摘要:
The distribution states of defects are analyzed on the basis of the coordinates of defects detected by an inspection apparatus to classify them into a distribution feature category, or any one of repetitive defect, congestion defect, linear distribution defect, ring/lump distribution defect and random defect. In the manufacturing process for semiconductor substrates, defect distribution states are analyzed on the basis of defect data detected by an inspection apparatus, thereby specifying the cause of defect in apparatus or process.
摘要:
In a recording and reproducing apparatus for a disc-shaped recording medium, and a defect substitution method for a disc-shaped recording medium (8), whether reproduction of recorded data is good is determined by sector unit and not by product code unit, defective sector discrimination is performed by sector unit, and only sectors determined defective are alternately recorded, when using a recording format in which data that is error detection and correction coded with a product code is segmented and recorded to a plurality of sectors.
摘要:
It is possible to reliably and efficiently determine whether a specimen contains viruses, bacteria, etc. and, if it does, identify their types, regardless of the observer. Furthermore, even a newly-discovered bacterium can be quickly identified by utilizing a database at a remote location. A transmission microscope system has a microscope for observing a specimen and a database which stores, for each microscopic thing (such as a virus), a name, a specimen pretreatment method and an imaging condition used when the microscopic thing is observed, captured image data, etc. An image of the specimen is captured according to a specimen pretreatment method and an imaging condition retrieved from the database using the name of a target microscopic thing as a key, and the captured image is compared with images stored in the database to identify microscopic things present in the specimen.
摘要:
Conventionally, there is no method for quantitatively evaluating the three-dimensional shape of an etched pattern in a non-destructive manner and it takes much time and costs to determine etching conditions. With the conventional length measuring method only, it has been impossible to detect an abnormality in the three-dimensional shape and also difficult to control the etching process.According to the present invention, variations in signal amounts of an SEM image are utilized to compute three-dimensional shape data on the pattern associated with the etching process steps, whereby the three-dimensional shape is quantitatively evaluated. Besides, determination of etching process conditions and process control are performed based on the three-dimensional shape data obtained.The present invention makes it is possible to quantitatively evaluate the three-dimensional shape of the etched pattern in a non-destructive manner. Further, the efficiency of determining the etching process conditions and a stable etching process can be realized.
摘要:
An inspection method and apparatus includes control of an acceleration voltage of an electron beam, irradiation of the electron beam to an object to be inspected mounted on a stage which is continuously moving at least in one direction, and detection of at least one of secondary electrons and reflected electrons emanated from the object in response to the irradiation. An image of the object is obtained from the detected electron by using positional information of the stage and inspection or measurement of the object is conducted using and obtained image. In the detection, an electric field in the vicinity of the object mounted on the stage is controlled so that at least one secondary electrons and the reflected electrons emanated from the object in response to the irradiation of the electron beam are decelerated.
摘要:
A bio electron microscope and an observation method which can observe a bio specimen by low damage and high contrast to perform high-accuracy image analysis, and conduct high-throughput specimen preparation. 1) A specimen is observed at an accelerating voltage 1.2 to 4.2 times a critical electron accelerating voltage possible to transmit a specimen obtained under predetermined conditions. 2) An electron energy filter of small and simplified construction is provided between the specimen and an electron detector for imaging by the electron beam in a specified energy region of the electron beams transmitting the specimen. 3) Similarity between an observed image such as virus or protein in the specimen and a reference image such as known virus or protein is subjected to quantitative analysis by image processing. 4) A preparation protocol of the bio specimen is made into a chip using an MEMS technique, which is then mounted on a specimen stage part of an electron microscope to conduct specimen introduction, preparation and transfer onto a specimen holder.
摘要:
It is possible to reliably and efficiently determine whether a specimen contains viruses, bacteria, etc. and, if it does, identify their types, regardless of the observer. Furthermore, even a newly-discovered bacterium can be quickly identified by utilizing a database at a remote location. A transmission microscope system has a microscope for observing a specimen and a database which stores, for each microscopic thing (such as a virus), a name, a specimen pretreatment method and an imaging condition used when the microscopic thing is observed, captured image data, etc. An image of the specimen is captured according to a specimen pretreatment method and an imaging condition retrieved from the database using the name of a target microscopic thing as a key, and the captured image is compared with images stored in the database to identify microscopic things present in the specimen.
摘要:
A pattern inspection method and apparatus are disclosed, the method has the steps of generating a reference digital image signal to be compared with a detection digital image signal detected continuously from the desired band-shaped inspection area on an object to be inspected, determining zero or one or more candidate , matching positions between the detection digital image signal and the reference digital image signal for each block unit area sequentially cut out and calculating a mass of candidate matching positions over the entire band-shaped inspection area, determining an accurate matching position between the detection digital image signal and the reference digital image signal for each block unit area based on the continuity of the block unit areas from the calculated mass of candidate matching positions over the entire band-shaped inspection area, and determining a defect by matching the positions based on the determined accurate matching position for each block unit area and comparing the images.
摘要:
An inspection method and apparatus includes control of an acceleration voltage of an electron beam, irradiation of the electron beam to an object to be inspected mounted on a stage which is continuously moving at least in one direction, and detection of at least one of secondary electrons and reflected electrons emanated from the object in response to the irradiation. An image of the object is obtained from the detected electron by using positional information of the stage and inspection or measurement of the object is conducted using an obtained image. In the detection, an electric field in the vicinity of the object mounted on the stage is controlled so that at least one of the secondary electrons and the reflected electrons emanated from the object in response to the irradiation of the electron beam are decelerated.
摘要:
The present invention provides a scanning electron microscope (SEM) or optical inspection method and apparatus which correct differences in brightness between comparison images and thus which is capable of detecting a fine defect with a high degree of reliability without causing any false defect detection. According to the present invention, the brightness values of a pattern, which should be essentially the same, contained in two detected images to be compared are corrected in such a manner that, even if there may be a brightness difference in a portion free from defects, the brightness difference is reduced to such a degree so that it can be recognized as a normal portion. Also, a limit for the amount of correction is furnished in advance, and correction exceeding such limit value is not performed. Such correction prevents the difference in brightness that should be permitted as non-defective from being falsely recognized as a defect without overlooking great differences in brightness due to a defect.