公开(公告)号：US20080289175A1

公开(公告)日：2008-11-27

申请号：US12123950

申请日：2008-05-20

Applicant: Masafumi Inoue ,  Fumio Kikutsugi ,  Masahiro Kihara

Inventor： Masafumi Inoue ,  Fumio Kikutsugi ,  Masahiro Kihara

IPC: H05K3/34

CPC classification number: H05K3/3484 ,  H01L23/544 ,  H01L24/81 ,  H01L24/83 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/81121 ,  H01L2224/81801 ,  H01L2224/83121 ,  H01L2224/83801 ,  H01L2924/01068 ,  H05K1/0269 ,  H05K3/0097 ,  H05K3/1216 ,  H05K3/303 ,  H05K2201/09918 ,  H05K2203/0165 ,  H05K2203/0545 ,  H05K2203/166 ,  Y02P70/613 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49179 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191 ,  H01L2924/3512 ,  H01L2924/00

Abstract: In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data.

Abstract translation: 在用于保持在载体上的多个单独基板的电子部件安装中，基于焊料印刷后的载体上的标记位置识别结果，焊料位置识别结果和表示电极位置信息的电极位置信息，针对各个基板计算焊接位置偏差数据 基于所计算的焊接位置偏差数据，对每个单独的基板执行每个单独基板上的电极的位置，用于计算位置校正数据的操作，该位置校正数据用于校正将电子部件安装在适当位置的位置偏差， 计算出的位置校正数据被馈送到电子部件安装装置，并且基于标记位置识别结果和位置校正数据来控制部件安装机构的电子部件安装操作。

公开(公告)号：US20080257937A1

公开(公告)日：2008-10-23

申请号：US11569126

申请日：2006-01-17

Applicant: Masahiro Kihara ,  Masafumi Inoue

Inventor： Masahiro Kihara ,  Masafumi Inoue

IPC: B23K37/04

CPC classification number: H05K3/3484 ,  B23K1/0016 ,  H01L21/67282 ,  H01L22/12 ,  H01L23/544 ,  H01L24/75 ,  H01L2223/54473 ,  H01L2224/75 ,  H05K1/0269 ,  H05K3/0097 ,  H05K13/0817 ,  H05K2203/163

Abstract: To provide an electronic component mounting system, an electronic component placing device, and an electronic component mounting method, which can prevent waste due to the place of an electronic component onto a unit substrate having a print failure.In the electronic component mounting method for mounting an electronic component on a multi-substrate in which a plurality of unit substrates are formed on the same substrate, the quality of a print state of a solder printed on electrodes formed on the plurality of unit substrates is determined by the test of the print state of the solder and a determination result is output to an electronic component placing device as solder test data in every unit substrate. In a component placing steps, a component placing mechanism is controlled based on the solder test data such that a component placing operation is performed only on the unit substrate in which the print state of the solder is determined to be good. Accordingly, it is possible to prevent waste due to the place of an electronic component onto a unit substrate having a print failure.

Abstract translation: 提供一种电子部件安装系统，电子部件放置装置和电子部件安装方法，其可以防止由于将电子部件放置在具有打印故障的单元基板上而引起的浪费。 在将电子部件安装在同一基板上形成有多个单位基板的多基板上的电子部件安装方法中，印刷在形成于多个单位基板上的电极上的焊料的印刷状态的质量为 通过焊料的打印状态的测试来确定，并且将确定结果输出到电子部件放置装置作为每个单位基板中的焊接测试数据。 在部件放置步骤中，基于焊料测试数据控制部件放置机构，使得仅在确定焊料的打印状态良好的单元基板上执行部件放置操作。 因此，可以防止由于电子部件的位置而导致在具有打印故障的单元基板上的浪费。

公开(公告)号：US20050015975A1

公开(公告)日：2005-01-27

申请号：US10922731

申请日：2004-08-20

Applicant: Masafumi Inoue ,  Yusuke Yamamoto ,  Hikaru Onizaki ,  Youichi Yanai ,  Yasuhiro Morimitsu

Inventor： Masafumi Inoue ,  Yusuke Yamamoto ,  Hikaru Onizaki ,  Youichi Yanai ,  Yasuhiro Morimitsu

IPC: H05K13/04 ,  H05K13/08 ,  H05K3/30

CPC classification number: H05K13/08 ,  H05K13/0469 ,  Y10T29/49004 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49144 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178

Abstract: A method of mounting a component on an electrode on a board. Mounting coordinates for mounting the component are calculated. A determination is made of printing positions where solder for the component is situation on the electrode. The printing positions of the solder are stored. Mounting position data for where the component is to be mounted on the solder is prepared based on the previous steps. The component is mounted using the information gathered in the previous steps.

Abstract translation: 将组件安装在电路板上的方法。 计算安装组件的安装坐标。 确定组件焊料在电极上的打印位置。 存储焊料的印刷位置。 基于前面的步骤准备将组件安装在焊料上的安装位置数据。 使用前面步骤中收集的信息安装组件。

公开(公告)号：US06786704B2

公开(公告)日：2004-09-07

申请号：US10283217

申请日：2002-10-30

Applicant: Hirokazu Kamiya ,  Shigeru Kamiya ,  Masafumi Inoue ,  Takashi Inoue ,  Mikio Matsuda

Inventor： Hirokazu Kamiya ,  Shigeru Kamiya ,  Masafumi Inoue ,  Takashi Inoue ,  Mikio Matsuda

IPC: F04B126

CPC classification number: F04B27/0882 ,  F04B27/0878 ,  F04B27/1054 ,  F04B27/1063 ,  F04B27/1072

Abstract: A piston type compressor having a drive plate (swash plate), wherein sliding friction between the drive plate and shoes is reduced and the compressor is made smaller by slidably attaching the shoes engaged with spherical ends of pistons to a shoe holding plate formed with guide grooves in the radial direction and supporting the shoe holding plate by the drive plate through a thrust bearing. The drive plate is connected to an arm of the shaft side through a double slide link mechanism to enable it to be supported by only a front end of the front housing.

