memory.
摘要:
A solid state radiation sensor, in which an electrode is disposed on each side of a recording photoconductive layer, and charges generated in the recording photoconductive layer by the irradiation of radiation, with a predetermined bias voltage being applied between the electrodes, are detected as electrical signals. Here, a predetermined region is provided between the electrodes, and the average density of an alkali metal in the predetermined region is greater than or equal to 10 times the average density of the alkali metal in the area between the electrodes other than the predetermined region.
摘要:
The connector includes a connector housing having two terminal fittings and terminal receiving chambers for receiving the terminal fittings, and a spacer 4 to be inserted into the connector housing through an opening. A receptacle for inserting an unlocking jig is formed on the spacer. The receptacle is opened at an outer wall of the spacer and a boundary wall to the connector housing 3. The receptacle is disposed in a manner not to spread across two terminal-receiving chambers. The receptacle communicates with one of the terminal-receiving chambers. A block of a main body of the spacer blocks a path between the receptacle and the other terminal-receiving chamber.
摘要:
A conveyance system for a semiconductor wafer can be used without any change before and after a support plate is adhered to the wafer. Also, the finish accuracy of the wafer and the positioning accuracy between the wafer and the support plate can be relaxed, thus improving the manufacturing efficiency. The wafer is formed on its peripheral portion with a stepped portion, which is deeper than a finished thickness obtained by partial removal of the rear surface thereof and which can be eliminated by the partial removal of the wafer rear surface. The separation portion has a length which extends radially outward from a flat surface, and which is greater than a total sum of a maximum-minimum difference between the finish allowances of the diameters of the wafer and the support plate, and a maximum value of a positioning error between the wafer and the support plate generated upon adhesion thereof.
摘要:
The light radiating conditions selecting device contains a) an input device for entering at least any one item of information on i) a component; ii) a board on which the component is soldered; and iii) solder for soldering the component; b) a storage for storing at least any one of databases on light radiation power and light radiation time for soldering; c) a calculator for determining light radiating conditions according to the information entered through the input device and the database stored in the storage; d) and an output device for outputting the light radiating conditions determined by the calculator.
摘要:
A data access apparatus has a memory portion including plural memory banks. A data storage control portion stores the pixel data in the plural memory banks with the pixel data being divided into the plural memory banks based on information on an access pattern of plural pixels set on a predetermined screen. A data access control portion reads pixel data relative to the plural pixels specified by the access pattern at the same time from the plural memory banks at each set position in which the set position of the access pattern moves from the start position thereof toward a pixel row direction. A selector portion transmits pixel data corresponding to respective pixels constituting each of the groups of pixels based on correspondence information on input and output. Each group of pixels includes a center pixel and peripheral pixels positioned at a periphery of the center pixel.