公开(公告)号：US20050175056A1

公开(公告)日：2005-08-11

申请号：US10774001

申请日：2004-02-06

Applicant: David Pepper ,  David Sumida

Inventor： David Pepper ,  David Sumida

IPC: H01S3/14 ,  H01S3/23 ,  H01S5/024 ,  H01S5/042 ,  H01S5/20 ,  H01S5/50

CPC classification number: H01S5/50 ,  H01S3/2308 ,  H01S3/2383 ,  H01S5/02423 ,  H01S5/0425 ,  H01S5/2063 ,  H01S2301/02

Abstract: A system and a method for providing more gain while minimizing the potential for parasitic oscillation and amplified spontaneous emissions in an optical amplifier or laser system, utilizing a partitioned monolithic gain element. The monolithic gain element being partitioned into discontinuous amplifying gain regions such that parasitic modes and amplified spontaneous emissions are substantially obviated

Abstract translation: 一种系统和方法，用于在利用分隔的单片增益元件的同时最大限度地减少光放大器或激光系统中的寄生振荡和放大的自发发射的可能性，从而提供更多的增益。 单片增益元件被划分为不连续的放大增益区域，使得寄生模式和放大的自发发射基本上被消除

公开(公告)号：US20050168950A1

公开(公告)日：2005-08-04

申请号：US11094191

申请日：2005-03-31

Applicant: Hokichi Yoshioka ,  Takayuki Yamaoka ,  Satoshi Senoo

Inventor： Hokichi Yoshioka ,  Takayuki Yamaoka ,  Satoshi Senoo

IPC: H01L23/473 ,  H01S5/024 ,  H05K7/20

CPC classification number: H01L23/473 ,  H01L2924/0002 ,  H01S5/02423 ,  H01L2924/00

Abstract: To prevent occurrence of distortion in semiconductor cooling device and to prevent the semiconductor chip from being separated away from the semiconductor cooling device in case the semiconductor chip and the semiconductor cooling device are thermally expanded, a semiconductor cooling device includes at least an upper plate, an intermediate plate and a lower plate, and has a coolant inlet portion, an outlet portion and a flow passage portion. The upper plate and the lower plate are composite plates constituted by plating copper maintaining a thickness of not smaller than 0.05 mm on one surface or on both surfaces of auxiliary plates made of a material having a tensile strength of not smaller than 1000 N/mm2, a heat conductivity of not smaller than 100 W/m·K and a coefficient of thermal expansion of not larger than 6.0 ppm/° C.

Abstract translation: 为了防止半导体冷却装置发生变形，并且在半导体芯片和半导体冷却装置热膨胀的情况下，为了防止半导体芯片与半导体冷却装置分离，半导体冷却装置至少包括上板， 中间板和下板，并且具有冷却剂入口部分，出口部分和流动通道部分。 上板和下板是通过在由抗拉强度不小于1000N / mm 2的材料制成的辅助板的一个表面上或在两个表面上镀铜而保持厚度不小于0.05mm的复合板， SUP> 2，热导率不小于100W / mK，热膨胀系数不大于6.0ppm /℃。

公开(公告)号：US20050069266A1

公开(公告)日：2005-03-31

申请号：US10942809

申请日：2004-09-17

Applicant: Hikaru Kouta ,  Hisaya Takahashi ,  Hideyuki Ono ,  Yuuzou Ikeda ,  Masaki Tunekane ,  Toshinori Ishida ,  Keiichi Kubota

Inventor： Hikaru Kouta ,  Hisaya Takahashi ,  Hideyuki Ono ,  Yuuzou Ikeda ,  Masaki Tunekane ,  Toshinori Ishida ,  Keiichi Kubota

IPC: H01S5/022 ,  H01S5/02 ,  H01S5/024 ,  H01S5/40 ,  G02B6/36

CPC classification number: H01S5/02264 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01S5/0021 ,  H01S5/02272 ,  H01S5/02276 ,  H01S5/02423 ,  H01S5/02476 ,  H01S5/4018 ,  H01S5/4025 ,  H01L2924/00014

Abstract: Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insulating spacer. A coil electrode is fitted in a V-shaped groove of the presser electrode. As the coil electrode is deformed slightly elastically, the coil electrode is pressed against the upper submount substrate.

