公开(公告)号：US20230304852A1

公开(公告)日：2023-09-28

申请号：US18124279

申请日：2023-03-21

Applicant: Zhejiang University

Inventor： Kaichen Xu ,  Huayu Luo ,  Haonan Zhao ,  Jiachen Ye ,  Zheyu Dong ,  Geng Yang ,  Huayong Yang

IPC: G01H11/06 ,  B23K26/359 ,  B23K26/38 ,  B23K26/402 ,  B29C70/70 ,  B29C70/68 ,  B29C70/88

CPC classification number: G01H11/06 ,  B23K26/359 ,  B23K26/38 ,  B23K26/402 ,  B29C70/70 ,  B29C70/683 ,  B29C70/882 ,  B23K2103/42

Abstract: A method for preparing a fully soft self-powered vibration sensor mainly uses a laser carbonization technology to prepare a two-dimensional porous carbon electrode with an origami structure, and then transfers the two-dimensional porous carbon electrode to a three-dimensional polydimethylsiloxane (PDMS) cavity through mold transfer; Finally, a laser engraving technology is used to create microstructures on surfaces of the porous carbon electrode and a PDMS film. The sensor includes the PDMS film, a liquid metal droplet oscillator, a porous out-of-plane carbon electrode, and a 3D PDMS cavity assembled tightly from top to bottom. The sensor works based on the triboelectric nanogenerator principle, when the sensor is excited by vibrations, contact and triboelectrification at an interface of the liquid metal droplet oscillator and PDMS film charge both objects, making contact surfaces carry stable charges, which allows the movement of the liquid metal droplet oscillator to output current through electrostatic induction.

公开(公告)号：US20230256535A1

公开(公告)日：2023-08-17

申请号：US18138955

申请日：2023-04-25

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Junji OKUMA

IPC: B23K26/064 ,  B23K26/042 ,  B23K26/359 ,  B23K26/70 ,  B23K26/03 ,  B23K26/06 ,  B23K26/08

CPC classification number: B23K26/064 ,  B23K26/042 ,  B23K26/359 ,  B23K26/702 ,  B23K26/705 ,  B23K26/032 ,  B23K26/0665 ,  B23K26/0853 ,  B23K2103/56

Abstract: A laser processing device includes a support unit, a laser light source, a reflecting spatial light modulator, a light collection optical system, an imaging optical system, a mirror, a first sensor configured to acquire displacement data on a laser light entry surface, and a second sensor configured to acquire displacement data on the laser light entry surface. An optical path of the laser light extending from the mirror to the light collection optical system is set along a first direction. An optical path of the laser light extending from the reflecting spatial light modulator to the mirror through the imaging optical system is set along a second direction. The first sensor is disposed on one side of the light collection optical system in a third direction.

公开(公告)号：US20230202113A1

公开(公告)日：2023-06-29

申请号：US18109529

申请日：2023-02-14

Applicant: Xiamen University

Inventor： Wei ZHOU ,  Rui Chen ,  Xinning Zhu ,  Tao LUO ,  Weisong LING ,  Chiqian XIAO

IPC: B29C64/386 ,  B23K26/046 ,  B23K37/04 ,  B23K26/359 ,  B33Y50/02

CPC classification number: B29C64/386 ,  B23K26/046 ,  B23K37/0417 ,  B23K26/359 ,  B33Y50/02

Abstract: A laser conformal manufacturing method of a flexible sensor comprises: obtaining morphology data of a curved surface, and constructing a Standard Triangle Language (STL) model of the curved surface; introducing into a 3D modeling software, and combining the curved surface with a clamper holder; manufacturing to obtain the clamper with the curved surface; coating material to be manufactured on a 3D curved surface of the damper with the curved surface; positioning to a processing platform of a laser device; constructing a model of a pattern to be manufactured by laser based on the STL model of the curved surface, and constructing an STL model or a dwg model of the pattern to be manufactured; introducing into the laser device, turning on the laser device, and running a 3D dynamic focus system; repeating the steps 4-8, and stripping the flexible sensor from the 3D curved surface.

公开(公告)号：US11679451B2

公开(公告)日：2023-06-20

申请号：US16965954

申请日：2019-01-28

Applicant: Datalogic IP Tech S.R.L.

Inventor： Lorenzo Bassi

IPC: B41J2/44 ,  B41J2/47 ,  B41J2/475 ,  B41M5/24 ,  B41M5/26 ,  B23K26/03 ,  B23K26/082 ,  B23K26/364 ,  B23K26/359

CPC classification number: B23K26/364 ,  B23K26/082 ,  B23K26/359 ,  B41J2/442 ,  B41J2/47 ,  B41J2/475 ,  B41M5/24 ,  B41M5/262 ,  B41M5/267

Abstract: A system and method for performing laser marking may include identifying an event performed by a laser marking system. A laser marking unit may be driven to mark the feature on the part. The part may be illuminated with a visible illumination signal to indicate an occurrence of the event in response to identifying the event.

