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公开(公告)号:US20060237330A1
公开(公告)日:2006-10-26
申请号:US11475583
申请日:2006-06-27
申请人: Antoine Manens , Alain Duboust , Siew Neo , Liang-Yuh Chen
发明人: Antoine Manens , Alain Duboust , Siew Neo , Liang-Yuh Chen
IPC分类号: B23H7/00
CPC分类号: B24B49/04 , B23H5/06 , B23H5/08 , B24B37/013 , B24B37/042 , B24B37/046 , B24B49/16 , C25F3/02 , C25F7/00 , G05B2219/45232 , G05B2219/49085 , H04N1/00
摘要: Method and apparatus for process control of electro-processes. The method includes electro-processing a wafer by the application of two or more biases and determining an amount of charge removed as a result of each bias, separately. In one embodiment, an endpoint is determined for each bias when the amount of charge removed for a bias substantially equals a respective target charge calculated for the bias.
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公开(公告)号:US20060217049A1
公开(公告)日:2006-09-28
申请号:US11418557
申请日:2006-05-06
申请人: Shijian Li , Liang-Yuh Chen , Alain Duboust
发明人: Shijian Li , Liang-Yuh Chen , Alain Duboust
IPC分类号: H01L21/306 , B24D11/00
摘要: Methods, articles of manufacture, and apparatus are provided for depositing and planarizing one or more layers of material on a substrate, or combinations thereof, are disclosed. In one embodiment, an article of manufacture is provided for polishing a substrate, comprising a polishing article having a polishing surface, a plurality of perforations formed in at least a portion of the polishing article for flow of material therethrough, and a plurality of grooves disposed in the polishing surface. The article of manufacture may be used in a method for processing a substrate, comprising positioning the substrate in an electrolyte solution containing a polishing article, optionally depositing a material on the substrate by an electrochemical deposition method, and polishing the substrate with the polishing article.
摘要翻译: 提供了方法,制品和装置,用于沉积和平坦化衬底上的一层或多层材料,或其组合。 在一个实施例中,提供了用于抛光衬底的制品,其包括具有抛光表面的抛光制品,在抛光制品的至少一部分中形成的用于材料流动的多个穿孔,以及多个槽, 在抛光面上。 制造物品可以用于处理基材的方法,包括将基底定位在含有抛光制品的电解质溶液中,任选地通过电化学沉积方法将材料沉积在基底上,并用抛光制品抛光基底。
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公开(公告)号:US20050161341A1
公开(公告)日:2005-07-28
申请号:US11087878
申请日:2005-03-22
申请人: Alain Duboust , Antoine Manens , Liang-Yuh Chen
发明人: Alain Duboust , Antoine Manens , Liang-Yuh Chen
CPC分类号: B24B37/042 , B23H5/08 , B24B37/046
摘要: A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using an electrode configured to electro polish a substrate edge are disclosed. The electro polishing of the substrate edge may occur simultaneously during electrochemical mechanical processing (Ecmp) of a substrate face. In one embodiment, a power source applies a bias between the substrate and at least two electrodes. The electrodes form a first electrode zone proximate the substrate edge at a sufficient potential to electro polish the substrate edge, thereby removing the conductive layer from the substrate edge. A second electrode zone with a lower potential than the first electrode zone is aligned proximate the substrate face during processing to enable Ecmp of the substrate face.
摘要翻译: 公开了一种用于使用构造成电抛光衬底边缘的电极沿着衬底的边缘去除沉积的导电层的方法和装置。 基板边缘的电抛光可以在基板表面的电化学机械处理(Ecmp)期间同时发生。 在一个实施例中,电源在衬底和至少两个电极之间施加偏压。 电极以足够的电位形成靠近衬底边缘的第一电极区域,以电抛光衬底边缘,从而从衬底边缘去除导电层。 具有比第一电极区域低的电位的第二电极区在处理期间靠近衬底面对准以使得衬底面的Ecmp能够被抑制。
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公开(公告)号:US06841057B2
公开(公告)日:2005-01-11
申请号:US10098796
申请日:2002-03-13
申请人: Ralph Wadensweiler , Alain Duboust , Liang-Yuh Chen , Manoocher Birang , Ratson Morad , Paul D. Butterfield
发明人: Ralph Wadensweiler , Alain Duboust , Liang-Yuh Chen , Manoocher Birang , Ratson Morad , Paul D. Butterfield
摘要: A method and apparatus are provided for polishing a substrate surface. In one aspect, an apparatus for polishing a substrate includes a conductive polishing pad and an electrode having a membrane disposed therebetween. The membrane is orientated relative the conductive pad in a manner that facilitates removal of entrained gas from electrolyte flowing towards the conductive pad. The apparatus may be part of an electro-chemical polishing station that may optionally be part of a system that includes chemical mechanical polishing stations.
