公开(公告)号：US4387755A

公开(公告)日：1983-06-14

申请号：US220913

申请日：1980-12-29

申请人： Masaki Kato ,  Tuneo Morikawa ,  Kazuyuki Kabe

发明人： Masaki Kato ,  Tuneo Morikawa ,  Kazuyuki Kabe

IPC分类号： B60C9/18 ,  B60C9/20 ,  B60C9/26 ,  B60C9/28 ,  B60C11/00 ,  B60C9/00

CPC分类号： B60C9/26 ,  Y10S152/90 ,  Y10S152/901 ,  Y10S57/902 ,  Y10T152/10495

摘要： A pneumatic tire having a tread reinforcement layer constituted by a steel cord strip layer adjacent the carcass and an aromatic polyamide cord strip layer superposed to the steel cord strip layer in a parallel side-by-side relationship. The aromatic polyamide cord strip layer is folded at its both edges toward the center, in such a manner that the folded portions contact the main portion in a parallel side-by-side relationship. The main portion has a width ranging between 100 and 110% of the width of the tread surface, while the width of each folded portion ranges between 27.5 and 35% of the width of main portion. Furthermore, the free edge of each folded portion is located at a distance from the center of the outermost circumferential groove in the tread surface, which distance being between 25 and 75% of the distance between the outermost groove and the adjacent groove.

摘要翻译： 一种充气轮胎，其具有由与胎体相邻的钢丝帘线带层构成的胎面加强层和与钢帘线带层叠并联的芳香族聚酰胺帘线带条层并列的关系。 芳族聚酰胺帘线带层在其两个边缘朝向中心折叠，使得折叠部分以平行的并排关系接触主体部分。 主要部分的宽度范围在胎面表面的宽度的100％至110％之间，而每个折叠部分的宽度在主要部分的宽度的27.5％至35％之间。 此外，每个折叠部分的自由边缘位于距离胎面表面中的最外周向沟槽的中心一定距离处，该距离在最外槽和相邻槽之间的距离的25％至75％之间。

公开(公告)号：US09738071B2

公开(公告)日：2017-08-22

申请号：US15172326

申请日：2016-06-03

申请人： Masaki Kato

发明人： Masaki Kato

IPC分类号： B41J2/14

CPC分类号： B41J2/14233 ,  B41J2/14201 ,  B41J2002/14241 ,  B41J2002/14306 ,  B41J2002/14419 ,  B41J2202/11

摘要： A liquid discharge head includes nozzles, a channel plate, a diaphragm member, a supporting substrate, a common liquid chamber forming substrate, a common liquid chamber, a groove, and a fluid restrictor. The supporting substrate is disposed at a side opposite the channel plate, with the diaphragm member interposed in between. The common liquid chamber forming substrate is disposed at a side opposite the diaphragm member, with the supporting substrate interposed in between. The common liquid chamber is communicated with individual liquid chambers. The groove is formed in an in-plane direction of a bonded face of the supporting substrate bonded to the diaphragm member. The fluid restrictor is disposed between the common liquid chamber and the individual liquid chambers. The fluid restrictor is formed between the groove of the supporting substrate and a bonded face of the diaphragm member bonded to the supporting substrate.

公开(公告)号：US09620444B2

公开(公告)日：2017-04-11

申请号：US14402538

申请日：2012-09-07

申请人： Tatsuya Fukase ,  Dai Nakajima ,  Masahiko Fujita ,  Masaki Kato

发明人： Tatsuya Fukase ,  Dai Nakajima ,  Masahiko Fujita ,  Masaki Kato

IPC分类号： H01G4/228 ,  H01L23/495 ,  H05K1/18 ,  H01L23/31 ,  H01L23/492 ,  H01L23/00 ,  H05K3/10 ,  H01G9/00 ,  H01G4/005 ,  H01G4/012 ,  H01G4/236 ,  H01G2/20 ,  H05K3/20

CPC分类号： H01L23/49589 ,  H01L23/3107 ,  H01L23/492 ,  H01L23/4952 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49562 ,  H01L23/49575 ,  H01L23/562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05624 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49111 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/10254 ,  H01L2924/10272 ,  H01L2924/1033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H05K1/186 ,  H05K3/103 ,  H05K3/202 ,  H05K2201/09118 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10636 ,  H05K2201/10962 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： According to a power semiconductor device of the present invention, it comprises a plurality of lead frames formed into like a wiring pattern, a power semiconductor element joined onto the lead frame, and a capacitor placed between mutually adjacent two lead frames, and is encapsulated with a mold resin. The capacitor is characterized in that external electrodes of that capacitor are connected to the lead frames each through a stress-relaxation structure portion that is lower in rigidity than the capacitor.

