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公开(公告)号:US20050079805A1
公开(公告)日:2005-04-14
申请号:US10816882
申请日:2004-04-05
CPC分类号: B24D3/28 , B24B37/22 , B24B37/24 , B24B37/26 , B24D11/008 , B24D18/00 , B24D18/0009
摘要: A polishing pad having a body comprising fibers embedded in a matrix polymer formed by a reaction of polymer precursors. The loose fibers define and the precursors were mixed first with curatives, then mold into a pad form. The pad may include a thin layer of free fibers at its polishing surface. A segment of at least a portion of the free fibers are embedded in the adjacent body of the polymer and fibers.