Abstract translation: 底座基板通过硬焊料连接到激光二极管的两侧。 下底座基板和散热器通过软焊料连接在一起。 散热器和压脚电极经由绝缘间隔件以预定间隙固定。 线圈电极装配在压脚电极的V形槽中。 当线圈电极稍微弹性变形时，线圈电极被压靠在上基板上。

公开(公告)号：US20050030988A1

公开(公告)日：2005-02-10

申请号：US10637095

申请日：2003-08-08

Applicant: John Nolan

Inventor： John Nolan

IPC: H01S3/04 ,  H01S5/00 ,  H01S5/024

CPC classification number: H01S5/02423 ,  H01S5/005 ,  H01S5/0085

Abstract: A coolant loop for an imaging engine light source avoids the necessity for a chiller or an expensive thermo-electric cooler. Instead, it uses a standard heat exchanger and a pneumatically-operated cooler, such as a vortex cooler. The advantage of a pneumatically-operated cooler is that in platesetters and imagesetters, for example, compressors are typically already included in the machines as a power sources for mechanical actuation within the machines. By simply increasing the nominal capacity of these compressors, the requirement for the expensive chillers or thermo-electric coolers can be thus avoided.

Abstract translation: 用于成像引擎光源的冷却剂回路避免了冷却器或昂贵的热电冷却器的必要性。 相反，它使用标准换热器和气动冷却器，如涡流冷却器。 气动冷却器的优点是，在制版机和成像机中，例如，压缩机通常已经作为用于在机器内进行机械致动的动力源被包括在机器中。 通过简单地增加这些压缩机的额定容量，可以避免对昂贵的冷却器或热电冷却器的要求。

公开(公告)号：US20050018726A1

公开(公告)日：2005-01-27

申请号：US10924318

申请日：2004-08-23

Applicant: Reinhold Dinger ,  Claus Haas ,  Dieter Hoffmann

Inventor： Reinhold Dinger ,  Claus Haas ,  Dieter Hoffmann

IPC: H01S5/042 ,  H01S5/024 ,  H01S5/40 ,  H01S3/00 ,  H01S3/04

CPC classification number: H01S5/40 ,  H01S5/02423 ,  H01S5/4031 ,  H05B33/083 ,  Y02B20/348

Abstract: A diode laser array has a plurality of electrically series-connected diode lasers. Each of the diode lasers has a bypass device that is electrically connected in parallel with the laser. The bypass is high-ohmic in normal operation and bypasses the diode laser with low resistance in the case of a diode laser diode defect, that would otherwise lead to high-ohmic interruption of the electric circuit. The bypass configuration is disposed on a cooling and contact element together with the diode laser.

Abstract translation: 二极管激光器阵列具有多个电串联连接的二极管激光器。 每个二极管激光器具有与激光器并联电连接的旁路装置。 旁路在正常工作时是高电阻的，并且在二极管激光二极管缺陷的情况下绕过具有低电阻的二极管激光器，否则将导致电路的高欧姆中断。 旁路配置与二极管激光器一起设置在冷却和接触元件上。

公开(公告)号：US06804275B2

公开(公告)日：2004-10-12

申请号：US09773510

申请日：2001-02-02

Applicant: Hirofumi Miyajima ,  Hirofumi Kan

Inventor： Hirofumi Miyajima ,  Hirofumi Kan

IPC: H01L2336

CPC classification number: H01S5/02423 ,  H01L23/473 ,  H01L2924/0002 ,  H01S5/02268 ,  H01S5/4031 ,  H01S5/405 ,  H05K7/20254 ,  H01L2924/00

Abstract: A semiconductor laser stack apparatus 1 comprises three semiconductor lasers 2a to 2c, two copper plates 3a and 3b, two lead plates 4a and 4b, a supply tube 5, a discharge tube 6, four insulating members 7a to 7d, and three heat sinks 10a to 10c. Here, the heat sink 10a to 10c is formed by a lower planar member 12 having an upper face formed with a supply water path groove portion 22, an intermediate planar member 14 formed with a plurality of water guiding holes 38, and an upper planar member 16 having a lower face formed with a discharge water path groove portion 30 which are successively stacked one upon another, whereas their contact surfaces are joined together.

Abstract translation: 半导体激光器堆叠装置1包括三个半导体激光器2a至2c，两个铜板3a和3b，两个引线板4a和4b，供给管5，放电管6，四个绝缘构件7a至7d以及三个散热片10a 到10c。 这里，散热片10a至10c由具有形成有供水路径槽部22的上表面的下平面构件12，形成有多个导水孔38的中间平面构件14和上平面构件 16，其下表面形成有排水路径槽部分30，它们彼此依次堆叠，而它们的接触表面接合在一起。

公开(公告)号：US06780678B2

公开(公告)日：2004-08-24

申请号：US10754004

申请日：2004-01-08

Applicant: Jonathan Simon ,  Ken A. Nishimura

Inventor： Jonathan Simon ,  Ken A. Nishimura

IPC: H01L2144

CPC classification number: H01L31/024 ,  H01S5/02423

Abstract: Optical systems for cooling optoelectronic elements are provided. A representative optical system includes a substrate and a first optoelectronic element supported by the substrate. Additionally, a first channel is formed in the substrate and a first heat transfer fluid is arranged in the first channel. The first heat transfer fluid is thermally coupled with the first optoelectronic element so that at least a quantity of heat produced by the first optoelectronic element is dissipated by the first heat transfer fluid. Methods and other systems also are provided.

