公开(公告)号：US09293806B2

公开(公告)日：2016-03-22

申请号：US14201501

申请日：2014-03-07

Applicant: Apple Inc.

Inventor： Kelvin Kwong ,  Lee E. Hooton

IPC: H01Q1/24 ,  H01Q1/22

CPC classification number: H01Q1/24 ,  H01Q1/2258 ,  H01Q1/243 ,  H01Q1/44

Abstract: An electronic device has a display mounted in a housing using a plastic display frame. The display has an active area and an inactive area. A display cover layer may have polymer coating layers in the inactive area. The display frame may lie under the inactive area. A patterned metal coating layer may be formed on the display frame. The patterned metal coating layer may have portions that form adhesion promotion structures for promoting adhesion between the frame and the adhesive. The patterned metal coating layer may also have portions that form antenna structures. The antenna structures may be used to transmit and receive radio-frequency signals and may be used as adhesion promotion structures. Adhesive may be interposed between the polymer coating layers and the metal coating layer on the display frame to attach the display cover layer and the display to the display frame.

Abstract translation: 电子设备具有使用塑料显示框架安装在壳体中的显示器。 显示屏具有活动区域和非活动区域。 显示器覆盖层可以在非活性区域中具有聚合物涂层。 显示框可能位于非活动区域之下。 图案化的金属涂层可以形成在显示框上。 图案化的金属涂层可以具有形成用于促进框架和粘合剂之间的粘附的粘合促进结构的部分。 图案化的金属涂层也可以具有形成天线结构的部分。 天线结构可以用于发射和接收射频信号，并且可以用作粘附促进结构。 粘合剂可以介于聚合物涂层和显示框架上的金属涂层之间，以将显示覆盖层和显示器附着到显示框架上。

公开(公告)号：US20140085859A1

公开(公告)日：2014-03-27

申请号：US13628773

申请日：2012-09-27

Applicant: APPLE INC.

Inventor： Lee E. Hooton ,  Michael B. Wittenberg ,  Shayan Malek

IPC: F21V21/00 ,  G03B15/02 ,  H05K7/20

CPC classification number: G03B15/02 ,  G03B2215/0567

Abstract: An electronic device may be provided with an electronic component such as a camera light source containing a light-emitting diode. During operation, the light-emitting diode may produce heat. Thermally conducting elastomeric structures may have features such as sidewalls that mate with external surface of the camera light source or other electronic component to dissipate heat from the electronic component. Metal structures such as a bracket may be used to press the elastomeric structures and the electronic component towards a wall of a housing for the electronic device. Support structures may be interposed between the wall of the housing and the elastomeric structures. The support structures may have an opening that is aligned with an opening in the housing wall. Insert structures may be received within the opening in the support structures. The electronic component may be aligned with the insert structures and the opening in the support structures.

Abstract translation: 电子设备可以设置有诸如包含发光二极管的照相机光源的电子部件。 在操作期间，发光二极管可能产生热量。 导热弹性体结构可具有诸如与相机光源或其他电子部件的外表面相配合以散发来自电子部件的热量的侧壁的特征。 诸如支架的金属结构可用于将弹性体结构和电子部件朝向用于电子装置的壳体的壁挤压。 支撑结构可以插入在壳体的壁和弹性体结构之间。 支撑结构可以具有与壳体壁中的开口对准的开口。 插入结构可以被容纳在支撑结构内的开口内。 电子部件可以与插入结构和支撑结构中的开口对准。