公开(公告)号：US20230136173A1

公开(公告)日：2023-05-04

申请号：US17518106

申请日：2021-11-03

Applicant: GM Global Technology Operations LLC

Inventor： Joshua Lee Solomon ,  Hui-ping Wang ,  Antonio R. Vittorini

IPC: B23K26/359 ,  B23K26/40 ,  B23K26/362

Abstract: A method of customizing a vehicle body includes inputting a selected customized embellishment to a laser controller, directing a beam of the laser onto a surface of the vehicle body, and guiding the beam of the laser with the laser controller to impart the selected customized embellishment to the surface.

公开(公告)号：US20230036158A1

公开(公告)日：2023-02-02

申请号：US17812642

申请日：2022-07-14

Applicant: JENOPTIK Automatisierungstechnik GmbH

Inventor： Walter LUTZE ,  Andreas BODE-MOSIG

IPC: B23K26/70 ,  B23K26/082 ,  B23K26/359

Abstract: A universally usable device for producing a predetermined breaking line in an equipment part of a vehicle. The device includes a laser beam generator, a laser scanner and a linear or matrix-shaped first sensor arrangement with first individual sensors of an identical first sensitivity and at least one identical linear or matrix-shaped second sensor arrangement of second individual sensor, which is arranged with an offset to the first sensor arrangement of first individual sensors, and the second individual sensors have an identical second sensitivity which differs from the first sensitivity.

公开(公告)号：US20220371121A1

公开(公告)日：2022-11-24

申请号：US17817197

申请日：2022-08-03

Applicant: Gigaphoton Inc.

Inventor： Koichi FUJII ,  Osamu WAKABAYASHI

IPC: B23K26/046 ,  B23K26/082 ,  B23K26/0622 ,  B23K26/03 ,  B23K26/359

Abstract: An exposure system that performs scanning exposure of a semiconductor substrate by irradiating a reticle with a pulse laser beam includes a laser apparatus configured to emit a pulse laser beam, an illumination optical system through which the pulse laser beam is guided to the reticle, a reticle stage, and a processor configured to control emission of the pulse laser beam from the laser apparatus and movement of the reticle by the reticle stage. The reticle includes a region in which multiple kinds of patterns are arranged in a mixed manner in a scanning width direction orthogonal to a scanning direction of the scanning exposure. The processor instructs the laser apparatus about a target wavelength such that the laser apparatus emits the pulse laser beam of a wavelength with which dispersion of best focus positions corresponding to respective patterns of the multiple kinds of patterns is minimum.

公开(公告)号：US11504805B2

公开(公告)日：2022-11-22

申请号：US16485642

申请日：2018-02-02

Applicant: SAUER GmbH

Inventor： Peter Hildebrand ,  Gottfried Reinicke

IPC: B23K26/082 ,  B23K26/352 ,  B23K26/359 ,  G05B19/19 ,  B41M5/24 ,  B41M5/26

Abstract: A method for machining at least one workpiece surface to apply a texture pattern to at least one section of the workpiece surface using a laser, based on image data specifying an image of the texture pattern applied to the at least one section of the workpiece surface and model data specifying a three-dimensional geometry of a surface form corresponding to the at least one section of the workpiece surface. Control data and segment data are generated based on the image and model data. The control data specify one or more segment sequences for each track line. Each segment sequence has track segments where the laser guides the texture pattern application to the at least one section of the workpiece surface; wherein the track segments of a segment sequence include one or more laser track segments where the laser travels in the switched-on state at a constant machining setpoint speed.

公开(公告)号：US20220288665A1

公开(公告)日：2022-09-15

申请号：US17831718

申请日：2022-06-03

Applicant: SUMITOMO HEAVY INDUSTRIES, LTD.

Inventor： Masayuki Ishizuka ,  Norieda Ueno

IPC: B21D24/10 ,  B21D22/30 ,  B23K26/359

Abstract: An information providing device provides information to a formed product formed by a forming device including a die for forming a metal material, in which the information is provided to the formed product after being formed by the forming device, and the information is information from which at least forming conditions of the formed product are acquirable. The information providing device includes an information acquisition unit that acquires the forming conditions.

公开(公告)号：US20220259092A1

公开(公告)日：2022-08-18

申请号：US17627572

申请日：2020-02-19

Applicant: NITTO DENKO CORPORATION

Inventor： Toshihiro Kanno ,  Takahiro Shinozaki ,  Kota Nakai ,  Naoyuki Matsuo

IPC: C03B33/07 ,  C03B33/02 ,  B23K26/359 ,  B23K26/0622 ,  B23K26/402

Abstract: A method is disclosed for dividing a composite material in which a brittle material layer and a resin layer are laminated, including: irradiating the resin layer with a laser beam L1 oscillated from a CO2 laser source along scheduled dividing lines DL of the composite material to form a processing groove along the scheduled dividing lines; and irradiating the brittle material layer with a laser beam L2 oscillated from an ultrashort pulsed laser source along the scheduled dividing lines to form a processing mark along the scheduled dividing lines. In the resin removing step, in a region IS where the scheduled dividing lines intersect, the laser beam oscillated from the CO2 laser source is not irradiated multiple times, or an irradiation amount of the laser beam is decreased relative to an irradiation amount in a region other than a region where the scheduled dividing lines intersect.