公开(公告)号：US07127451B1

公开(公告)日：2006-10-24

申请号：US09629972

申请日：2000-07-31

申请人： Yoshio Kimura

发明人： Yoshio Kimura

IPC分类号： G06F17/30 ,  G06F17/00 ,  G06F15/00 ,  G06F3/00

CPC分类号： G06F3/1285 ,  G06F3/1204 ,  G06F3/1226 ,  Y10S707/959 ,  Y10S707/99933 ,  Y10S707/99945

摘要： To provide a device searching client which can extract, for example, dynamic search conditions which are peculiar to a printing matter (print job), search a device, and correctly print, in a printer as a device searching client, a CRT has search condition input means for allowing the user to input not only static data but also dynamic data as search conditions.

摘要翻译： 为了提供可以提取例如打印物（打印作业）特有的动态搜索条件，搜索设备并且正确地在打印机中打印作为设备搜索客户端的设备搜索客户端，CRT具有搜索条件 输入装置，用于允许用户不仅输入静态数据，而且还输入动态数据作为搜索条件。

公开(公告)号：US06768049B2

公开(公告)日：2004-07-27

申请号：US10114468

申请日：2002-04-03

申请人： Hideki Nakayama ,  Yoshio Kimura ,  Kiyohito Murata

发明人： Hideki Nakayama ,  Yoshio Kimura ,  Kiyohito Murata

IPC分类号： H01L31058

CPC分类号： H02S10/30

摘要： A thermophotovoltaic power generating apparatus that heats an emitter by a combustion gas produced by fuel and air, and converts light radiated from the emitter into electric power by using photoelectric conversion elements. An air pipe is disposed in an internal hollow portion of the emitter, and a combustion gas supplier for supplying the combustion gas toward the emitter is disposed outside the emitter. The photoelectric conversion elements that receive radiated light are disposed further outside of the emitter. Therefore, residual heat of the combustion gas that has heated the emitter is utilized to heat the air needed for the combustion of fuel, and light radiated from the heated emitter is received by the photoelectric conversion elements. Thus, electric power generating efficiency can be improved.

摘要翻译： 一种通过燃料和空气产生的燃烧气体对发射体进行加热并且通过使用光电转换元件将从发射极辐射的光转换成电力的热光伏发电装置。 空气管设置在发射器的内部中空部分中，并且用于将燃烧气体朝向发射器供应的燃烧气体供应器设置在发射器的外部。 接收辐射光的光电转换元件设置在发射极的外侧。 因此，利用加热发射体的燃烧气体的余热来加热燃料燃烧所需的空气，并且由加热的发射体辐射的光被光电转换元件接收。 因此，能够提高发电效率。

公开(公告)号：US06746197B2

公开(公告)日：2004-06-08

申请号：US10202090

申请日：2002-07-25

申请人： Yoshio Kimura ,  Issei Ueda ,  Mitiaki Matsushita ,  Kazuhiko Ito

发明人： Yoshio Kimura ,  Issei Ueda ,  Mitiaki Matsushita ,  Kazuhiko Ito

IPC分类号： B65G4907

CPC分类号： H01L21/67778 ,  H01L21/67769 ,  H01L21/67772 ,  Y10S414/137 ,  Y10S414/139 ,  Y10S414/14

摘要： A substrate processing apparatus comprises a processing section for performing processing for a substrate, a substrate carrier transfer section into/out of which a substrate carrier holding a plurality of substrates is carried, and a substrate transfer mechanism for taking an unprocessed substrate out of the substrate carrier carried into the substrate carrier transfer section to deliver it to the processing section and for receiving a processed substrate from the processing section to deliver it into the substrate carrier placed on the substrate carrier transfer section. The substrate carrier transfer section shifts the position of the substrate carrier between a first position at which the substrate carrier is carried to/from the outside and a second position at which the substrate in the substrate carrier is delivered to/from the substrate transfer mechanism.

摘要翻译： 基板处理装置包括：用于对基板进行处理的处理部分，承载保持多个基板的基板载体的基板载体转移部分，以及用于将未处理的基板从基板取出的基板转移机构 携带到基板载体传送部分中的载体传送到处理部分并且用于从处理部分接收经处理的基板，以将其传送到放置在基板载体传送部分上的基板载体。 衬底载体传送部分将衬底载体的载体的第一位置/从外部移动到衬底载体的第一位置和衬底载体中的衬底被输送到衬底传送机构的第二位置之间移动衬底载体的位置。

公开(公告)号：US06579370B2

公开(公告)日：2003-06-17

申请号：US09852176

申请日：2001-05-10

申请人： Yoshio Kimura ,  Seiki Ishida

发明人： Yoshio Kimura ,  Seiki Ishida

IPC分类号： B05C1110

CPC分类号： H01L21/67109 ,  G03F7/168

摘要： An apparatus for the coating treatment comprises a coating section for coating a substrate with a process solution, a heating section for heating the substrate coated with the process solution, and a recovery section for recovering at least a part of the solvent vapor contained in the hot exhaust gas discharged from the heating section. The recovery section includes a cooling apparatus, and the hot exhaust gas containing a solvent vapor generated from the substrate when the substrate is subjected to a heating treatment is passed through the cooling apparatus so as to cool and condense at least a part of the solvent vapor contained in the hot exhaust gas so as to recover the solvent in the form of a liquid.