公开(公告)号：US09379838B2

公开(公告)日：2016-06-28

申请号：US13341111

申请日：2011-12-30

申请人： Radhakrishnan L. Nagarajan ,  Masaki Kato ,  Michael Francis Van Leeuwen ,  Timothy Butrie

发明人： Radhakrishnan L. Nagarajan ,  Masaki Kato ,  Michael Francis Van Leeuwen ,  Timothy Butrie

IPC分类号： H04J14/02 ,  H04J14/00

CPC分类号： G02B6/12026 ,  G02B6/12019 ,  G02F1/2257 ,  G02F2001/212 ,  H01S5/02453 ,  H01S5/4087 ,  H04J14/02

摘要： Pairs of distributed feedback (DFB) lasers are provided on a substrate. An arrayed waveguide grating (AWG) is also provided on the substrate having input waveguides, each of which being connected to a corresponding pair of DFB lasers. The wavelengths of optical signals supplied from each pair of DFB lasers may be spectrally spaced from one another by a free spectral range (FSR) of the AWG. By selecting either a first or second DFB laser in a pair and temperature tuning to adjust the wavelength, each pair of DFB lasers can supply optical signals at one of four wavelengths, pairs of which are spectrally spaced from one another by the FSR of the AWG. A widely tunable transmitter may thus be obtained.

摘要翻译： 分布反馈（DFB）激光器在基板上提供。 阵列波导光栅（AWG）也设置在具有输入波导的基板上，每个波导光栅连接到相应的一对DFB激光器。 从每对DFB激光器提供的光信号的波长可以通过AWG的自由光谱范围（FSR）彼此光谱间隔。 通过选择成对的第一或第二DFB激光器和温度调谐来调整波长，每对DFB激光器可以以四个波长中的一个提供光信号，其中的一对波长由AWG的FSR彼此光谱间隔开 。 因此可以获得广泛可调的发射器。

公开(公告)号：US09374935B2

公开(公告)日：2016-06-21

申请号：US13643347

申请日：2011-03-29

申请人： Noriaki Iwaki ,  Kazuyoshi Nagato ,  Masaki Kato ,  Hideaki Nomura ,  Shinji Ichino

发明人： Noriaki Iwaki ,  Kazuyoshi Nagato ,  Masaki Kato ,  Hideaki Nomura ,  Shinji Ichino

IPC分类号： H05K13/04

CPC分类号： H05K13/04 ,  G05B19/0421 ,  G05B19/41805 ,  G05B19/41865 ,  G05B2219/31421 ,  G05B2219/32283 ,  G05B2219/34418 ,  G05B2219/36195 ,  G05B2219/45026 ,  H05K13/0495 ,  Y02P90/04 ,  Y02P90/10 ,  Y02P90/14 ,  Y02P90/20 ,  Y02P90/28 ,  Y10T29/51

摘要： A manufacture work machine for performing a manufacture work, including a plurality of work-element performing apparatuses each configured to perform one of a plurality of work elements that constitute the manufacture work, wherein the plurality of work-element performing apparatuses include a plurality of work head devices and wherein the plurality of work head devices include a first work head device and a second work head device which are mutually different in kind of a work to be performed.

摘要翻译： 一种用于进行制造工作的制造作业机械，其特征在于，具有多个作业元件执行装置，其各自被构造成执行构成所述制造工作的多个作业元素中的一个，其中，所述多个作业元件执行装置包括多个作业 头装置，并且其中所述多个工作头装置包括第一工作头装置和第二工作头装置，所述第一工作头装置和第二工作头装置在待执行的工件的种类上是不同的。

公开(公告)号：US09372306B1

公开(公告)日：2016-06-21

申请号：US11045827

申请日：2005-01-27

申请人： Radhakrishnan L. Nagarajan ,  Fred A. Kish, Jr. ,  Masaki Kato ,  Charles H. Joyner ,  David F. Welch ,  Randal A. Salvatore ,  Richard P. Schneider ,  Mehrdad Ziari ,  Damien Jean Henri Lambert ,  Sheila K. Hurtt ,  Andrew G. Dentai ,  Atul Mathur ,  Vincent G. Dominic

发明人： Radhakrishnan L. Nagarajan ,  Fred A. Kish, Jr. ,  Masaki Kato ,  Charles H. Joyner ,  David F. Welch ,  Randal A. Salvatore ,  Richard P. Schneider ,  Mehrdad Ziari ,  Damien Jean Henri Lambert ,  Sheila K. Hurtt ,  Andrew G. Dentai ,  Atul Mathur ,  Vincent G. Dominic