摘要翻译: 提供了一种用于抛光衬底表面的方法和装置。 一方面,用于抛光衬底的装置包括导电抛光垫和在其间设置有膜的电极。 膜以相对于导电垫的方向定向,以便于从电解液中流出的夹带气体去除导电垫。 该设备可以是电化学抛光站的一部分,其可以可选地是包括化学机械抛光站的系统的一部分。
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公开(公告)号:US06773507B2
公开(公告)日:2004-08-10
申请号:US10215068
申请日:2002-08-07
申请人: Ravi Jallepally , Shih-Hung Li , Alain Duboust , Jun Zhao , Liang-Yuh Chen , Daniel A. Carl
发明人: Ravi Jallepally , Shih-Hung Li , Alain Duboust , Jun Zhao , Liang-Yuh Chen , Daniel A. Carl
IPC分类号: C30B2504
CPC分类号: C30B25/14 , C23C16/45521 , C23C16/45544 , C23C16/45565 , Y10T117/1008
摘要: Method and apparatus for depositing layers by atomic layer deposition. A virtual shower curtain is established between the substrate support and chamber to minimize the volume in which the reactants are distributed. A showerhead may be used to allow closer placement of the substrate thereto, further reducing the reaction volume. Zero dead space volume valves with close placement to the chamber lid and fast cycle times also improve the cycle times of the process.
摘要翻译: 用于通过原子层沉积沉积层的方法和装置。 在基板支撑件和室之间建立虚拟浴帘,以使反应物分布的体积最小化。 可以使用喷头来使衬底更靠近放置,进一步减小反应体积。 零静态空间体积阀具有紧密放置在室盖和快速循环时间,也提高了工艺的循环时间。
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公开(公告)号:US07628905B2
公开(公告)日:2009-12-08
申请号:US11475583
申请日:2006-06-27
申请人: Antoine P. Manens , Alain Duboust , Siew S. Neo , Liang-Yuh Chen
发明人: Antoine P. Manens , Alain Duboust , Siew S. Neo , Liang-Yuh Chen
IPC分类号: B23H3/02
CPC分类号: B24B49/04 , B23H5/06 , B23H5/08 , B24B37/013 , B24B37/042 , B24B37/046 , B24B49/16 , C25F3/02 , C25F7/00 , G05B2219/45232 , G05B2219/49085 , H04N1/00
摘要: Method and apparatus for process control of electro-processes. The method includes electro-processing a wafer by the application of two or more biases and determining an amount of charge removed as a result of each bias, separately. In one embodiment, an endpoint is determined for each bias when the amount of charge removed for a bias substantially equals a respective target charge calculated for the bias.
摘要翻译: 电工艺过程控制的方法和装置。 该方法包括通过施加两个或更多个偏压来电晶体处理,并且分别确定作为每个偏压的结果去除的电荷量。 在一个实施例中,当针对偏置移除的电荷量基本上等于针对偏置计算的相应目标电荷时,针对每个偏置确定端点。
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公开(公告)号:US07303462B2
公开(公告)日:2007-12-04
申请号:US11087878
申请日:2005-03-22
申请人: Alain Duboust , Antoine P. Manens , Liang-Yuh Chen
发明人: Alain Duboust , Antoine P. Manens , Liang-Yuh Chen
CPC分类号: B24B37/042 , B23H5/08 , B24B37/046
摘要: A method and apparatus for the removal of a deposited conductive layer along an edge of a substrate using an electrode configured to electro polish a substrate edge are disclosed. The electro polishing of the substrate edge may occur simultaneously during electrochemical mechanical processing (Ecmp) of a substrate face. In one embodiment, a power source applies a bias between the substrate and at least two electrodes. The electrodes form a first electrode zone proximate the substrate edge at a sufficient potential to electro polish the substrate edge, thereby removing the conductive layer from the substrate edge. A second electrode zone with a lower potential than the first electrode zone is aligned proximate the substrate face during processing to enable Ecmp of the substrate face.