Abstract translation: 提供了用于冷却光电元件的光学系统。 代表性的光学系统包括衬底和由衬底支撑的第一光电元件。 此外，第一通道形成在基板中，第一传热流体布置在第一通道中。 第一传热流体与第一光电子元件热耦合，使得由第一光电元件产生的至少一定量的热量被第一传热流体消散。 还提供了方法和其它系统。

公开(公告)号：US06765941B2

公开(公告)日：2004-07-20

申请号：US10008944

申请日：2001-12-03

Applicant: John Nolan

Inventor： John Nolan

IPC: H01S304

CPC classification number: H01S5/02423 ,  H01S5/4025

Abstract: A cooling system having a single circulator cools a laser, laser power supply, and laser light valve using two parallel cooling loops having different flow rates. Independent protection against an over temperature condition of the laser, laser power supply, and/or laser light valve is provided in each cooling loop.

Abstract translation: 具有单个循环器的冷却系统使用具有不同流速的两个并联冷却回路冷却激光器，激光电源和激光阀。 在每个冷却回路中提供了针对激光器，激光器电源和/或激光光阀的过温条件的独立保护。

公开(公告)号：US20040052280A1

公开(公告)日：2004-03-18

申请号：US10242055

申请日：2002-09-12

Inventor： Robert Rex Rice

IPC: H01S003/04

CPC classification number: H01S5/02423 ,  H01S3/0941 ,  H01S5/02264 ,  H01S5/4025 ,  H01S5/405

Abstract: The laser diode arrays with removable linear laser diode bars and the methods of removing and replacing linear laser diode bars of the present invention provide easy and immediate removal of individual linear laser diode bars in laser diode arrays. The laser diode array is at least partially made of a plurality of removable linear laser diode bars and a plurality of spacers, such that each removable linear laser diode bar is disposed between a respective pair of spacers. A linear laser diode bar may be slideably removed from between the respective pair of spacers in the laser diode array without breaking any mechanical connection between the removable linear laser diode bar and the respective pair of spacers. A replacement linear laser diode bar may then be slideably inserted between the respective pair of spacers without forming a mechanical connection between the replacement linear laser diode bar and the spacers.

Abstract translation: 具有可移除线性激光二极管条的激光二极管阵列以及本发明的去除和替代线性激光二极管条的方法提供了在激光二极管阵列中简单且立即去除各个线性激光二极管条的方法。 激光二极管阵列至少部分地由多个可移除的线性激光二极管棒和多个间隔件制成，使得每个可移除的线性激光二极管棒设置在相应的一对间隔件之间。 线性激光二极管棒可以从激光二极管阵列中的相应的一对间隔件之间可滑动地移除，而不会破坏可拆卸的线性激光二极管棒和相应的一对间隔件之间的任何机械连接。 然后可以将替代的线性激光二极管棒可滑动地插入在相应的一对间隔件之间，而不需要在替换的线性激光二极管棒和间隔件之间形成机械连接。

公开(公告)号：US06650668B2

公开(公告)日：2003-11-18

申请号：US09969338

申请日：2001-10-02

Applicant: Alexander A. Yatskar ,  Serrena Marie Carter ,  R. Russel Austin

Inventor： Alexander A. Yatskar ,  Serrena Marie Carter ,  R. Russel Austin

IPC: H01S5024

CPC classification number: H01S3/0941 ,  H01S3/025 ,  H01S5/02264 ,  H01S5/02272 ,  H01S5/02407 ,  H01S5/02423 ,  H01S5/02469

Abstract: A cylindrical two-dimensional diode-laser assembly includes fractionally-cylindrical dielectric segments bonded in a circular aperture in a metal heat-sink. Diode laser bars are located in gaps between the segments with light from the diode-lasers directed inwardly. The segments are made by cutting slots in one end of a tube of the dielectric material with the width of the slots corresponding to the width of the gaps and the part of the tube between slots providing the segments. The slotted tube is metallized and the slotted end of the tube is inserted into the heat-sink aperture with an unslotted part of the tube outside the aperture. The slotted part of the tube is bonded in the aperture and the unslotted part of the tube separated from the slotted part leaving the segments bonded in the aperture.

Abstract translation: 圆柱形二维二极管激光器组件包括结合在金属散热器中的圆形孔中的分数圆柱形介质段。 二极管激光条位于两段之间的间隙中，二极管激光器的光线向内指向。 这些段通过在电介质材料的管的一端中切割槽而制成，其中槽的宽度对应于间隙的宽度，并且管的部分在提供段之间的槽之间。 开槽管被金属化，并且管的开槽端插入散热孔中，管的未被切开的部分在孔的外部。 管的开槽部分接合在孔中，并且管的未开槽部分与开槽部分分离，留下接合在孔中的段。