IPC分类号： G02B6/12

CPC分类号： G02B6/12009 ,  G02B6/00 ,  G02B6/02204 ,  G02B6/12004 ,  G02B6/12019 ,  G02B6/12023 ,  G02B6/12026 ,  G02B6/12028 ,  G02B6/12033 ,  G02B6/124 ,  G02B6/4215 ,  G02F1/0121 ,  G02F1/01725 ,  G02F1/025 ,  G02F2001/0175 ,  G02F2001/01758 ,  G02F2203/05 ,  H01S5/0085 ,  H01S5/024 ,  H01S5/02415 ,  H01S5/02453 ,  H01S5/02461 ,  H01S5/02476 ,  H01S5/026 ,  H01S5/0261 ,  H01S5/0264 ,  H01S5/0265 ,  H01S5/0268 ,  H01S5/0425 ,  H01S5/0612 ,  H01S5/06256 ,  H01S5/06258 ,  H01S5/0683 ,  H01S5/0687 ,  H01S5/12 ,  H01S5/1228 ,  H01S5/2077 ,  H01S5/22 ,  H01S5/2214 ,  H01S5/2224 ,  H01S5/227 ,  H01S5/2272 ,  H01S5/2275 ,  H01S5/3408 ,  H01S5/34306 ,  H01S5/4025 ,  H01S5/4031 ,  H01S5/4087 ,  H01S5/50 ,  H04B10/506 ,  H04B10/572 ,  H04J14/02

摘要： A method provides acceptable performance from a semiconductor transmitter photonic integrated circuit (TxPIC) that contains a plurality of modulated sources each comprising a laser source and an external modulator where each laser source provides a different emission wavelength and each modulated source forms a separate signal channel, comprising the steps of providing at least some of the signal channels with an extended identical active layer (EIAL) so that the modulated sources each have an identical active region wavelength and detuning the laser emission wavelength in each laser source within the EIAL from the laser active region wavelength.

摘要翻译： 一种方法从包含多个调制源的半导体发射器光子集成电路（TxPIC）提供可接受的性能，每个调制源包括激光源和外部调制器，其中每个激光源提供不同的发射波长，并且每个调制的源形成单独的信号通道， 包括以下步骤：向扩展的相同有源层（EIAL）提供信号通道的至少一些，使得调制源各自具有相同的有源区波长并使来自激光器活动的EIAL内的每个激光源中的激光发射波长失谐 区域波长。

公开(公告)号：US09238367B2

公开(公告)日：2016-01-19

申请号：US14207910

申请日：2014-03-13

申请人： Masaki Kato

发明人： Masaki Kato

IPC分类号： B41J2/14 ,  B41J2/05 ,  B41J2/045 ,  B41J2/16

CPC分类号： B41J2/14233 ,  B41J2/161 ,  B41J2/1623 ,  B41J2/1625 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1634 ,  B41J2/1642 ,  B41J2/1643 ,  B41J2/1646 ,  B41J2002/14491

摘要： A droplet discharging head includes a passage substrate in which individual liquid chambers are formed; a plurality of piezoelectric elements formed on the passage substrate; a plurality of wirings for connecting electrodes of the plurality of piezoelectric elements and drive circuit connecting portions for being connected to a drive circuit, respectively, formed on the passage substrate; and a support substrate, formed on the passage substrate, provided with a concave portion for housing the plurality of piezoelectric elements at a surface facing the passage substrate, the support substrate being provided with an opening portion above the drive circuit connecting portions, wherein the support substrate is adhered to the passage substrate at a support substrate adhering region of the passage substrate including area where the wirings are formed, and wherein a wiring space between each adjacent wirings is formed to have a crank portion at the support substrate adhering region.

摘要翻译： 液滴喷射头包括形成各个液室的通道基板; 形成在所述通道基板上的多个压电元件; 多个用于连接多个压电元件的电极和驱动电路连接部分的布线，分别连接到形成在通路基板上的驱动电路; 以及支撑基板，其形成在所述通道基板上，设置有用于在与所述通道基板相对的表面处容纳所述多个压电元件的凹部，所述支撑基板在所述驱动电路连接部的上方设置有开口部， 在包括形成有布线的区域的通道基板的支撑基板粘合区域处，将基板粘贴到通道基板上，并且其中每个相邻布线之间的布线空间形成为在支撑基板粘附区域具有曲柄部分。

公开(公告)号：US09166460B2

公开(公告)日：2015-10-20

申请号：US13612107

申请日：2012-09-12

申请人： Naohide Maeda ,  Masahiko Fujita ,  Masaki Kato

发明人： Naohide Maeda ,  Masahiko Fujita ,  Masaki Kato

IPC分类号： H02K11/00

CPC分类号： H02K11/0073 ,  H02K11/21 ,  H02K11/33

摘要： Provided is a rotary electric machine including housings, a stator, a rotor, bearings, a slip ring, a power assembly, a control assembly, a rotation sensor, and a brush holder, in which a switching element mounting surface of the power assembly and a surface of the control assembly, on which a control element of a control circuit is mounted, are placed in parallel to a rotation shaft, and the rotation sensor is placed between the rear bearing and the slip ring.