公开(公告)号：US06387552B1

公开(公告)日：2002-05-14

申请号：US09666538

申请日：2000-09-21

申请人： Yusuke Iyori ,  Yuichi Nakahara ,  Yoshio Kimura

发明人： Yusuke Iyori ,  Yuichi Nakahara ,  Yoshio Kimura

IPC分类号： B32B5102

CPC分类号： C22C29/04 ,  Y10T428/252

摘要： A TiCN-based cermet comprises 5-25 weight % of a binder phase mainly composed of Co and/or Ni, the balance being substantially a hard phase and inevitable impurities, the hard phase being mainly composed of carbide, nitride and/or carbonitride and containing at least Ti and W, the cermet having a cross-section microstructure in which the number of Ti-rich particles having an area of 0.02 &mgr;m2 or more is 1000 or less per a unit area of 1000 &mgr;m2.

摘要翻译： 基于TiCN的金属陶瓷包括5-25重量％的主要由Co和/或Ni组成的粘结相，余量基本上是硬相和不可避免的杂质，硬相主要由碳化物，氮化物和/或碳氮化物组成， 含有至少Ti和W的金属陶瓷具有横截面微观结构，其中面积为0.02mum2以上的富钛颗粒的数量为1000mum2的单位面积为1000以下。

公开(公告)号：US06368776B1

公开(公告)日：2002-04-09

申请号：US09270806

申请日：1999-03-17

申请人： Koji Harada ,  Junichi Nagata ,  Yasunori Kawakami ,  Masatoshi Kaneda ,  Norio Semba ,  Yoshio Kimura ,  Masami Akimoto ,  Yasuhiro Sakamoto ,  Nobuyuki Jinnai

发明人： Koji Harada ,  Junichi Nagata ,  Yasunori Kawakami ,  Masatoshi Kaneda ,  Norio Semba ,  Yoshio Kimura ,  Masami Akimoto ,  Yasuhiro Sakamoto ,  Nobuyuki Jinnai

IPC分类号： G03C500

CPC分类号： H01L21/67253 ,  H01L21/67109 ,  H01L21/6715 ,  H01L21/67248

摘要： A gas supplied from a gas source is exposed to an atmosphere above a liquid surface in a tank saving the liquid and thereafter is supplied around a wafer in a treatment chamber through a gas supply passage and a supply port. The gas supplied around the wafer uniformly flows from around the wafer toward above the center of the wafer and thereafter is discharged from an exhaust port which is formed at the top of the treatment chamber. Meanwhile, with respect to the wafer, heat treatment is performed by a heating mechanism and a predetermined PEB is carried out. The humidified gas is supplied into the treatment chamber, thereby preventing drying in the treatment chamber. Therefore, water in resist is not taken out, resulting in that a required resist pattern can be formed on the wafer.

摘要翻译： 从气源供给的气体暴露在储存液体的槽内的液面以上的气氛中，然后通过气体供给通路和供给口在处理室内的晶片供给。 在晶片周围供给的气体均匀地从晶片周围朝向晶片的中心方向流动，之后从形成在处理室顶部的排气口排出。 同时，相对于晶片，通过加热机构进行热处理，进行规定的PEB。 将加湿气体供给到处理室，防止处理室内的干燥。 因此，抗蚀剂中的水不会被取出，导致可以在晶片上形成所需的抗蚀剂图案。

公开(公告)号：US06183147B2

公开(公告)日：2001-02-06

申请号：US09312581

申请日：1999-05-14

申请人： Yoshio Kimura ,  Takahiro Okubo

发明人： Yoshio Kimura ,  Takahiro Okubo

IPC分类号： G03D500

CPC分类号： G03D5/00

摘要： A process solution supply system, comprising a process solution supply source from which a process solution is supplied, an intermediate storage mechanism for temporarily storing the process solution supplied from the process solution supply source and for supplying the process solution with predetermined pressure applied thereto, and a fluid supply mechanism for supplying the intermediate storage mechanism with a fluid which applies pressure to the process solution stored in the intermediate storage mechanism, the intermediate storage mechanism including a vessel which has an introduction port and a discharge port for the process solution, stores the process solution supplied through the introduction port and can discharge the process solution, and a compressing member, arranged inside the vessel to be located between the process solution and the fluid supplied from the fluid supply mechanism, for permitting pressure of the fluid to act on the process solution.