Abstract translation: 一种具有驱动板（斜盘）的活塞式压缩机，其中驱动板和滑块之间的滑动摩擦力减小，并且通过将与活塞的球形端接合的鞋可滑动地附接到形成有导向槽的鞋保持板而使压缩机变小 在径向方向上，并通过驱动板通过止推轴承来支撑鞋保持板。 驱动板通过双滑动连杆机构连接到轴侧的臂上，使其能够仅由前壳体的前端支撑。

公开(公告)号：US06729532B2

公开(公告)日：2004-05-04

申请号：US10037125

申请日：2001-10-25

Applicant: Masafumi Inoue ,  Yusuke Yamamoto ,  Hikaru Onizaki ,  Yoichi Yanai ,  Yasuhiro Morimitsu

Inventor： Masafumi Inoue ,  Yusuke Yamamoto ,  Hikaru Onizaki ,  Yoichi Yanai ,  Yasuhiro Morimitsu

IPC: B23K3512

CPC classification number: H05K3/3442 ,  H05K3/3484 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2203/048 ,  H05K2203/0545 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49151 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49179

Abstract: A component mounting method for mounting several micro component chips aligned in parallel onto a board by soldering. An allowable offset is set for each electrode, taking into account a self-alignment effect of melted solder in soldering for bonding component terminals onto electrodes formed on the board corresponding to a component layout. Solder printing and component placement onto the electrodes are shifted by the offset. This offset is balanced by the self-alignment effect of melted solder, and each component is secured at an appropriate position. This mounting method allows less stringent spacing conditions to be applied for mounting and prevents the occurrence of defects during printing and placement.

Abstract translation: 一种用于通过焊接将几个微型组件芯片并联平行地安装到板上的部件安装方法。 考虑到焊接中熔化的焊料的自对准效应，将组件端子接合到对应于部件布局的板上形成的电极上，为每个电极设置允许的偏移。 焊接印刷和部件放置在电极上移位偏移。 该偏移由熔融焊料的自对准效应平衡，并且每个部件固定在适当的位置。 该安装方法允许不太严格的间隔条件用于安装，并防止在打印和放置期间出现缺陷。

公开(公告)号：US06610818B2

公开(公告)日：2003-08-26

申请号：US10034089

申请日：2001-12-28

Applicant: Yasuhiro Yamamoto ,  Shuji Shimizu ,  Masafumi Inoue ,  Hideki Oishi

Inventor： Yasuhiro Yamamoto ,  Shuji Shimizu ,  Masafumi Inoue ,  Hideki Oishi

IPC: C08J510

CPC classification number: C08J3/16 ,  C08G12/30 ,  C08G12/32 ,  C08J3/26 ,  C08J2361/20

Abstract: A process for producing amino resin particles includes: a reaction process for obtaining a reaction solution containing an amino resin precursor which is obtained by a reaction of an amino compound with formaldehyde, and having a viscosity in a range of from 2×10−2 Pa·s to 5.8×10−2 Pa·s at a temperature in a range of from 95° C. to 98° C.; an emulsion process for obtaining an emulsion by emulsifying the reaction solution; and a curing process for curing the amino resin precursor in the emulsion state by adding a catalyst to the emulsion. With this producing process, it is possible to readily produce amino resin particles with an essentially uniform particle size (narrow particle size distribution). Further, with use of an aqueous dispersion of an inorganic pigment which is obtained by wet pulverizing the inorganic pigment in an aqueous medium until the average particle size of the inorganic pigment measured by a light scattering method becomes not more than 300 nm, it is possible to obtain amino resin particles with superior properties in coloring strength, visibility, heat resistance, solvent resistance, and chemicals resistance.

公开(公告)号：US5226437A

公开(公告)日：1993-07-13

申请号：US795762

申请日：1991-11-21

Applicant: Yuji Kamikawa ,  Masafumi Inoue ,  Mitsuo Nishi

Inventor： Yuji Kamikawa ,  Masafumi Inoue ,  Mitsuo Nishi

IPC: H01L21/00 ,  H01L21/677

CPC classification number: H01L21/67017 ,  H01L21/67051 ,  H01L21/67766 ,  H01L21/67781 ,  Y10S134/902

Abstract: A washing apparatus for performing a batch treatment of a plurality of wafers has a vessel and a wafer boat dedicated to the vessel and movable in the vertical direction. The boat has a fork, which supports the wafers in the vessel in a manner such that the wafers are spaced from one another at predetermined intervals. The wafers are received in a carrier, and are transferred to the boat by a rotary transfer arm. This arm has a fork for supporting the wafers during transfer thereof in a manner such that the wafers are spaced from one another at the predetermined intervals. Transfer of the rotary transfer arm is performed above the washing vessel by moving the boat up and down. At this time, the forks of the boat and arm engage with each other.

Abstract translation: 用于执行多个晶片的批量处理的洗涤装置具有专用于容器并可在垂直方向上移动的容器和晶片舟。 该船具有叉子，该叉子以使得晶片以预定间隔彼此间隔的方式支撑在容器中的晶片。 晶片被接收在载体中，并通过旋转传递臂传送到船上。 该臂具有用于在其转移期间支撑晶片的叉，使得晶片以预定间隔彼此间隔开。 通过上下移动舟皿，在洗涤容器上方进行旋转传送臂的传送。 在这时候，船和手臂的叉子相互啮合。