摘要翻译： 提供一种旋转电机，其包括壳体，定子，转子，轴承，滑环，动力组件，控制组件，旋转传感器和电刷架，其中动力组件的开关元件安装表面和 控制组件的安装有控制电路的控制元件的表面平行于旋转轴放置，旋转传感器位于后轴承和滑环之间。

公开(公告)号：US09117688B2

公开(公告)日：2015-08-25

申请号：US13985780

申请日：2011-04-18

申请人： Takuya Oga ,  Masaki Kato ,  Tsuyoshi Sugihara

发明人： Takuya Oga ,  Masaki Kato ,  Tsuyoshi Sugihara

IPC分类号： H01L23/48 ,  H01L23/495 ,  H01L25/07 ,  H01L23/00 ,  H01L23/31 ,  H02K11/00 ,  H02M7/537 ,  B60L11/18 ,  B60L15/00

CPC分类号： H01L25/07 ,  B60L11/1803 ,  B60L15/007 ,  H01L23/3107 ,  H01L23/49524 ,  H01L23/49551 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/05 ,  H01L24/06 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/37 ,  H01L24/40 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/02166 ,  H01L2224/04026 ,  H01L2224/04034 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/0603 ,  H01L2224/06181 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/3701 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40137 ,  H01L2224/40247 ,  H01L2224/40249 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48699 ,  H01L2224/73215 ,  H01L2224/73221 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3511 ,  H02K11/33 ,  H02M7/537 ,  Y02T10/645 ,  Y02T10/7005 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05552

摘要： Provided is a semiconductor device including: a first MOS-FET (21) joined to a first base plate (11) via solder (61); a second MOS-FET (22) joined to a second base plate (12) via solder (64); a first lead (31) joining the first base plate (11) and the second MOS-FET (22); and a second lead (32) joining the second MOS-FET (22) and a current path member (13) that gives and receives current flowing through the MOS-FETs (21, 22) to and from the outside. The second base plate (12) is more rigid than both the leads (31, 32), a boundary line (D-D) intersects the second base plate (12) without intersecting both the leads (31, 32), the boundary line including a gap portion (52) along which both the MOS-FETs (21, 22) are opposed to each other, extending in the direction in which both the MOS-FETs (21, 22) are not opposed to each other.

摘要翻译： 提供一种半导体器件，包括：通过焊料（61）与第一基板（11）接合的第一MOS-FET（21）; 通过焊料（64）与第二基板（12）接合的第二MOS-FET（22）; 连接所述第一基板（11）和所述第二MOS-FET（22）的第一引线（31）; 以及连接所述第二MOS-FET（22）的第二引线（32）和向外部施加流过MOS-FET（21,22）的电流和电流通路构件（13）。 第二基板（12）比两个引线（31,32）更刚性，边界线（DD）与第二基板（12）相交而不与两个引线（31,32）相交，边界线包括一个 两个MOS-FET（21,22）沿着两个MOS-FET（21,22）彼此相对的方向彼此相对延伸的间隙部分（52）。

公开(公告)号：US09006879B2

公开(公告)日：2015-04-14

申请号：US12908500

申请日：2010-10-20

申请人： Masaki Kato ,  Masahiko Fujita ,  Kazuyasu Sakamoto

发明人： Masaki Kato ,  Masahiko Fujita ,  Kazuyasu Sakamoto

IPC分类号： H01L23/40 ,  H05K1/02 ,  H01L23/36 ,  H05K1/18

CPC分类号： H05K1/021 ,  H01L23/13 ,  H01L23/36 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K1/184 ,  H05K2201/0397 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/10166 ,  H05K2201/10689 ,  H01L2924/00

摘要： The invention is to provide a semiconductor apparatus configured to position a semiconductor device reliably and easily without having a protruding portion formed in the bottom surface of the semiconductor device in the semiconductor apparatus. A semiconductor apparatus is fabricated by attaching a semiconductor device of a surface mount package type and a wiring member to a heat sink. A fitting portion in which the semiconductor device is fit is provided to the wiring member, so that the semiconductor device is positioned by fitting the semiconductor device into the fitting portion provided to the wiring member. According to the semiconductor apparatus of the invention, it becomes possible to position the semiconductor device at a high degree of accuracy.

摘要翻译： 本发明提供一种半导体装置，其被配置为可靠且容易地定位半导体器件，而不会在半导体器件中的半导体器件的底表面中形成突出部分。 通过将表面安装封装型半导体器件和布线构件附接到散热器来制造半导体器件。 在配线部件上设置有将半导体装置配合的嵌合部，通过将半导体装置嵌入到配线部件的嵌合部中来定位半导体装置。 根据本发明的半导体装置，可以高精度地定位半导体器件。