摘要翻译： 一种处理溶液供应系统，包括从其提供处理溶液的处理溶液供应源，用于临时存储从处理溶液供应源提供的处理溶液并用于向施加到其上施加预定压力的处理溶液供应的中间储存机构，以及 用于向中间存储机构供应向存储在中间存储机构中的处理溶液施加压力的流体的流体供给机构，包括具有用于处理液的引入口和排出口的容器的中间储存机构， 通过引入口提供的处理溶液并且可以排出处理溶液;以及压缩构件，布置在容器内部，以位于处理溶液和从流体供应机构供应的流体之间，以允许流体作用在流体供应机构上的压力 过程解决方案。

公开(公告)号：US5467788A

公开(公告)日：1995-11-21

申请号：US254916

申请日：1994-06-06

申请人： Yoshio Kimura

发明人： Yoshio Kimura

IPC分类号： A45D2/06 ,  A45D2/24 ,  A45D6/14 ,  B29C45/14 ,  A45D2/00

CPC分类号： A45D2/24

摘要： The present invention facilitates visually checking whether or not either end of a cover has been fixedly embedded, by insert molding, properly in a pair of clasps of a setting frame. In a hair curler of the present invention, the outer edge at either end of the cover is fixedly embedded in the pair of clasps, exposed out of the outer side surface of the pair of clasps. According to the method of manufacturing the hair curler of the present invention, the projecting portion with the outer edge side of the cover embedded, in the insert molding of the setting frame, is integrally formed on the outside surface of the pair of clasps, and then is cut off from the pair of clasps together with the outer edge side of the cover embedded in the projecting portion.

摘要翻译： 本发明通过在设置框架的一对扣中适当地嵌入成型，便于目视检查盖子的任一端是否被固定地嵌入。 在本发明的卷发器中，盖的任一端的外边缘固定地嵌入一对扣子中，露出在一对扣子的外侧表面之外。 根据本发明的卷发器的制造方法，在嵌套成型中嵌入有盖的外缘侧的突出部一体地形成在一对扣子的外表面上， 然后与嵌入在突出部分中的盖的外边缘侧一起从一对扣子上切下。

公开(公告)号：US5002008A

公开(公告)日：1991-03-26

申请号：US357279

申请日：1989-05-26

申请人： Mitsuru Ushijima ,  Osamu Hirakawa ,  Masami Akimoto ,  Yoshio Kimura ,  Noriyuki Anai

发明人： Mitsuru Ushijima ,  Osamu Hirakawa ,  Masami Akimoto ,  Yoshio Kimura ,  Noriyuki Anai

IPC分类号： B05B15/02 ,  B05C11/08 ,  G03F7/16

CPC分类号： B05B15/025 ,  B05C11/08 ,  G03F7/162

摘要： Disclosed is a coating apparatus for applying a resist or developing solution to a semiconductor wafer. This coating apparatus comprises a plurality of nozzles supplied with various resist from a resist source and each adapted to drip the different solution onto the wafer, a vessel in which the nozzles is kept on stand-by, while maintaining the liquids in a predetermined state in the vicinity of discharge port portions of the nozzles, when the nozzles need not be operated, and a nozzle operating mechanism for selecting one of the nozzles kept on stand-by in the vessel, and transporting the selected nozzle to the location of the wafer, whereby the resist is applied to the wafer by means of only the nozzle transported by the nozzle operating mechanism.

摘要翻译： 公开了一种将抗蚀剂或显影液施加到半导体晶片的涂布装置。 该涂布装置包括从抗蚀剂源供给各种抗蚀剂的多个喷嘴，每个喷嘴适于将不同的溶液滴到晶片上，其中喷嘴保持待机的容器，同时将液体保持在预定状态 喷嘴的排出口部分附近，当喷嘴不需要操作时，以及喷嘴操作机构，用于选择在容器中保持待机的喷嘴之一，并将所选择的喷嘴输送到晶片的位置， 由此通过仅由喷嘴操作机构传送的喷嘴将抗蚀剂施加到晶片。

公开(公告)号：US4913635A

公开(公告)日：1990-04-03

申请号：US177117

申请日：1988-04-04

申请人： Yoshihiro Ochiai ,  Masashi Yaguchi ,  Yoshio Kimura

发明人： Yoshihiro Ochiai ,  Masashi Yaguchi ,  Yoshio Kimura

IPC分类号： F04C18/02 ,  F04C27/00

CPC分类号： F04C27/008

摘要： A scroll type compressor includes a housing having an inner chamber and fluid inlet and outlet ports connected to the inner chamber. A fixed scroll is mounted within the housing and has a circular end plate from which a first spiral element extends. An orbiting scroll is also mounted within the housing for orbital motion with respect to the fixed scroll, and includes a circular end plate from which a second spiral element extends. The fixed scroll and the orbiting scroll are maintained angularly and radially offset from each other so that the spiral elements interfit to form a plurality of line contacts between their spiral curved surfaces which seal-off and define at least one pair of fluid pockets. The orbital movement of the orbiting scroll relative to the fixed scroll shifts the line contacts along the spiral curved surfaces of the spiral elements which changes the volume of the fluid pockets. The end plate of the fixed scroll partitions the inner chamber of the housing into a suction chamber and a discharge chamber. A sealing structure is disposed between the inner peripheral wall of the housing and the outer peripheral surface of the end plate of the fixed scroll. The sealing structure includes an annular cut-out portion, having an L-shaped sectional side view, formed in the outer peripheral surface of the end plate of the fixed scroll, an annular ridge formed in the inner peripheral wall of the housing and an O-ring seal element disposed between the annular cut-out portion and the annular ridge.