摘要翻译: 公开了一种用于使用构造成电抛光衬底边缘的电极沿着衬底的边缘去除沉积的导电层的方法和装置。 基板边缘的电抛光可以在基板表面的电化学机械处理(Ecmp)期间同时发生。 在一个实施例中,电源在衬底和至少两个电极之间施加偏压。 电极以足够的电位形成靠近衬底边缘的第一电极区域,以电抛光衬底边缘,从而从衬底边缘去除导电层。 具有比第一电极区域更低的电位的第二电极区在处理期间靠近衬底面对齐以使得衬底面的Ecmp。
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公开(公告)号:US07285036B2
公开(公告)日:2007-10-23
申请号:US11562320
申请日:2006-11-21
申请人: Shou-Sung Chang , Stan D. Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
发明人: Shou-Sung Chang , Stan D. Tsai , Donald J. K. Olgado , Liang-Yuh Chen , Alain Duboust , Ralph M. Wadensweiler
CPC分类号: B24B37/22 , B23H5/06 , B23H5/08 , B23H5/10 , B24B37/046 , B24B37/11 , B24B37/24 , B24B37/26 , B24B49/16 , B24B53/017 , C25D17/10 , H01L21/32125
摘要: Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer and below the working surface of the processing layer. The upper surface of the electrode is at least partially exposed to the working surface by a plurality of apertures to provide an electrolyte pathway between the upper surface of the electrode and the working surface of the pad assembly.
摘要翻译: 提供了用于处理基板的垫组件的实施例。 焊盘组件包括处理层,其具有适于处理衬底的工作表面,耦合到处理层的下层并设置在处理层下方的电极,以及具有设置在处理层的工作表面下方和下方的上表面的电极 。 电极的上表面通过多个孔至少部分地暴露于工作表面,以在电极的上表面和焊盘组件的工作表面之间提供电解质通路。
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公开(公告)号:US07112270B2
公开(公告)日:2006-09-26
申请号:US10456851
申请日:2003-06-06
申请人: Antoine P. Manens , Alain Duboust , Siew S. Neo , Liang-Yuh Chen
发明人: Antoine P. Manens , Alain Duboust , Siew S. Neo , Liang-Yuh Chen
IPC分类号: H05K3/07
CPC分类号: B24B49/04 , B23H5/06 , B23H5/08 , B24B37/013 , B24B37/042 , B24B37/046 , B24B49/16 , C25F3/02 , C25F7/00 , G05B2219/45232 , G05B2219/49085 , H04N1/00
摘要: Method and apparatus for process control of electro-processes. The method includes electro-processing a wafer by the application of two or more biases and determining an amount of charge removed as a result of each bias, separately. In one embodiment, an endpoint is determined for each bias when the amount of charge removed for a bias substantially equals a respective target charge calculated for the bias.
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公开(公告)号:US20060163074A1
公开(公告)日:2006-07-27
申请号:US10456851
申请日:2003-06-06
申请人: Antoine Manens , Alain Duboust , Siew Neo , Liang-Yuh Chen
发明人: Antoine Manens , Alain Duboust , Siew Neo , Liang-Yuh Chen
IPC分类号: B23H5/00
CPC分类号: B24B49/04 , B23H5/06 , B23H5/08 , B24B37/013 , B24B37/042 , B24B37/046 , B24B49/16 , C25F3/02 , C25F7/00 , G05B2219/45232 , G05B2219/49085 , H04N1/00
摘要: Method and apparatus for process control of electro-processes. The method includes electro-processing a wafer by the application of two or more biases and determining an amount of charge removed as a result of each bias, separately. In one embodiment, an endpoint is determined for each bias when the amount of charge removed for a bias substantially equals a respective target charge calculated for the bias.
摘要翻译: 电工艺过程控制的方法和装置。 该方法包括通过施加两个或更多个偏压来电晶体处理,并分别确定作为每个偏压的结果去除的电荷量。 在一个实施例中,当针对偏置移除的电荷量基本上等于针对偏置计算的相应目标电荷时,针对每个偏置确定端点。
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